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COMMERCE BUSINESS DAILY ISSUE OF NOVEMBER 5,1996 PSA#1715Defense Special Weapons Agency, 6801 Telegraph Rd., Alexandria, VA
22310-3398 A -- THE ADVANCED ETCHING FOR PRINTED WIRING BOARDS AND MILTICHIP
MODULES FOR HYPER-DENSE ELECTRONIC PACKAGING POC Michael Jackson,
Negotiator, (703) 325-9211, Edward Archer, Contracting Officer, (703)
325-5028. The development of high density Multichip Modules (MCM) and
Printed Wiring Boards (PWB) technology is essential to the development
of future space systems and the upgrade of existing systems. Only
through the use of these technologies can the required levels of
integration density be reached to support the onboard data and signal
processing requirements of these systems. However, advances in the
fabrication process of MCMs and PWBs must be made to ensure that the
required density, reliability, performance (speed), and thermal
management capabilities, needed to support system specifications is
available. This effort will develop technology to ensure that the
necessary density, reliability, speed, and thermal performance can be
realized by future MCM and PWB designs. The contemplated period of
performance is 12 months. The Defense Special Weapons Agency (DSWA)
plans to award a sole source contract to ElectroChemical Systems, Inc.,
118 Sherwood Road, Ridgewood, NJ 07450. DSWA believes that
ElectroChemical is the only source possessing the existing RDT&E
expertise to adapt this specific requirement to meet this program
requirement within the time required by DSWA and available funding. Any
other firm desiring consideration must fully identify its capability to
perform this requirement. See Note 22. Information on DSWA
solicitations, already released, can be obtained by calling the DSWA
Hotline at (703) 325-1173. As of 31 May 96, Acquisition Management has
added ''Procurement Opportunities'' to the DSWA Home Page available on
the World Wide Web. Information will include this synopsis and more.
Please check us out at www.dswa.mil. Reference Synopsis No. 97-11
(0306) Loren Data Corp. http://www.ld.com (SYN# 0003 19961104\A-0003.SOL)
A - Research and Development Index Page
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