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COMMERCE BUSINESS DAILY ISSUE OF NOVEMBER 6,1995 PSA#1467TECHNOLOGY TRANSFER OPPORTUNITY: THERMAL FUSE SENSOR TECHNOLOGY Sandia
National Laboratories desires to partner with one or more industrial
partners in an effort to commercialize and market a thermal fuse sensor
technology. This concept utilizes material systems and batch assembly
processes to fabricate a low cost device in which one or more
electrically conducting patterns become non-conducting upon exposure of
the sensor to temperatures exceeding a prescribed value. Device
manufacture includes mechanical polishing processes for substrate
preparation; shadow (aperture) mask technology for pattern definition;
electron beam evaporation techniques for thin film deposition; and
traditional interconnect and packaging technologies for integration of
the sensor into electronic systems. The thin film sensing element
(patent pending) allows for a range of activation temperatures to meet
a particular customer's application. In addition, multiple activation
temperatures can be integrated into a single sensor to support more
complex service requirements. Shadow mask patterning technology offers
a large extent of feature configurations and sizes to accommodate
functionality and miniaturization requirements. The thermal fuse can
provide a traditional thermal protection concept, or be used to
customize electronic circuits by selective thermal treatments. The
fusing mechanism is irreversible so that protection of the system,
and/or circuit customization, are permanent. The introduction of
photolithographic processes for micron level and sub-micron level
features will require further development. The device is configured for
resistance to mechanical shock and vibration. It can be packaged to
operate in ambient air or placed in a sealed package to resist harsh
service environments. Resistance to thermal shock is also a
characteristic of the sensor. The use of inexpensive materials and
conventional thin film batch deposition processes minimizes the
cost-per-part in the event of device replacement. For further
information on the thermal fuse sensor, please write or FAX: Joanne
Trujillo, MS1380, Sandia National Laboratories, Technology Transfer,
P.O. Box 5800, Albuquerque, NM 87185-1380, FAX: (505) 843-4175. Loren Data Corp. http://www.ld.com (SYN# 0471 19951103\SP-0002.MSC)
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