Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- VLSI PHOTONICS SOL BAA 97-38 DUE 112497 POC E. Towe, DARPA/ETO, Fax (703) 696-2206 WEB: http://www.darpa.mil, http://www.darpa.mil. E-MAIL: BAA97-38@darpa.mil, BAA97-38@darpa.mil. PROGRAM OBJECTIVES AND DESCRIPTION: DARPA is soliciting proposals for technical research in the area of very large scale integration of photonic devices (VLSI Photonics). Optics and optical interconnection in the long-haul and local area networks have proven extremely successful. The next arena where optics and optical interconnection will make an even greater impact is in the box where optics has the potential to solve the electronic interconnect problem at the backplane of boards, between MCMs, and between chips, for example, in processor-to-memory and processor-to-processor communications. At this level of hierarchy, optics and optical interconnections have the potential to dramatically increase the speed and capacity of interconnection buses. Next-generation optical memories are projected to increase current storage capacities by at least an order of magnitude; optical volumetric memory concepts will push this limit to densities in the terabits per cubic centimeter range. With parallel access optical interconnections, formed from very large scale integration of optical and electronic devices, the raw transfer rates of these memories will easily approach the 100s of gigabits/s. The emphasis of the VLSI Photonics program will be on applications that clearly show the advantages of the parallelism of optics, advanced VLSI electronics, and large scale integration of optoelectronic smart pixels, combined with innovative heterogeneous integration and packaging technologies. This DARPA program will build on advances made in optoelectronic device technologies, optical memory technologies, heterogeneous integration and packaging technologies to demonstrate data transport rates and reconfigurable I/O capabilities in the 10s of Tbits/s range, and rapid parallel access to ultra-high density memories. The two areas of interest in this program which must be proposed together as one complete effort are: I. VLSI Photonics Systems Demonstrations and II. VLSI Components and Packaging Technologies. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 97-38 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Collaborative efforts with closely coupled and integrated research teams are strongly encouraged. Integrated teaming refers to collaboration among system/subsystem developers and integrators, component developers/manufacturers, and researchers (e.g., University and industrial researchers). Members of proposed teams should have experience and expertise in optoelectronic component development, optical memories, VLSI design, and other relevant experience and expertise. Offerors should be capable of demonstrating applications of VLSI Photonics technology in high-payoff military and commercial information processing systems, with the potential (not under this program) of commercializing the results. The program scope does not include field insertion, but rather, a concept demonstration. Offerors must propose as one cohesive effort both areas of interest exclusive ofOptical Memories if an offeror does not have this expertise; however, offerors are encouraged to seek the inclusion of such capability. Awards totaling approximately $35,000,000 over four years are expected to be made during the first quarter of calendar year 1998. Multiple awards are anticipated. Cost sharing is strongly encouraged. The technical POC for this effort is Dr. Elias Towe, fax: 703-696-2206, electronic mail: etowe@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled BAA 97-38, VLSI Photonics, Proposer Information Pamphlet which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort inproposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and eight (8) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-38) on or before 4:00 P.M., Monday, October 6, 1997. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and eight (8) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-38) on or before 4:00 P.M., Monday, November 24, 1997, in order to be considered. This notice, in conjunction with the BAA 97-38 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in VLSI Photonics. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 97-38. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit; (2) potential contribution and relevance to DARPA mission; (3) plans and capability to accomplish technology transition; (4) offeror's capabilities and related experience; and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 97-38), Electronic Mail: BAA 97-38@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 97-38, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0232)

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