Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF MARCH 6,1996 PSA#1545

Federal Aviation Administration,Acquisition Management Branch, 2300 E. Devon Avenue, Room 458, Des Plaines, IL 60018

Z -- RELOCATION OF RWY 32 LOCALIZER AT FORT WAYNE INTERNATIONAL AIRPORT, FORT WAYNE, INDIANA SOL DTFA14-96-B-33818 DUE 041596 POC For solicitation packages contact Maggie Gillespie, AIM, 2300 E. Devon, DesPlaines, IL 60018 or FAX your request to 708-294-8050. Relocation of Runway 32, Fort Wayne International Airport, Ft. Wayne, Indiana has the following, but not limited to, scope of work: 1. Relocate V-ring localizer antenna support. 2. Remove and dispose of eight screw anchor foundations with welded-on antenna mast base plates. 3. Remove and dispose of fiberglass localizer shelter. 4. Construct 10' x 12' concrete foundation and frame shelter on foundation. 5. Install compacted crushed aggregate road segment. 6. Install underground power and control cables. 7.Miscellanous civil and electrical work. Solicitation packages are to be issued on or about March 15, 1996. The estimated start date for the project is August 1, 1996. Bid range is between $50,000 and $75,000. SIC CODE is 1542. FOR MINORITY, WOMEN-OWNED AND DISADVANTAGED BUSINESS ENTERPRISES: The Department of Transportation (DOT) Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 Million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning Bonding Assistance Program and/or the STLP, please call the OSDBU at (800)532-1169. (0064)

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