Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF FEBRUARY 8,1996 PSA#1527

Federal Aviation Administration,Acquisition Management Branch AGL-72 2300 E. Devon Avenue, Room 458, Des Plaines, Illinois 60018

Z -- REPLACEMENT OF INSTRUMENT LANDING SYSTEM (ILS) EQUIPMENT RUNWAY 3R DETROIT METRO (WAYNE COUNTY) AIRPORT, DETROIT, MI SOL DTFA14-96-B-33815 DUE 040896 POC To Secure a solicitation package write to Yashoda Reddy at the above address or FAX your request to Yashoda Reddy 708-294-8310. Work under this solicitation consists of, but is not limited to, the following: 1. Replacement of ILS equipment, Runway 3R, Detroit (Metro Wayne County Airport) Michigan. 2. Partial demolition of existing localizer clearance array foundation and removal of all associated cables. 3. Demolition of two existing equipment shelters (Glide Slope and Outer Marker.) 4. Construction of two (2) new equipment buildings at the Glide Slope and Outer Marker locations. 5. Installation of new Glide Slope antenna mast foundation and antenna mast. 6. Installation of new Middle Marker and Outer Marker antenna masts and Far Field Monitor antenna pole. 7. Demolition of the existing marker antennas at all marker sites. The SIC CODE is 1629. Solicitation packages are estimated to be issued on or about March 8, 1996. The estimated price range for the above project is expected to be between $100,000 and $200,000. For minority or Women- Women-Owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning Bonding Assistance Program and/or the STLP, please call the OSDBU at (800) 532-1169. (0037)

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