NEW RAC RELIABILITY PUBLICATIONS The Reliability Analysis Center (RAC), which is sponsored by the Defense Technical Information Center (DTIC) and operated by IIT Research Institute (IITRI) for over 20 years, is the DoD Information Analysis Center (IAC) for the collection, analysis and dissemination of reliability and maintainability data. The RAC is pleased to announce the immediate availability of the following new publications: ``RAC Thermal Management Guidebook'' provides guidelines for ensuring the development of a thermally adequate, cost effective product. Design, analysis and test topics are presented, as well as tailoring issues. ``Reliable Application of Multichip Modules'' specifically addresses hybrid microcircuits, multichip packaging and MCMs, and provides an overview of how this technology can be most efficiently and cost effectively applied. ``Reliable Application of Plastic Encapsulated Microcircuits'' updates a 1992 RAC book with information on parts control/procurement, failure modes/mechanisms, and data on PEM reliability/quality. Includes a new PEM failure rate prediction model. ``Business Process Reengineering for Quality Improvement'' addresses the strategies required to help organizations quickly gain a competitive edge by answering frequently asked questions on BPR with guidance on ``what to do'' and ``how to do it''. ``RAC Computer-Aided Reliability Training Course'' targets the need for a concise overview and basic understanding of reliability definitions, standards, analysis tools and techniques, etc. The course is PC Windows TM based and comes in four modules. To inquire about these RAC publications, or to obtain a copy of our latest product catalog, please write or call Gina Nash at IIT Research Institute, Reliability Analysis Center, 201 Mill Street, Rome, NY 13440. Phone(free):(888)722-8737, e-mail: gnash@rome.iitri.com, Fax: (315)337-9932.

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