NOTICE OF A FREEDOM OF INFORMATION REQUEST FOR NUGGETS UNDER THE BMDO SMALL BUSINESS INNOVATIVE RESEARCH (SBIR) PROGRAM POC Mr. Jeff Bond, BMDO/TRI, Acting Program Manager for SBIR, Ballistic Missile Defense Organization, (703) 693-1620, FAX (703) 693-3013. Notice to Ballistic Missile Defense Organization Small Business Innovative Research Program Contractors. The companies set forth herein are hereby notified that information about their proposals for and/or work under Ballistic Missile Defense Organization (BMDO) Small Business Innovative Research (SBIR) Program contracts has been requested under the Freedom of Information Act (FOIA), Section 552, Title 5, United States Code, and the Department of Defense intends to release some of the information. This information is set forth in an internal U.S. Government publication NUGGETS which was used to inform government personnel involved in the BMDO SBIR Program about what was occurring in the program. The NUGGETS has been requested under the FOIA. BMDO has thoroughly reviewed the NUGGETS to assure that information proposed for release does not include ``confidential commercial information'' which means information provided to the government by a submitter that arguably contains material exempt from release under Exemption 4 of the Freedom of Information Act, 5 U.S.C. 552(b)(4) because disclosure could reasonably be expected to cause substantial competitive harm. This review was led by Mr. Carl Nelson who was the former director of the program. However, since the information requested contains business confidential information, under Executive Order 12600 the Government is required to give notice to the submitter of the proposed release in order that the submitter will have an opportunity to take action to protect its information. Where notification of a voluminous number of submitters is required, the Executive Order allows notification in a place reasonably calculated to accomplish notification. The Department of Defense has determined that the Commerce Business Daily meets this requirement. Pursuant to the requirement of the Executive Order requiring that submitters be given a reasonable time after notice to object to release of information, those portions of the NUGGETS which have been determined to be releasable will not be released until thirty days after date of publication of this notice. If a company wants to know the content of its information proposed for release, it should contact Mr. Jeff Bond, Acting Program Manager for SBIR, Ballistic Missile Defense Organization, Room 1E149, The Pentagon, Washington, D.C. 20301-7100, Phone: (703) 693-1620, Fax: (703) 693-3013. If the company objects to release of any of the information, it shall provide its objections to the above office in writing by registered mail or fax evidenced by confirmation. BMDO will advise the submitter whether or not it agrees with its objections. Where BMDO does not agree with the submitter's objections, it will provide the submitter a reasonable time to take legal action before it releases the information. The names of the companies whose information is subject to release by reason of the portions of NUGGETS follows: 3C Semiconductors, AccSys Acme Cleveland, ACT Research Corp, Adroit Systems, Inc., Advance Device Technology Inc., Advanced Fuel Research Inc, Advanced Materials & Process, Advanced Material Corp, Advanced Modular Power System Inc, Advanced Photonix Inx, Advanced Scientific Concepts, Advanced Technology Materials Inc, Aerodyne Research Inc, AF Phillips Lab, AF Rome Lab, AF Wright Labs, Air Products Inc, Akzo Inc, Alabama Cryogenic, Amain Electronics, Amber Engineering, American GNC Corp, Amherst System Inc, AMP Inc, Analytic Power, Analyticon Corp, Anro Engineering Inc, APA Optics Inc, Apple, Applied Physics, Applied Pulse Power Inc, Applied Sciences Inc, Applied Technologies Corp, Aria Microwave Systems, Aries Technology, Aspen Systems Inc, Astralux Inc, AstroPower Inc, AstroTerra, AT&T, ATA Inc, Autonomous Technologies Corp, Babcock & Wilcox, Beltran Inc, Biomagnetic Technologies, Boulder Metric, Brimrose Corp of America, BTA Technology Inc, Busek Co Inc, Canon, Cardiac Pacemakers Inc, CCVD Inc, Celanese, Center for Remote Sensing, CERAM Inc, Ceramic Composites Inc, CHIRP Corp, Chronos Research Labs Inc, Chrysler, CIBA Vision Opthalmics, Ciencia Inc, Clark-MXR Inc, Coleman Research Inc, Combustion Sciences Inc, Commonwealth Scientific, Conceptual Software Systems Inc, Conductus Inc, Connecticut Innovations Inc, Continuous Molding Inc, Cook Critical Care Inc, Coretek Inc, Cray, Creare Inc, Cree Research Inc, Crystal Associates Inc, Crystal Systems Inc, Crystallume, CSA Engineering Inc, Cudo Technologies Ltd, Cygnus Imaging Corp, Cymer Laser Technologies, Daniel H. Wagner Associates Inc, Data Refining Technologies, Deacon Research, Decatur Industry, Defense Research Tech, Diamond Materials, Diamond Technology Inc, Digital Optical Computer, Displaytech Inc, Dow Chemical, DTX Corp, DuPont, Dynacs Engineering Company, Dynamics Technology, Dynatherm Corp, Dynetics, Eagle Optoelectronics Inc, Eaton, Electric Propulsion, Electro Energy Inc, Electro-Optek Corp, Electro-Optical Sciences Inc, ElectroChemical System Inc, ElectroMagnetic Applications Inc, Electron Transfer Technologies Inc, EMCORE Corp, ENDINE Inc, Energy Science Laboratories Inc, Engineering & Research Inc, Entech Corp, Epion Corp, ERG Systems Inc, Etalon Inc, Excel Technology Inc, Failure Analysis Associates, Fairfax Materials Research Inc, Federal Electro-Optics Inc, FedEx, Fiber and Sensor Technologies Inc, Fiber Materials Inc, Fibertek, Fluorochem, FMC Corp, Foster-Miller Inc, FS Fang Inc, Full Circle Research Inc, Futron Corp, Gardy-McGrath International, Gazprom, GE, GELTECH Inc, Gemini Computer Inc, General Dynamics, General Pneumatics Corp, General Sciences Inc, GeriMed, Giner Inc, GORCA Systems Inc, GT Devices, Gumbs Associates Inc, Hayes & Associates, Hewlett-Packard, Hexcel Inc, High-Z Technology Inc, Hitachi, Hittman Materials & Medical Components Inc, HMJ Corp, HNC Software Inc, Holoplex, HOLOS Inc, Honeywell, Huges Aircraft, Hypress Inc, IAP Research Inc, Ibis Technology Corp, IBM, ICET Inc, IGC Advanced Superconductors Inc, Igloo Products Corp, II-IV Inc, Illinois Superconductor Corp, Imaging Science Technologies, Implant Sciences Inc, Industrial Sensors and Actuators, Integrated Applied Physics Inc, Intel Corp, Intelligent Automation Systems Inc, Intelligence Machine Technology Corp, Intelligent Neutrons Inc, Interface Studies Inc, International Solar Electric Technology Inc, Interphases Research, Ionic Atlanta, Ionwerks, Iowa Laser, Irvine Sensors Corp, J & D Scientific Inc, Jackson & Tull Chartered Engineers, JBS Technologies Inc, Jet Process Corp, Jet Propulsion Lab, John R. Bayless, JPL, Kensal Corp, Kobe Steel, Kodak, Kolimorgen, Kopin Corp, Kulite Semiconductor Products Inc, Laser Photonics Technology, Light Impressions Inc, Light Industries Ltd, Lightwave Electronics, Linares Management Associates Inc, Lincoln Lab, Lithium Energy Associates, Litton, LNK, Lockheed, Lynntech, Mainstream Engineering Inc, Martin Marietta, Massachusetts Technological Laboratory, Massie Research Labs, Material Technologies Corp, Materials Industries, Materials Modifications Inc., Matsushita, Maxdem Inc, Mayer Applied Research, MCC, MDS Company, Mecury LPE, Merix Corp, MetroLaser, Micracor Inc, Micro-Optics Technologies Inc, Miles Aircraft Company, Millipore Inc, Mission Research, MITI Corp, MMCC Inc, Morganite, Motorola, MOXTEK, MS Sapuppo & Associates, MSNW Inc, Multispectral Solutions Inc, Nanjing Electronic Devices Institute, Nanodynamics Inc, Needham & Co, Neillen Technologies Corp, NeuroDyne Inc, New Light Industries Ltd, Nichia Corp, Nielsen Engineering & Research Inc, Nikon, Nippon Sheet Glass, Noise Communications Inc, NonVolatile Electronics Inc, Northeast Photosciences Inc, Northeast Semiconductor Inc, Novapure, NTT, NZ Applied Tech, On-Line Technologies Inc, ONYX Optics, Optelecom Inc, Optical Concepts Inc, Optical Polymer Inc, OptiComp, OPTIGAIN Inc, Optimization Technology Inc, Optivision Inc, Optron Systems, Orbital Technologies Corp, Ortel Corp, Orthonormal Neural Nets, PacAstro, Pacific Advanced Technology, Pacific Applied Research, Page Automated Telecommunications Systems, Parametrics Inc, Parasoft Corp, Parkview Research & Development Inc, Pathfinder Systems Inc, PD-LD Inc, PDR Inc, Photonic Systems, Photonics Research Inc, Photonics Spectra, Photosciences Inc, Physical Optics Corp, Physical Sciences Inc, Physitron, Picometrix, Picotronix Inc, Pizza Hut, Polaroid, Potomac Photonics Inc, Precision Magnetic Bearings, Productivity Solutions, Propulsion Research Inc, PSI Environmental Instruments Corp, Q-DOT Inc, QSource Inc, Quantex Corp, Quantum Materials Inc., Quantum Technology Inc, Quest Integrated Inc, Radiant Research Inc, Rasor Associates, Raytheon, Research Opportunities Inc, Reticular Systems, Reveo Inc, Pheological Solutions Inc, Rockford Diamond Technology, Rocky Research Inc, Roitech, San Juan Technologies, Sarcos Research Corp, SatCon Technologies, Scalable Systems Technologies, Schaefer Composites Inc, Schmidt Instruments, Schwartz Electro-Optics Inc, Science & Engineering Services Inc, Science and Engineering Associates, Science and Engineering Research Inc, Science Research Laboratory Inc, Scientific Computing Associates, Scientific Research Associates Inc, SDL Inc, Secure Computing Corp, SEMA Inc, SEMATECH, Semicon West, Sensor System, Sensors Corporation, Sensors Unlimited Inc, Sharo, SI Diamond Technology Inc, Sierra Monolithics Inc, Silicon Designs, Silcon Mountain Design Inc, Simplex Wire & Cable, Simula Government Products, Sioux Manufacturing, SKW Corp, Space Computer Corp, Space Exploration Associates, Space Power Inc, Sparta Inc, Spectra Diode Labs, Spectra-Physics, Spectral Sciences Inc, Spire Corp, SRS Technologies, SSG Inc, St Paul Square Small Institute Incubator, Staghorn Technologies, Steroids Ltd, Structured Materials Industries Inc, Sun Microsystems, Superconductor Technologies Inc, SVT Associates Inc, Symetrix, TACAN Corp, Techno-Sciences Inc, Technochem, Technology Applications Corp, Technology Center, Technology Development Corp, Technology Materials Inc, Tetra Corp, Texas Instruments, Thermacore Inc, Thermotrex, Theseus Research Inc, Top-Vu Technology, Toranga Technologies Inc, Toshiba, TPL Inc, Tristan Technologies Inc, TRS Ceramics Inc, TRW, Trymer Inc, UES Inc, Ultramet, United Technologies, Varian Associates, Virtual Environments, Vixel, VRex, Ware Technical Services Inc, Washington Technology, Westinghouse, Wright-Patterson Materials, XACTON Corp, Xemet Corp, Xerox, Xinetics Xinotech, XonTech Inc, Xsirius Superconductivity Inc, Yaron Consulting.

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