Federal Aviation Administration, 2300 East Devon Ave., Des Plaines Il 60018

Z -- REPLACE GLIDE SLOPE & LOCALIZER EQUIPMENT BUILDINGS, DAYTON INTERNATIONAL AIRPORT, DAYTON, OHIO SOL DTFA14-96-Q-20356 DUE 042396 POC Submit requests in writing to the above address, Attn: Diane Ayen or FAX requests to (708) 294-8050. Offers are requested to furnish all labor, equipment, materials and supervision to remove existing Glide Slope & Localizer Equipment Buildings and construct new buildings at Dayton International Airport, Dayton Ohio. Packages are estimated to be issued on or about 4/2/96, with an estimated opening date of 4/23/96 COB. Commencement date is approximately 6/1/96. Offer range is under $50,000.00. For Minority, Women-owned and Disadvantaged Business Enterprises: The Department of Transporation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transporation-related contracts. This is applicable to any eligible prime or subcontractor at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 million per contract. The DOT provides an 80% guaranty on the bond amount to a surety aganist losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further assistance and applicable forms concerning the Bonding Assistance Program and /or STLP, please call the OSDBU at (800) 532-1169. SIC CODE 1542 (0067)

Loren Data Corp. http://www.ld.com (SYN# 0179 19960308\Z-0011.SOL)