Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- HIGH-POWER SOLID-STATE ELECTRONICS SOL RA 97-08 DUE 032897 POC Elliott R. Brown, DARPA/ETO, FAX (703) 696-2206 WEB: http://www.darpa.mil/, http://www.darpa.mil/. E-MAIL: RA 97-08@darpa.mil, RA97-08@darpa.mil. DARPA and the Electric Power Research Institute (EPRI) are soliciting innovative research proposals in novel high-power device structures, IC technology, and IC sub-system interaction, that will rapidly revolutionize the state-of-the-art. EPRI is a non-profit research organization for the electric power industry. As a co-sponsor with DARPA, EPRI anticipates contributing half of the industry funds for this R&D program; however, cost sharing from industry is strongly encouraged. DARPA and EPRI will evaluate all proposals submitted in accordance with the guidelines set forth in this RA and the associated Proposer Information Pamphlet. Proposals may be funded by either DARPA or EPRI, jointly by DARPA and EPRI, or through cost sharing with the proposer. For jointly funded projects (where funding will be provided by DARPA, EPRI, and potential awardees), both DARPA and EPRI will be involved in the program management of the research effort. Offerors who feel that their research efforts are primarily of interest to the Department of Defense may wish to respond to BAA 97-05, Megawatt Solid-State Electronics. Those that consider their research efforts primarily of interest to the utilities industry may wish to consider contacting EPRI s Power Electronics Manager, Avishay Katz (fax: (415) 855-2287, electronic mail: akatz@eprinet.epri.com). PROGRAM OBJECTIVES AND DESCRIPTION: DARPA and EPRI are soliciting innovative research proposals in novel high-power device structures, IC technology, and IC sub-system interaction, that will rapidly revolutionize the state-of-the-art. This solicitation is in response to the widespread military and commercial need for high-power solid-state electronics (switching devices and integrated circuits) that can meet the high-current and high-voltage requirements of power transmission and distribution systems, hybrid- and all-electric vehicles, and other types of electrical equipment and machinery so pervasive in modern society. The proposed research should concentrate on novel high-power device structures, IC technology, and/or IC sub-system interaction. Wide-band-gap semiconductors (i.e., SiC, GaN, CVD diamond) are of prime interest, but innovative ideas are encouraged in advanced Si-based power device technology utilizing, for example, advanced wafer-scale thermal management, composite Si material, or beam-triggered devices. All proposals should address the issue of operating temperature because it is of critical importance to the success of this program. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice. DARPA and EPRI seek proposals in the following areas: (I) High-Power Devices, (II) High-Power Integrated Circuits (fabrication processes, design rules, and architectures), and (III) High-Power IC Sub-System Interaction. Each of these areas are of equal importance for funding. Offerors may propose innovative research in one or more area. Additional information on these technology areas is provided in the Areas of Interest section of the RA 97-08 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Multiple awards are anticipated. During the first half of calendar year 1997, DARPA plans to award grants, cooperative agreements, and other transactions, for periods of up to three years. Collaborative efforts/teaming and cost sharing are strongly encouraged. The technical POCs for this effort are Elliott R. Brown (fax: (703) 696-2206, electronic mail: erbrown@darpa.mil) and Avishay Katz (fax: (415) 855-2287, electronic mail: akatz@eprinet.epri.com). GENERAL INFORMATION: Proposers must obtain a pamphlet entitled RA 97-08, High-power Solid-State Electronics, Proposer Information Pamphlet which provides further information on the areas of interest, the submission, evaluation, and funding processes, proposal formats, and other general information. This pamphlet may be obtained by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. DARPA and EPRI will evaluate all proposals submitted in accordance with the guidelines. All proprietary portions of proposals must be clearly marked. Proposers must submit an original and seven (7) copies of proposals to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: RA 97-08) on or before 4:00 P.M., Friday, March 28, 1997, in order to be considered. This notice, in conjunction with the RA 97-08 Proposer Information Pamphlet, constitutes the total RA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA and EPRI. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this RA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in high-power solid-state electronics. Any objections to the terms of this RA or the RA 97-08 Proposer Information Pamphlet must be presented in writing within fifteen (15) calendar days of the publication of this RA in the CBD. Any objections to the conduct of receipt, evaluation or award of grants, cooperative agreements or other transactions must be presented in writing within ten (10) calendar days of the date the objector knows or should have known the basis for its objections. Objections must be provided in letter format, clearly stating that it is an objection or protest to this RA or to the conduct of evaluation or award of a grant, cooperative agreement, or other transaction, andproviding a clearly detailed factual statement of the basis for objection. Objections must be received at the address stated above for delivery of proposals within the times indicated in order to be considered. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a full proposal to this RA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding RA 97-08. Proposals may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA and EPRI encourage use of the World Wide Web (WWW) for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit; (2) potential contribution and relevance to the DARPA and/or EPRI mission; (3) novelty and ingenuity of technical approach; (4) offeror's capabilities and recent related experience, including personnel, facilities, equipment, and data to perform the work; (5) manufacturability and plans to accomplish technology transition; and (6) cost realism and amount of any cost share (strongly encouraged). Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. Proposals that are chosen for funding only by DARPA (i.e., not funded jointly by DARPA and EPRI or solely by EPRI) will require a minimum of 50% cost share. The administrative addresses for this RA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, RA 97-08), Electronic Mail: RA 97-08@darpa.mil, Mail: DARPA/ETO, ATTN: RA 97-08, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0034)

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