Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington VA 22203-1714

A -- ELECTRONIC SYSTEMS MANUFACTURING AND DESIGN SUPPORT FOR MIXED- TECHNOLOGY INTEGRATION SOL BAA 96-16 DUE 053096 POC Mr. R. E. Harr, Program Manager, FAX (703) 696-2206. The solicitation, BAA 96-16 including the ''BAA 96-16 Proposer Information Pamphlet'', is amended by this Amendment 0001 to rescope the Electronic Packaging & Interconnect thrust to focus exclusively on longer term, more revolutionary chip packaging ideas. As such, the following changes are made to the Electronic Systems Manufacturing portion of BAA 96-16: 1) Topic area I.D. ''Applications'' is eliminated, 2) Topic Area I.C. ''Simplified Manufacturing Processes'' is descoped to focus solely on demonstrating the feasibility of novel manufacturing techniques. The development of manufacturing equipment or the reduction to practice of already demonstrated manufacturing processes are not likely to be funded, and 3) Area I.B., ''Physical Design Tools'' will focus primarily on CAD technology which is essential to enable the adoption of high speed digital and mixed signal packaging technologies being developed by other ARPA programs. Furthermore, all proposals in the aforementioned topic areas should be limited to 24 months in duration. As a result of these changes, the total dollar awards are estimated to be reduced from $50 to $30 million over 3 years with approximately one-half of this amount expected in the Electronic Systems Manufacturing area of interest.This amendment may be retrieved via the WWW at URL http://www.arpa.mil/ in the solicitations area. (0116)

Loren Data Corp. http://www.ld.com (SYN# 0009 19960426\A-0009.SOL)