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COMMERCE BUSINESS DAILY ISSUE OF AUGUST 20,1996 PSA#1662Rome Laboratory/PKPX, 26 Electronic Parkway, Rome NY 13441-4514 A -- SPECIAL NOTICE: ROME LABORATORY'S FY 97 SBIR TOPICS SOL SBIR
TOPIC 10 POC Joetta A. Bernhard, Contracting Officer, A/C 315-330-2308;
Margot Ashcroft, SBIR Program Manager, 315-330-1793. PART 3 OF 6. ROME
LABORATORY'S FY 97 SBIR TOPIC. ROME LABORATORY IS PLEASED TO MAKE
AVAILABLE THE FOLLOWING SMALL BUSINESS INNOVATIVE RESEARCH (SBIR)
PROGRAM TOPICS, AS FOLLOWS: SBIR TOPIC (10) TITLE: Prognostic
Assessment Technique/Tool for Electronic Equipment and Systems.
TECHNICAL POINT OF CONTACT: Dr. Christopher E. Reuter, RL/ER-G,
315-330-7642. NARRATIVE: Because microelectronic semiconductor devices
degrade as they age (transistor diffused or doped regions degenerate,
metal/semiconductor contacts break down, metal traces degrade from
electromigration, etc.) there is potential to measure system level
radiated signals with external (non-contact) probing for the purpose of
assessing the health of electronic equipment. The device level
degradation causes reduced device and system performance. Furthermore,
(as the equipment ages) this degradation may modify the ambient
radiation inherent to all electronic equipment and can potentially be
measured by external non-contact probing of various signals. Thus an
innovative technique designed to measure and characterize life-cycle
status of electronic equipment and predict necessity for replacement of
system components is desired. It is envisioned that the technique/tools
developed would have the capability to predict/estimate time-to-failure
system under test and provide advance information on the life-cycle
disposition of an electronic system. Additionally the technique should
have the ability to localize degraded devices within the system.
OBJECTIVE: To develop prognostic techniques and hardware for assessing
health of electronic equipment/systems. DESCRIPTION: PHASE I: This
consists of identifying appropriate measurable signals that are
indicative of the health of electronic equipment and testing the
feasibility of using these signals as a diagnostic/prognostic indicator
for equipment under test. This may include simulations and empirical
testing of hardware. POTENTIAL COMMERCIAL MARKET: There would be a
large commercial potential from this effort. The ability to assess the
health of electronic equipment could potentially dramatically impact
both military and commercial practices regarding electronic equipment
and maintenance. SBIR TOPIC (11) TITLE: New Diagnostic Tool for
Evaluation of Material Surfaces. TECHNICAL POINT OF CONTACT: Lois D.
Walsh, RL/ER-G, 315-330-2983. OBJECTIVE: Develop marketable technique
for routine measurement and comparison of material surfaces during
integrated circuit manufacture. DESCRIPTION: The problem is that the
reliability of microelectronic devices is dependent on the consistent
quality of material surfaces and interfaces. There is no one routine
measurement to provide a simple complete surface description. The
technical challenge is to develop a new diagnostic tool for evaluation
of material surfaces to determine consistency of current manufactured
lots with previous known ''good'' lots. Surface structure is known to
change with deposition and substrate parameters. Presently there is no
standard method to determine the quality of the surface or to compare
one surface with another surface. Grain size, surface roughness, and
grain orientation are parameters to be considered, but they need to be
monitored and analyzed in such a way as to promote easy comparisons.
One technique might be to determine the fractal dimension of the
surfaces using a kinetic model with Smoluchowski equations and
Jullien's solution. - Phase I Expectations: Develop robust, consistent
technique for routine surface quality measurement of nanometer
structures. DUAL USE COMMERCIAL POTENTIAL: A readily available
technique for surface quality measurements is imperative to producing
high quality reliable microelectronic devices for both commercial and
military applications. Such a technique would allow in-process
monitoring of microelectronic materials for surface and interface
quality before addition of more value to the product. The tool would
also assist small companies with older deposition equipment to produce
a high quality, more reliable product. Resultant reliable devices
would be available for commercial (medical, transportation and
communications) and military (transportation, communications, and
weapons) applications at more competitive prices. SBIR TOPIC (12)
TITLE: Design Tools for Minimizing Electronic Failure. TECHNICAL POINT
OF CONTACT: Martin J. Walter, RL/ER-G315-330-4102. OBJECTIVE: Develop
a computer-aided design tool minimizing the failure of VLSI
microcircuits and integrate them. DESCRIPTION: The failure of
electronic components and systems has adverse effects on the readiness,
effectiveness, availability, and affordability of military systems. It
increases maintenance costs, and aggravates the quantity of spares
required during deployment. Managing the failure of electronic systems
and components involves building electronic systems and components
that are not susceptible to end-of-life failure mechanisms, and that
can perform the required functions when some of the components or some
part of a component has failed. In order to build reliability into
electronic components and systems, design techniques and tools must be
developed which guide design processes such as synthesis and
technology mapping based on reliability and fault tolerance.
Reliability analysis and simulation during logic design assist in
making circuits reliable. The management of failure includes
constraining circuit susceptibility to failure mechanisms like
electromigration through design processes such as synthesis and
technology mapping, analyzing physical layouts of VLSI designs to make
the design more robust, and exploiting fault tolerant design
techniques to increase the reliability of the overall circuit when some
portion of it has failed. The models, algorithms and techniques will be
integrated into a commercializable CAD tool that can be interfaced with
commercial design frameworks, and employ widely accepted design
modeling languages such as VHDL.- Phase I: Define and detail the
proposed algorithms that need to be developed and implemented. Create
a preliminary design of the proposed methods and tools including the
interfaces to commercial design frameworks. POTENTIAL COMMERCIAL
MARKET: The ability to manage circuit failure during the design of the
circuit, reduces the time required to develop advanced microcircuits
while maintaining high confidence in the availability of electronic
systems. This technology is important both for the use of these
circuits in military applications and in the commercial sector. The
tools developed under this topic will have a significant effect on
military electronic systems because the failure of the electronics can
severely damage mission success rates, increase system support costs,
and the number of spares needed. The tools will reduce development
time which is the driving force for commercial electronics, and defines
the profitability of electronic companies. Electronic systems will
benefit by reducing the number of spare parts needed when they are
deployed, by reducing the amount of time needed for system repair, and
by increasing the availability of the system for operational use.
Tools developed for this area will reduce the overall cost and time
associated with developing reliable advanced microelectronic circuits.
End-of-life failure mechanisms, that pervade the circuit population,
must be eliminated as early as possible during circuit development. The
tools developed under this topic will enable circuit designers to
minimize the circuit's susceptibility to these mechanisms, and minimize
the effects of device failure on circuit performance. The tools will
reduce life cycle support costs for both military and commercial
electronics including automotive, communications and aerospace
applications SBIR TOPIC (13) TITLE: Ultra-High Speed Bit Error Rate
Tester. TECHNICAL POINT OF CONTACT: Charles W. Tsacoyeanes, RL/ER-H,
617-377-4599. OBJECTIVE: To develop a 25Gbit/s bit error rate tester.
DESCRIPTION: Current fiber optic links have only partially realized the
enormous bandwidth available using single-mode optical fiber. The
military and the telecommunications industry have had bandwidth
requirements which have been increasing each year by a factor of
greater than two. These demands are driven by the transmission of
images and the increase in traffic on the world wide web. Current
commercial systems operate at speeds up to 2.5Gbit/s with future
upgrades planned for 10Gbit/s (OC-192). The Air Force and several other
government agencies have immediate requirements for data transmission
rates in the 10 to 40Gbit/s range and future requirements as high as
100Gbit/s. DARPA has a new program entitled ''Ultra Photonics'' whose
objective is to increase the speed of current information processing
systems by a factor of 10 to 100. The components needed to build fiber
optic links with data transmission rates up to 40Gbit/s are available
commercially but the test equipment needed to measure their
performance is not. Measurement of the performance of these systems
requires a high speed bit error rate tester (BERT). The highest speed
BERT available commercially is 12Gbit/s and very expensive ($300K). The
goal of this program is to design, develop and commercialize a reliable
and affordable 25Gbit/s BERT and establish the framework necessary to
develop a 40Gbit/s BERT. The commercial availability of this instrument
will accelerate the development and utilization of much higher speed
fiber optic links than presently available. Collaborations are
encouraged.- PHASE I: Design and demonstrate the feasibility of
developing a 25Gbit/s BERT. POTENTIAL COMMERCIAL MARKET: The demand for
this product will be driven by the telecommunications industry which is
a multi-billion dollar market. SBIR TOPIC (14) TITLE: Large Area
Nitride Substrates. TECHNICAL POINT OF CONTACT: David Bliss, RL/ER-H,
617-377-4841. OBJECTIVE: Economical large area III-N epitaxial
substrates. DESCRIPTION: Nitride semiconducting devices have
demonstrated capabilities for solar blind detection, visible emission
for heads-up displays, short wavelength sources for ultra high density
data storage and short wavelength optical communications. Cost
effective manufacturing of these devices for subsystem insertion
depends on the availability of large area nitride substrate materials.
GaN-suitable substrates must be compatible with existing semiconductor
handling equipment. GaN and related materials are currently grown by
epitaxial means upon surrogate substrates. Epitaxial deposition and
substrate technology must be developed to demonstrate device quality
material growth on economical, large area substrates. Program
expectation is for demonstration of III-Nitride growth on large area
substrates, with demonstration of material quality through
demonstration of optoelectronic componentry. Teaming and collaborative
relations, especially in Phase II, are encouraged.- PHASE I:
Experimentally demonstrate growth on 75mm substrates, and feasibility
of scaling substrate diameter in excess of 150mm. POTENTIAL COMMERCIAL
MARKET: GaN substrates are suitable platforms for blue lasers and blue
LED's. The market for blue light emitting diodes (LED's) is expected to
be as large as the present market for red and green LED's, which is on
the order of 10 billion parts per year. The substrate requirement to
achieve this level of production is conservatively estimated to be over
one million wafers per year, or approximately $100M/yr. The estimated
price of $100 per wafer is expected to come down as the volume
increases over time, as new applications such as blue lasers are
brought into production. (0229) Loren Data Corp. http://www.ld.com (SYN# 0005 19960819\A-0005.SOL)
A - Research and Development Index Page
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