Defense Supply Center Columbus, DCCC-PLI, 3990 E. Broad Street, P.O. Box 16704, Columbus, OH 43216-5000

A -- ADVANCED MICROCIRCUIT EMULATION (AME) SOL BAA 97-PLI-01 DUE 012697 POC Contract Specialist, Scott Savory, (614) 692-7121; Contracting Officer, Cheryl Montoney, (614) 692-7114 ADVANCED MICROCIRCUIT EMULATION PROGRAM (AME PROGRAM) Broad Agency Announcement (BAA 97-PLI-01). The Defense Logistics Agency is soliciting proposals for its Advanced Microcircuit Emulation (AME) Program. Proposed development concepts should lead directly to Form, Fit, and Function (FFF) emulation capability with demonstrated emulations of microcircuits, hybrids, and/or elements of electronic assemblies as applicable. Proposed concepts must be technically/economically viable and also implement a Low Rate Initial Production (LRIP) capability. Concepts must evidence a realistic near-term viability for an ongoing stand-alone, non-subsidized emulation enterprise. Specifically excluded are: theoretical concepts, proposed studies, concepts not including a turn-key capability for at least a single application area, standard redesign, after market concepts, remanufacture, and non-functional (in the Government's judgment) concepts. The goal of the AME Program is the development, demonstration, implementation and reproduciblity (as described in the Proposer Information Packet, see below) of FFF methods of production and supply of non-procurable microcircuits and their related electronic assemblies. AME will be the basis to economically supply DLA's needs for items that have been discontinued or declared non-procurable by the original source of supply or for which the Government anticipates obsolescence problems in the future. Relevant technologies to AME's goal include, but are not limited to: device characterization, device test, microcircuit design, microcircuit fabrication, microwave design, device packaging, hybrid design, hybrid assembly, electronic assembly fabrication, electronic assembly test, and device/assembly qualification. Specific application areas of interest to DLA include: (1) Advanced Digital Devices: The desired capability may be broadly bounded by Large Scale Integration up through Very Large Scale Integration devices. (2) Microprocessors and Microcontrollers: This application area includes both early standard and custom microprocessors (4) bit and bit-slice) up through mid-term microprocessors (16 and 32 bit) and greater. (3) Memory: This application area includes the broad RAM and ROM categories beyond 4K. (4) Hybrid Microcircuits: This application area includes hybrid microcircuits employing components from SSI up to the scale and complexity of the die in the accompanying application areas one through three above. (5) Linear/Analog Devices: This application area includes devices beginning with the low end high performance operational amplifiers and continuing through advanced high performance analog-to-digital (A/D) and digital-to-analog (D/A) converters. (6) Assemblies: This application includes engineering services related to replacement of electronic assemblies or elements thereof with emulated FFF devices. The target assemblies are both printed wiring boards and microwave categories. Efforts in this category are producing/mounting FFF components and also FFF emulation of sub-assemblies and/or assemblies using modern emulation techniques. In addressing all of the application areas, fully integrated emulation capabilities are required with proven in-house or captive design and production capability desired. Further details on individual topics are available in the BAA 97-PLI-01 Proposer Information Package (PIP). Program scope: Proposals for individual efforts should not exceed five years in length with LRIP implemented no later than the midway point of the third year. Technologies that have a significant impact on key issues related to DLA's mission, such as: massively broadening the emulatable device coverage, economical end item costs, rapid availability, and high end item quality will be given highest priority. Contract awards are expected late in first quarter of FY 97. Total funding for AME is anticipated to be approximately $25, 000, 000.00 over five years. Both multiple and partial awards are possible. GENERAL INFORMATION: Proposers must obtain the document BAA 97-PLI-01 Proposer Information Package (PIP). The PIP provides further information on areas of interest, the submission, evaluation, funding processes, proposal format, and proposal abstract format. Proposals not meeting format requirements of the PIP may not be reviewed. Internet electronic mail to the administrative address below is the preferred method of requesting the PIP. The PIP will be sent first class mail. Alternately, a proposer may provide a completed prepaid (suitable for 2 pound content) self-addressed overnight US Postal Service Express Mail container to the administrative address below. The PIP will be placed in the container for shipment. Finally, a copy of the PIP may also be obtained in person at the address at the end of this announcement. This BAA will remain open for a period of six (6) months from the date of publication. The first cut-off date for receipt of proposals will be 30 days after the date of publication of this announcement. Proposals received on or before 4:00 PM EST on the first cut-off date will be considered for initial contract awards. An original and five (5) copies of the Proposal must be submitted to the address at the end of this announcement. Proposers are strongly encouraged to submit a Proposal Abstract in advance of actual proposals. This procedure is intended to minimize unnecessary effort in proposal preparation and review. An original and four (4) copies of each Proposal Abstract must be submitted to the administrative address for the for this BAA. Upon review, the Government will provide written feedback on the likelihood of a full proposal being selected. Regardless of the results of a Proposal Abstract review, the decision to offer a full Proposal is entirely the responsibility of the offeror. This announcement in conjunction with the PIP, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for additional information, a further and/or revised announcement will be disregarded. The Government reserves the right to select some, none, or all of the proposals received. Evaluation of the proposals will accomplished through a scientific review of each proposal using the following criteria, which are listed in descending order of relative importance: (1) overall scientific and technical merit, (2) proven, demonstrated captive or in-house capability to produce/fabricate high quality devices (as proposed in the concept), (3) potential contribution to meeting DLA's and the Services' requirements, (4) plans, management structure, and capability to accomplish technology development, implement LRIP, and transition to a self-sufficient stand-alone enterprise (possibly including the use of proposer's resources), (5) Offeror's capabilities and past performance on related efforts (6) Cost realism. Note: Cost Realism will only be significant in proposals which have significantly under or over estimated the cost to complete their effort. All administrative correspondence and questions on this announcement, including requests for information on how to submit a Proposal Abstract or Full Proposal to this BAA, must be directed to the administrative contact below. DLA intends to use electronic mail and fax for correspondence regarding this announcement. Proposals and Proposal Abstracts may not be submitted by fax, any such so sent will be disregarded. The Administrative Address for BAA 97-PLI-01 is: Scott M. Savory, Defense Supply Center Columbus, ATTN: DSCC-PLI (IAC Research and Development Team), P.O. Box 16704, Bldg. 20, Columbus, OH 43216-5010, Phone (614) 692-7121, FAX (614) 692-6935, electronic mail: Scott_Savory@dscc.dla.mil (0355)

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