DOC; Mountain Administrative Support Center; Acquisition Management Division; 325 Broadway MC3; Boulder, CO

66 -- ELECTROSTATIC CHUCK SOL 52RANB70C027 POC Procurement Technicians, (303) 497-3221 or Fax: (303) 497-3163 E-MAIL: NOAA; MASC Acquisition Management, Joyce.J.Mills@noaa.gov. The National Institute of Standards and Technology (NIST) requires a cooled wafer chuck upgrade and preventative maintenance on an electron cyclotron resonance plasma-enhanced chemical vapor deposition system (ECR System) manufactured by PlasmaQuest, Inc.. A complete turnkey upgrade is required, including all components, installation and computer interfacing and programming necessary to integrate the cooled electrostatic chuck with the existing ECR System. The ECR System is used to deposit silicon dioxide on wafers (mostly silicon) for microcircuit fabrication. In the absence of other qualified sources, it is the intent of NIST to acquire this upgrade from PlasmaQuest, Inc. 850 North Dorothy Drive, Suite 504, Richardson, TX 75081, under "other than full and open competition procedures," pursuant to 4l USC 253 (c)(1) -- only one responsible source. Minimum technical requirements for the electrostatic chuck are as follows: (1) Shall be configured for use with 76.20 mm silicon wafers that meet this standard: "SEMI M1.2-89 standard for 3 inch polished monocrystalline silicon wafers". (2) Shall be able to control the temperature of the chuck between -15 deg. C to 120 deg. C using a chiller with a temperature range of -25 deg. C to 150 deg. C. (3) The thermal transfer medium between the chuck and wafer shall be helium gas. (4) Clamping of the wafer to the chuck shall be accomplished using an electrostatic force created by a tripolar electrode configuration within the wafer chuck. (5) The transient time required for the electrostatic chuck to completely grip a wafer shall be adjustable from 0.3 seconds to 300 seconds. (6) The controller of the electrostatic chuck shall be able to sense the conductivity of the wafer during loading and communicate the conductivity to the ECR System software. (7) The electrostatic chuck surface which contacts the wafer shall be quartz. (8) The electrostatic chuck shall be able to hold the wafer for more than 1.5 hours. (9) The electrostatic chuck shall be able to release the wafer in less than 700 milliseconds. (10) Shall be able to perform SiO2 depositions without using electrostatic clamping and backside helium cooling. (11) The electrostatic chuck operation shall be compatible with our existing deposition processes, including rf bias up to 300 watts. (12) The chuck shall be capable of withstanding backside helium arcs without damage. (13) The chuck shall be capable of withstanding plasma exposure without damage. (14) RF filters shall be provided for chuck and lift motor assembly. (15) Power supply shall be capable of supplying bipolar output on each driving line up to +/- 4000 volts. (15) Helium gas break for helium discharge suppression shall operate at 10 Torr and 6 kV peak to peak rf voltage. (16) Chuck shall be provided with an integral stepper motor lift mechanism at rf potential. (17) Motor drive for wafer lift mechanism shall be isolated from rf bias potential and integrated with electrostatic state drive control signals. (18) The chuck shall have a thermal conductivity of greater than 200 watts per meter squared per Kelvin. Minimum technical requirements for installation/integration on NIST ECR System are as follows: (1) Fully integrate electrostatic chuck control into existing PlasmaQuest ECR control computer. (2) Shall be able to control and monitor the pressure of the helium gas between the wafer and chuck on existing PlasmaQuest ECR control computer. (3) All required controllers, power supplies and interface electronics shall be provided. (4) The wafer shall be loaded automatically onto the chuck from the existing load lock. (5) The loading mechanism shall be able to place a wafer in the center of the chuck with an error of positioning no greater then +/- 0.5 mm. This tolerance includes the positioning of the primary and secondary flats of the wafer to the position of the respective flats on the chuck. (6) Existing PlasmaQuest ECR control computer software shall be modified to control or monitor all the appropriate parameters of the electrostatic chuck and be completely debugged for problems. (7) Existing PlasmaQuest ECR control computer software modifications shall include all appropriate control characteristics of the electrostatic chuck so that they appear on the same video screen as the existing process parameters. (8) The contractor shall have expertise in process development for optimizing SiO2 deposition processes for achieving conformal coverage in a PlasmaQuest ECR system. (9) Initial setup and testing of the upgrade, including the electrostatic chuck and software, shall be required at the factory before installation at NIST. (10) The upgrade and all warranty work shall be performed on-site with minimum downtime. (11) The upgrade shall be completely operational and meet all the technical requirements listed when the installation is complete. (12) A six month warranty shall be required that includes all components, travel and labor for the upgraded ECR System. This warranty shall require the upgrade to be completely operational and meet all the technical requirements for six months and cover all costs involved in meeting these requirements including travel. (13) An ECR System preventative maintenance shall be performed at the time of chuck installation which includes the following: Load Lock: (a) Check lead screw drive and lubricate; (b) Check bearings and belt on lead screw drive; (c) Check drive unit on inside on load lock. Relubricate and check bearings; (d) Check and clean or replace o-rings in load lock; (e) Check micro-switches on load lock; (f) Change oil pad in turbo; (g) Clean load lock (vacuum it and wipe it out). Clean down to turbo; (h) Check setting on moducell; (i) Check cold cathode gauge. Clean if necessary. Main Chamber: (a) Check quartz window and replace if necessary; (b) Change top ISO 400 centering ring if necessary; (c) Check all viewports and replace if necessary; (d) Clean out chamber, lower spool, valve and turbo screen; (e) Check ceramic lift pins and replace if needed; (f) Clean chuck and pucks; and (g) Check alignment of loading. System: (a) Check for water leaks; (b) Check solenoid valves for leaks and proper operation; (c) Check all drivers and sensors; (d) Check all analog signals. Tweak signals where needed; (e) Check MFC'S for proper operation; (f) Check interlock circuit; (g) Check water flow switch; (h) Zero Baratrons and VAT pm5; (i) Clean or wipe down system; and (j) Run plasma clean process. Sources responding must demonstrate their capability to provide full system integration to meet the Government's minimum requirements, and to provide preventative maintenance of the ECR System at the time of chuck installation. This capability statement shall be submitted to the individual and office cited above within 30 days from the publication date of this synopsis. The acquisition is a commercial item acquisition. This is not a formal solicitation. See Note 22. (0099)

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