Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington VA 22203-1714

A -- MEGAWATT SOLID STATE ELECTRONICS SOL BAA 97-05 DUE 022897 POC Elliot R. Brown, DARPA/ETO, Fax: (703) 696-2206. PROGRAM OBJECTIVES AND DESCRIPTION: DARPA is soliciting innovative research proposals in the area of high-power solid-state electronics in response to a critical military need for switching devices and integrated circuits that can meet the high-current, high-voltage, and speed requirements of electric components and sub-systems in emerging hybrid-electric combat vehicles. Three ancillary applications areas are more-electric aircraft, naval ships, and commercial vehicles. The proposed research should concentrate on at least one of the following technical areas, in descending order or importance: (1) high-power device structures, (2) high-power semiconductor materials, (3) IC technology, or (4) IC sub-system interaction. A leading candidate semiconductor for devices, materials, and ICs is SiC, but other wide-bandgap semiconductors will be considered. In addition, innovative ideas are solicited in more conventional Si-based power device technology utilizing, for example, advanced wafer-scale thermal management, non-stoichiometric Si material (for thermal carrier suppression), or composite material (for impact ionization suppression). In all cases high operating temperature is likely, so that each proposal should address this issue. Technical approaches that do not require liquid cooling are encouraged. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices or systems. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice. DARPA seeks innovative proposals in the following areas: (I) High-Power Devices, (II) High-power Semiconductor Materials, (III) High-Power Integrated Circuits (fabrication processes, design rules, architectures, and packaging), and (IV) High-Power IC Sub-System Interaction. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 97-05 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: During the second quarter of calendar year 1997, DARPA plans to make multiple awards for research up to three years in duration. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Elliott R. Brown, fax: (703) 696-2206, electronic mail: erbrown@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled ''BAA 97-05, Megawatt Solid-State Electronics, Proposer Information Pamphlet'' which provides further information on the areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and nine (9) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-05) on or before 4:00 P.M., Wednesday, December 18, 1996. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and nine (9) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-05) on or before 4:00 P.M., Friday, February 28, 1997, in order to be considered. This notice, in conjunction with the BAA 97-05 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals, however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in megawatt solid-state electronics. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below, e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 97-05. Proposals and proposal abstracts may not be submitted by fax or e-mail, any so sent will be disregarded. DARPA encourages use of the World Wide Web (WWW) for retrieving the Program Information Package and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) novelty and ingenuity of technical approach, (4) offeror's capabilities, related experience, and past performance, (5) manufacturability, and plans and capability to accomplish technology transition, and (6) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 97-05), Electronic Mail: BAA 97-05@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 97-05, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0317)

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