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COMMERCE BUSINESS DAILY ISSUE OF FEBRUARY 8,1996 PSA#1527Federal Aviation Administration,Acquisition Management Branch AGL-72
2300 E. Devon Avenue, Room 458, Des Plaines, Illinois 60018 Z -- REPLACEMENT OF INSTRUMENT LANDING SYSTEM (ILS) EQUIPMENT RUNWAY
3R DETROIT METRO (WAYNE COUNTY) AIRPORT, DETROIT, MI SOL
DTFA14-96-B-33815 DUE 040896 POC To Secure a solicitation package write
to Yashoda Reddy at the above address or FAX your request to Yashoda
Reddy 708-294-8310. Work under this solicitation consists of, but is
not limited to, the following: 1. Replacement of ILS equipment, Runway
3R, Detroit (Metro Wayne County Airport) Michigan. 2. Partial
demolition of existing localizer clearance array foundation and removal
of all associated cables. 3. Demolition of two existing equipment
shelters (Glide Slope and Outer Marker.) 4. Construction of two (2) new
equipment buildings at the Glide Slope and Outer Marker locations. 5.
Installation of new Glide Slope antenna mast foundation and antenna
mast. 6. Installation of new Middle Marker and Outer Marker antenna
masts and Far Field Monitor antenna pole. 7. Demolition of the existing
marker antennas at all marker sites. The SIC CODE is 1629. Solicitation
packages are estimated to be issued on or about March 8, 1996. The
estimated price range for the above project is expected to be between
$100,000 and $200,000. For minority or Women- Women-Owned and
Disadvantaged Business Enterprises: The Department of Transportation
(DOT), Office of Small and Disadvantaged Business Utilization (OSDBU),
has programs to assist minority, women-owned and disadvantaged
business enterprises to acquire short-term working capital and bonding
assistance for transportation-related contracts. This is applicable to
any eligible prime or subcontract at any tier. The DOT Bonding
Assistance Program enables firms to apply for bid, performance and
payment bonds up to $1.0 million per contract. The DOT provides an 80%
guaranty on the bond amount to a surety against losses. Loans are also
available under the DOT Short Term Lending Program (STLP) at prime
interest rates to provide accounts receivable financing. The maximum
line of credit is $500,000. For further information and applicable
forms concerning Bonding Assistance Program and/or the STLP, please
call the OSDBU at (800) 532-1169. (0037) Loren Data Corp. http://www.ld.com (SYN# 0135 19960207\Z-0004.SOL)
Z - Maintenance, Repair or Alteration of Real Property Index Page
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