DEVELOPMENTS AT NIST Researchers in the Electronics and Electrical Engineering Laboratory at the National Institute of Standards and Technology have developed a new technology, Thermalplane Heat Sink, NIST DOCKET NUMBER 97-023PA. The invention comprises heat sinks that extend beyond the boundaries of hot components on electronic circuit boards and that are shorter than traditional heat sinks. These low-profile heat sinks can cool one component or several components simultaneously. Any parties interested in the further development or licensing of the technology described above may write to: Ernest R. Graf, Licensing and CRADA Officer, National Institute of Standards and Technology, Industrial Partnerships Program, Building 820, Room 213, Gaithersburg, Maryland 20899. This is not an announcement of a contract or a grant. WEB: NIST Contracts Homepage, http://www.nist.gov/admin/od/contract/contract.htm. E-MAIL: NIST Contracts Office, Contract@nist.gov.

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