Federal Aviation Administration, Southern Region, P. O. Box 20636, Attn: ASO-55A, Atlanta, Georgia 30320

Y -- CONSTRUCT MARK 20 ILS SOL DTFA06-95-B-30037 DUE 071595 POC LaTonia Vickers, Procurement Technician, (404)305-5819, FAX (404)305-5774 Construction of a Mark 20 Instrument Landing System (ILS), Runway 09R, W. B. Hartsfield-Atlanta International Airport, Atlanta, Georgia.--Work includes, but is not limited to the construction of a new localizer, including site layout, installing foundation, trenching and cable installation, and assembling new antenna array. Dismantle existing middle marker platform, install middle marker foundation and antenna, and install new cables. Dismantle existing inner marker and far field monitors, install inner marker and far field monitor foundations and antennas, install new equipment shelter and foundation. Dismantle old localizer antenna array and remove foundations, remove existing outer marker shelter and counterpoise, install new equipment shelter and foundation, install new outer marker foundation and antenna, and install new meter rack and cables.--Estimated price range $25,000.00-$100,000.00.--Estimatedperformance time is 45 calendar days.--All responsible sources may submit a bid which shall be considered.--NOTE: For Minority, Women-Owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT) Office of Small and Disadvantaged Business Utilization has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term workingcapital and bonding assistance for transportation-related contracts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates up to $500,000.00 per contract to provide accounts receivable financing. The DOT Bonding Assistance Programs enables firms to apply for bid, performance and payment bonds up to $500,000.00 per contract. DOT provides an 80 percent guaranty on the bond amount to a surety against losses. For further information and applicable forms concerning the STLP and Bonding Assistance Program, please call (800)532-1169.(0145)

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