NASA/Goddard Space Flight Center, Code 217, Greenbelt, MD 20771

36 -- SPACE FLIGHT QUALIFIED DRAM MEMORY STACKS SOL RFO5-092941-241 DUE 051697 POC Judith Jones, Contract Specialist, Phone (301)286-4242, Fax (301)286-1720, Email Judith.M.Jones.1@gsfc.nasa.gov WEB: Click here for the latest information about this notice, http://procurement.nasa.gov/EPS/GSFC/date.html#RFO5-092941-241. E-MAIL: Judith Jones, Judith.M.Jones.1@gsfc.nasa.gov. NASA/GSFC plans to issue a Request for Offer (RFO) for the acquisition of 60 screened and functionally tested space qualified, package-less, DRAM memory stacks (.512 Mbits), Part No. AS7D16M32BGA and its supporting documentation that includes but is not limited to, structural, mechanical, electrical, functional, timing, and test data for as built as tested units. This procurement is being conducted under the NASA MidRange Pilot Test Program approved by the Office of Federal Procurement Policy. NASA/GSFC intends to purchase the items from Austin Semiconductor, Inc. of Austin, Texas, on a sole source basis, as they are the initial source for the supplies to be purchased. As a follow on effort, Austin Semiconductor is the only known source capable of providing the specific space flight qualified items which will meet these mandatory requirements. The statutory authority permitting Other Than Full and Open Competition is 10 U.S.C. 2304(c)(1), Only One Responsible Source. The specification requirements are as follows: (1) Assemblies of TI 16Mbit, fast page mode, 5V, 4K refresh die, part number TMS416400, (2) The assembly must incorporate wafer scale segments as functional memory building blocks. These memory segments shall be assembled in such a way so as not to be considered packaged or enclosed in platic (PEM), (3) The stack assembly base shall be a ceramic, 50 mil. pitch, chip scale BGA (ball grid array). This same ceramic base must be able to be used with a 2 Gbit stack assembly upgrade. (4) The contractor shall have established procurement relations with Samsung and TI for wafer lot procurement. Samsung 64 Mbit DRAM die (5V, FPM, 4K refresh) will be required for near term density upgrade and acceptable timing upgrades to existing boards built under the EO-1 program. The Contractor shall also provide written mechaical/electrical/timing specifications for the flight qualified DRAM memory stacks. Interested firms have 15 days from the date of this publication on the NAIS to submit their qualifications/capabilities to the Contract Specialist identified above. Sources must provide detailed technical information and other technical literature sufficiently documented to demonstrate their ability to meet all of the above specifications in order to permit this Agency to analyze their information and to determine the firm's bonafide capability of meeting this requirement. Such qualifications/capabilities will be used solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. Responses received after 15 days without the required information will be considered nonresponsive to the synopsis and will not be considered. A determination by the Government not to compete this proposed contract, on a full and open competitive basis, based upon responses to this notice, is solely within the discretion of the Government. No solicitation document is available and a request for a solicitation shall not be considered an affirmative response to this announcement. Telephone responses shall not be accepted, however, you may facsimile information to (301) 286-1720 to the attention of the contract specialist. All responsible sources may submit an offer which shall be considered by the agency. Any referenced numbered notes can be viewed at the following URL: http://genesis.gsfc.nasa.gov/nnotes.htm. (0122)

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