Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- DESIGN SUPPORT FOR LARGE SCALE INTEGRATION OF MIXED TECHNOLOGY MICRODEVICES SOL BAA 97-17 DUE 042397 POC Randolph E. Harr, DARPA/ETO, FAX (703) 696-2206 WEB: http://www.darpa.mil/, http://www.darpa.mil/. E-MAIL: BAA 97-17@darpa.mil, BAA97-17@darpa.mil. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of design support for large scale integration of mixed technology microdevices (Composite CAD). The primary focus is on the design and integration of non-transistor devices where the benefits of wafer scale processing with minimal assembly have not been realized. Applications which utilize the resultant tools developed on the design of mixed technology microsystems are also being solicited as a demonstration of developed tool capability and to a lesser extent to demonstrate the applications feasibility. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices or systems. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice. In order to take advantage of emerging microdevices and manufacturing processes, proposals are sought for design technology (tools, methodology, and architectures) to support device and systems design of microelectromechanical, optoelectronic and fluidic devices integrated in with electronic systems. The goal is to bring the benefits of scale and mass production to the integration of microdevices of a non-transistor nature. A new term, integrated microdevices (or IM s), is being introduced to identify this new type of monolithic system. DARPA seeks innovative proposals in the following areas: I. Process and shape-based analysis for the process and device engineer, II. Circuit and physical layout synthesis and verification environments for the systems designer, and III. Applications which utilize the resulting design technology on integrated microdevices (IM s). The primary focus is on linking under-development shape-based analysis tools into a functional circuit and physical layout environment. The circuit and layout environment could be enhanced from standard mixed-signal design tool set but needs to allow the design and incorporation of mixed-technology devices such as microelectromechanical (MEMS) resonators, optoelectronic transmitters and receivers, and microfluidic valves, channels and chambers. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 97-17 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Awards totalling approximately $17 million over three years are expected to be made during the last half of fiscal year 1997. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are strongly encouraged. The technical POC for this effort is Randolph E. Harr, fax: (703) 696-2206, electronic mail: rharr@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled BAA 97-17, Design Support for Large Scale Integration of Mixed Technology Microdevices, Proposer Information Pamphlet which provides further information on design goals for mixed technology microsystems, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and seven (7) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-17) on or before 4:00 P.M., Wednesday March 12, 1997. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and seven (7) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-17) on or before 4:00 P.M., Wednesday, April 23, 1996, in order to be considered. This notice, in conjunction with the BAA 97-17 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in design tools for mixed technology microsystems. Alladministrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 97-17. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the World Wide Web (WWW) for retrieving the Program Information Package and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit. (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror'scapabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 97-17), Electronic Mail: BAA 97-17@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 97-17, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0038)

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