Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF MAY 12,1995 PSA#1345

Federal Aviation Administration, New England Region, ANE-55CG, 12 New England Executive Park, Burlington, MA 01803

Y -- REPLACEMENT OF INSTRUMENT LANDING SYSTEM Sol DTFA12-95-B-00071. Due 063095. Contact: Carol A. Granberg, Contracting Officer, 617-238-7687.Provide all labor, material, equipment and supplies (not otherwise identified as Government Furnished) for replacement of the Instrument Landing System (ILS) serving Runway 4R at Logan International Airport, Boston, MA. Work includes layout, installation of cable in duct, demolition of existing facilities, excavation and placing of concrete, erection of towers and antennas, miscellaneous electrical work, excavation of trenches and installation of ducts, site grading and preparation, removal and replacement of underground storage tanks, placement of new concrete buildings, renovation of existing buildings, and miscellaneous carpentry. The contract performance period is 60 calendar days. Estimated cost is between $100,000 and $250,000. A $50.00 non-refundable charge is required for the bid package. Requests for bid packages will be honored until the supply is exhausted. This procurement is under the Small Business Competitive Demonstration Program. The proposed issue date for the IFB is 5-31-95. The proposed Bid Opening Date is 6-30-95. SPECIAL NOTE FOR MINORITY, WOMEN-OWNED AND DISADVANTAGED BUSINESS ENTERPRISES: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning the Bonding Assistance Program and/or the STLP, please call the OSDBU at (800) 532-1169. (128)

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