Advanced Research Projects Agency (ARPA), Contracts Management Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714

A -- ADVANCED LITHOGRAPHY SOL BAA 96-04 DUE 051796 POC D. O. Patterson, ARPA/ETO, FAX (703) 696-2206. The Advanced Research Projects Agency (ARPA) is soliciting proposals for research of advanced lithography technologies. The goal of this program is to revolutionize semiconductor manufacturing through research of innovative lithography technologies for future device generations. The objective of this program is to solve the basic challenges in developing lithography equipment/processes that enables and accelerates the availability of advanced process technologies for pattern transfer of features with critical dimension of 100 nm and below. Approaches that also provide potential process simplifications, such as electron beam direct writing and resistless lithography, are of particular interest. Specifically excluded are research efforts that primarily result in evolutionary improvements to the present state-of-practice. PROGRAM OBJECTIVE AND DESCRIPTION: The objective of the ARPA Advanced Lithography Program is to revolutionize and accelerate the availability of lithography technologies for future semiconductor generations (i.e., 100 nm feature sizes over fields of ) 1100 sq mm). Technology approaches that eliminate the need for masks are of greatest interest. Also of interest are technologies that simplify processes by minimizing or eliminating resists and resist processing. In addition to exposure sources, proposals with innovative ideas that may lead to solutions of the challenges in the areas of metrology, inspection and repair, and high-fidelity computational modeling of membrane and wafer distortions are solicited. Approaches should be capable of meeting wafer throughput and overall equipment effectiveness needs, while also being completely compatible and integrable into a fabrication facility. ARPA seeks innovative proposals in the following areas: (1) Electron beam direct writing, (2) Optical direct writing, (3) Any other exposure technology approach that satisfies the overall goals and objectives, (4) Associated technologies (i.e., metrology, inspection, repair, membrane distortion modelling, etc.) To be cost-effectively used for semiconductor manufacturing, lithography equipment and processes must meet a number of manufacturing metrics, such as yield, throughput, field size, data handling, resolution, overlay, depth of focus, process latitude, process compatibility, capital costs, operational and maintenance costs, and availability. Proposed efforts should provide for a timely transfer of results to ensure that there is a sufficient lead time to commercialize promising research and develop prototypes. Additional information on these technical areas is provided in the Areas of Interest section of the BAA 96-04 Proposer Information Pamphlet described below. PROGRAM SCOPE: Multiple awards totalling approximately $5 million over the next three years are expected to be made during FY 96. Collaborative efforts/teaming and cost sharing are encouraged, The technical POC for this effort is Dr. David O. Patterson, fax: (703) 696-2206, electronic mail: ''dpatterson@arpa.mil.'' GENERAL INFORMATION: Proposers must obtain a pamphlet, BAA 96-04 Proposer Information Pamphlet, which provides further information on areas of interest, the submission, evaluation, and funding processes, and proposal and proposal abstract formats. This pamphlet may be obtained by fax, electronic mail, or mail request from the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit brief proposal abstracts in advance of full proposals. An original and eight (8) copies of the proposal abstract must be submitted to ARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN: BAA 96-04), on or before 4:00 PM, March 21, 1996. Proposal abstracts received after this date may not be reviewed. Upon review, ARPA will provide written feedback on the likelihood of a full proposal being selected and the date and time for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and eight (8) copies of the full proposal to ARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN: BAA 96-04), on or before 4:00 PM, May 17, 1996 in order to be considered. This notice, in conjunction with the pamphlet, BAA 96-04 Proposer Information, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by ARPA. Historically Black Colleges and Universities (HBCU) and Minority Institutions (MI) are encouraged to submit proposals and join others in submitting proposals, however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in maskless lithography technology. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or proposal to this BAA, should be directed to one of the administrative addresses below, e-mail or fax is preferred. ARPA intends to use electronic mail and fax for correspondence regarding BAA 96-04. Proposals and proposal abstracts may not be submitted by fax or e-mail, any so sent will be disregarded. EVALUATION CRITERIA: Evaluation of proposal abstracts and proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to the ARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: Cost realism will only be significant in proposals which have significantly under - or over - estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: 703-351-8616 (Addressed to: ARPA/ETO, BAA 96-04), Electronic Mail: BAA96-04@arpa.mil, Mail: ARPA/ETO, Attn.: BAA 96-04, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (0046)

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