Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF NOVEMBER 6,1995 PSA#1467

TECHNOLOGY TRANSFER OPPORTUNITY: THERMAL FUSE SENSOR TECHNOLOGY Sandia National Laboratories desires to partner with one or more industrial partners in an effort to commercialize and market a thermal fuse sensor technology. This concept utilizes material systems and batch assembly processes to fabricate a low cost device in which one or more electrically conducting patterns become non-conducting upon exposure of the sensor to temperatures exceeding a prescribed value. Device manufacture includes mechanical polishing processes for substrate preparation; shadow (aperture) mask technology for pattern definition; electron beam evaporation techniques for thin film deposition; and traditional interconnect and packaging technologies for integration of the sensor into electronic systems. The thin film sensing element (patent pending) allows for a range of activation temperatures to meet a particular customer's application. In addition, multiple activation temperatures can be integrated into a single sensor to support more complex service requirements. Shadow mask patterning technology offers a large extent of feature configurations and sizes to accommodate functionality and miniaturization requirements. The thermal fuse can provide a traditional thermal protection concept, or be used to customize electronic circuits by selective thermal treatments. The fusing mechanism is irreversible so that protection of the system, and/or circuit customization, are permanent. The introduction of photolithographic processes for micron level and sub-micron level features will require further development. The device is configured for resistance to mechanical shock and vibration. It can be packaged to operate in ambient air or placed in a sealed package to resist harsh service environments. Resistance to thermal shock is also a characteristic of the sensor. The use of inexpensive materials and conventional thin film batch deposition processes minimizes the cost-per-part in the event of device replacement. For further information on the thermal fuse sensor, please write or FAX: Joanne Trujillo, MS1380, Sandia National Laboratories, Technology Transfer, P.O. Box 5800, Albuquerque, NM 87185-1380, FAX: (505) 843-4175.

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