Federal Aviation Administration, New England Region, ANE-55HP, 12 New England Executive Park, Burlington, MA 01803

Y -- CONSTRUCT AND INSTALL A LOCALIZER TO SERVE RUNWAY 15R AT LOGAN INTERNATIONAL AIRPORT, BOSTON, MA. SOL DTFA12-95-B-00066. DUE 060795. Contact: Helene P. Conway, Contracting Officer, 617-238-7687. Furnish all labor, material, equipment, and supplies necessary to replace an existing localizer (LOC) antenna with a Government Furnished eight element log periodic localizer antenna serving runway 15R at Logan International Airport, Boston, MA. Work includes dismantling and removal of existing LOC, Layout, and survey for the new LOC, installation of modified steel frame on existing concrete foundations, cable installation, assembly and wiring, and site work. Estimated cost is between $25,000 and $100,000. To obtain a copy of the IFB, a written request must be made to the Contracting Officer along with a $10.00 non-refundable check, made out to the Federal Aviation Administration, for plans and specifications. This procurement is not set-aside. The proposed IFB is expected to be issued by May 9, 1995, with a proposed Bid Opening date of June 6, 1995. Special note for Minority, Women-Owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning Bonding Assistance Program and/or the STLP, please call the OSDBU at (800) 532-1169. (107)

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