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COMMERCE BUSINESS DAILY ISSUE OF JUNE 11,1997 PSA#1864Defense Advanced Research Projects Agency (DARPA), Contracts Management
Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714 A -- FREQUENCY AGILE MATERIALS FOR ELECTRONICS SOL BAA97-34 DUE 100197
POC Drs. Stuart Wolf and Francis W. Patten, Fax (703) 696-3999
FREQUENCY AGILE MATERIALS FOR ELECTRONICS SOL BAA#97-34 DUE OCTOBER 1,
1997, POC Drs. Stuart A. Wolf and Francis W. Patten DARPA/DSO, FAX
703-696-3999. BACKGROUND: The Defense Advanced Research Projects Agency
(DARPA) seeks proposals to discover, develop and exploit new functional
materials systems, structures and processes for frequency agile
materials, highly innovative device designs using these materials, and
military system applications and insertions. Significantly improved
frequency agile components and subsystems will be very important for
providing new capabilities in military communications, electronic
warfare, remote sensing and surveillance systems, while at the same
time significantly reducing size and cost. The ability to eventually
utilize very small platforms for deploying this technology is of great
interest. PROGRAM OBJECTIVES AND DESCRIPTION: The principal objective
of the Frequency Agile Materials for Electronics (FAME) program is the
development of novel materials, processing techniques and component
technology that will lead to frequency or phase agile electronic
components for DoD applications. To achieve this objective, DARPA is
interested in the development of very low loss, thin and thick film
hybrid materials as well as monolithic structures for frequency or
phase adaptable filters, circulators, conformal and phased array
antennas, oscillators, phase shifters and other rf, or optical devices
utilizing the magnetic field dependence of the permeability of ferrite
materials or the electric field dependence of the permittivity of
ferroelectric materials. Other novel and highly innovative approaches
to achieve frequency and phase agility are also solicited. Proposals
should also address the development of cost effective and scaleable
materials processing technology including sensing and control.
Applications of these frequency adaptable or phase shifting materials
and structures will undoubtedly require a certain level of integration
with semiconductor electronics and therefore DARPA is also interested
in the development of fabrication processes that are compatible with
conventional semiconductor processing. This program expects to leverage
recent advances in theoretical modeling, on-line sensing and process
control as well as experimental techniques for rapid synthesis,
screening and characterization of novel compounds and structures. The
overall goal of the FAME program is to provide an order of magnitude
enhancement in component performance over current state of the art
accompanied by significant reductions in size and cost, thereby
enabling new paradigms in the operability of military systems.
Innovative concepts that address any of the above areas are desired
since DARPA does not have preconceived ideas of the best approach.
Teaming among industrial, academic and government laboratories is
encouraged to ensure that advances in materials and components can be
rapidly exploited for military systems. Cost sharing is also strongly
encouraged, especially for the industrial participants, as it is an
indication of commitment. Individual efforts by industrial, academic
and government laboratories will also be entertained where a convincing
case can be made for comprehensive internal capabilities or broad
applicability of the research. The program is currently scheduled for
four years with approximately $24M of DoD funds. The proposals should
be organized with an initial phase of two years with a significant and
demonstrable milestone at the end, followed by a second one or two
year phase again with a significant technological accomplishment at the
conclusion of the program. All phases should include measurable
milestones and technology demonstrations. HOW TO PROPOSE: Proposal
submission will be a two stage process: First, offerors should submit
pre-proposals which are due at 1600 EDT on 18 July 1997. Based on the
evaluation of these pre-proposals, selected offerors will be encouraged
to submit full proposals which are due at 1600 EDT on 1 October 1997.
The intent of the request for pre-proposalsis to minimize the labor and
costs associated with full detailed technical and cost proposals. All
interested offerors are therefore encouraged to submit pre-proposals.
However, all proposals satisfying the terms and conditions cited herein
will be reviewed regardless of the disposition (or lack) of
pre-proposals. PRE-PROPOSALS: One original and five single sided, hard
copies of pre-proposals of no more than six pages including the
required cover page must arrive no later than 1600 EDT, 18 July 1997 to
receive consideration. Pre-proposals should have the same page format
as the full proposals as described below and in the Proposer
Information Pamphlet (PIP). The pre-proposal should concisely: 1)
identify the focus of the proposed effort; 2) describe the essence of
the new idea; 3) describe the impact on military systems of a
successful effort if reduced to practice; 4) identify the central
science and technology issues including the identification of the major
risks involved in the effort; 5) set forth in tabular form the major
tasks, the corresponding milestones, the timing of the milestones, and
the funding versus time; 6) identify key individuals along with their
institutions, roles and experience; and 7) outline plans, capability
and commitment to productization (if appropriate) including character
and extent of cost sharing. The pre-proposal should also have a brief
cost estimate summary. These pre-proposals should be submitted to
DARPA/DSO, ATTN: BAA #97-34/Wolf/Patten, 3701 N. Fairfax Drive
Arlington VA 22203-1714. Written requests for the proposer information
pamphlet (PIP) or general administrative information should be
addressed to Ms. Wendy Lozano, Strategic Analysis, Inc., Suite 175,
4001 N. Fairfax Drive, Arlington, VA 22203-1714. Faxed requests: Attn:
Wendy Lozano (703) 527-5445. Email requests: lozanw@sainc.com. GENERAL
INFORMATION FOR PREPARATION OF FULL PROPOSALS: Proposers should obtain
the pamphlet entitled BAA#97-34 Proposer Information Pamphlet (PIP)
from the address above. This pamphlet provides detailed information on
required proposal formats and forms. The offeror shall submit six
single sided hard copies, each 8.5 by 11 inches. The pages shall have
1.25 inch margins and the font size will be no smaller than 12 pitch.
Non-conforming proposals may be rejected without review. Facsimile or
electronic media transmissions of the proposal will NOT be accepted.
Separate attachments, such as institutional brochures, reprints, disks,
or videotapes, will be ignored. Proposals shall consist of two volumes:
Volume 1 will be the Technical Proposal and Volume 2 the Cost Proposal.
The first page of each shall be a required special cover sheet and
shall clearly indicate the title, the prime contractor and
subcontractors or partners as the case may be, the principal
investigator name, phone number, fax number, e-mail, the period of
performance, the yearly cost of the effort and the total cost. Volume
1 -- Technical Proposal: the technical proposal shall include, a Table
of Contents, Executive Summary, a Program Description, a Program Plan,
a Statement of Work, a Milestone Chart, a Facilities and Equipment
description, a Description of Relevant Prior Work, a Management Plan,
and brief Resumes of Key Individuals and a brief Cost Summary. The page
count of Volume 1 shall be limited to a maximum of 50 pages, which
includes all figures, references, tables, charts and appendices. Volume
2 -- Cost Proposal: -- The cost proposal shall contain a summary cost
breakdown and a detailed cost breakdown. The cost proposal shall be
prepared in general accordance with FAR 15.804-6 and shall include a
Standard Form 1411, Contract Pricing Proposal Cover Sheet, with all
supporting data in order to allow for a complete review by the
Government. The detailed breakdown of cost data shall include all costs
expected to be incurred under the contract. Cost details, broken-down
by cost element, should be prepared for each major task along with
supporting rationale. All cost details shall be broken down to coincide
with the offeror's accounting periods as related to the specific period
of performance as indicated in the proposed milestone chart. The cost
proposal shall include all supporting information including, but not
limited to: breakdown of labor hours by category, materials (vendor
quotes or method of establishing cost), travel, direct, and indirect
costs. Prime contractors are responsible for assuring that all proposed
subcontracts in excess of $500,000 are supported by an executed SF
1411. The summary breakdown should be shown to the level of major tasks
and should indicate manpower levels of effort, equipment and supplies,
travel and miscellaneous expenses for the tasks of the entire program,
broken out by phases and time. Details of the cost sharing to be
undertaken by the offeror, if any, must be included in the summary
section of volume 2 of the proposal. The summary shall be one page long
(see PIP), but the detailed cost breakdown is not limited in page
count. PROPOSAL EVALUATION: Pre-proposals and full proposals will
beevaluated according to the following evaluation criteria in
descending order of importance: 1) scientific and technological merit
of the proposed program and potential for significant (10X) enhancement
of performance of frequency agile components; 2) offeror's capabilities
and recent related experience, including personnel, facilities,
equipment and data; 3) impact of the successful development on defense
systems; 4) plans, capability and commitment to productization (if
appropriate); and 5) reasonableness of cost. BROAD AGENCY ANNOUNCEMENT:
This CBD notice, in conjunction with BAA#97-34 Proposer Information
Pamphlet (PIP) constitutes a Broad Agency Announcement as contemplated
by FAR 6.102(d)(2). No additional information is available nor will a
formal RFP or other solicitation regarding this announcement be
issued. Requests for same will be disregarded. The government reserves
the right to select for award all, some or none of the proposals
received in response to this announcement. In addition, the Government
reserves the right to award either contracts or assistance
instruments. No portion of the BAA will be set aside for HBCU and MI
participation due to the impracticality of reserving a discrete or
severable area of research for exclusive competition among those
entities. HBCU's and MI's are encouraged to apply and/or team with
other proposers. Awards made under this BAA are subject to the
provisions of the Federal Acquisition Regulation (FAR) Subpart 9.5,
Organizational Conflict of Interest. All offerors and proposed
subcontractors must state in writing, at the time of proposal
submission, whether they are supporting any DARPA technical office(s)
through an active contract or subcontract. All affirmations must state
which office(s) the offeror supports, and identify the prime contract
number. All facts relevant to the existence or potential existence of
organizational conflicts of interest, as that term is defined in FAR
9.501, must be disclosed. This disclosure shall include a description
of the action the Contractor has taken, or proposes to take, to avoid,
neutralize or mitigate such conflict. One original and five copies of
each proposal shall be sent to DARPA/DSO, ATTN: BAA 97-34/Wolf/Patten,
3701 North Fairfax Drive, Arlington, VA 22203-1714 by 1600 EDT, 1
October 1997. DARPA will acknowledge receipt of pre-proposal and
proposal submissions within approximately ten business days of receipt,
and assign a control number that should be used in all further
correspondence regarding the submission. (0160) Loren Data Corp. http://www.ld.com (SYN# 0002 19970611\A-0002.SOL)
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