Defense Special Weapons Agency, 6801 Telegraph Rd., Alexandria, VA 22310-3398

A -- THE ADVANCED ETCHING FOR PRINTED WIRING BOARDS AND MILTICHIP MODULES FOR HYPER-DENSE ELECTRONIC PACKAGING POC Michael Jackson, Negotiator, (703) 325-9211, Edward Archer, Contracting Officer, (703) 325-5028. The development of high density Multichip Modules (MCM) and Printed Wiring Boards (PWB) technology is essential to the development of future space systems and the upgrade of existing systems. Only through the use of these technologies can the required levels of integration density be reached to support the onboard data and signal processing requirements of these systems. However, advances in the fabrication process of MCMs and PWBs must be made to ensure that the required density, reliability, performance (speed), and thermal management capabilities, needed to support system specifications is available. This effort will develop technology to ensure that the necessary density, reliability, speed, and thermal performance can be realized by future MCM and PWB designs. The contemplated period of performance is 12 months. The Defense Special Weapons Agency (DSWA) plans to award a sole source contract to ElectroChemical Systems, Inc., 118 Sherwood Road, Ridgewood, NJ 07450. DSWA believes that ElectroChemical is the only source possessing the existing RDT&E expertise to adapt this specific requirement to meet this program requirement within the time required by DSWA and available funding. Any other firm desiring consideration must fully identify its capability to perform this requirement. See Note 22. Information on DSWA solicitations, already released, can be obtained by calling the DSWA Hotline at (703) 325-1173. As of 31 May 96, Acquisition Management has added ''Procurement Opportunities'' to the DSWA Home Page available on the World Wide Web. Information will include this synopsis and more. Please check us out at www.dswa.mil. Reference Synopsis No. 97-11 (0306)

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