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COMMERCE BUSINESS DAILY ISSUE OF OCTOBER 3,1997 PSA#1944

Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- MICROELECTROMECHANICAL SYSTEMS (MEMS) SOL BAA 97-43 DUE 121597 POC A. Pisano, DARPA/ETO, Fax: (703) 696-2206 WEB: http://www.darpa.mil, http://www.darpa.mil. E-MAIL: BAA97-43@darpa.mil, BAA97-43@darpa.mil. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of microelectromechanical systems (MEMS). The long-term goal of the MEMS program is to combine sensing, computing, and actuating and integrate these functions into mechanical structures to radically change the way people and machines interact with the physical world. Military information systems are tending to leave command centers and appear both in weapons and in the pockets of the combatants. Thus, they are getting closer to the physical world, and this trend creates new opportunities for perceiving and controlling the battlefield environment. Further demands for increased performance, reliability, robustness, lifetime, maintainability, and capability of military equipment of all kinds can be met by the integration of MEMS into macro devices and systems. DARPA seeks proposals in two broad technology areas: (1) development and demonstration of arrays of MEMS, including but not limited to wristwatch communications, arrays for vehicle or macro system monitoring and/or control, and micro airborne surveillance/communication; and (2) fabrication and assembly processes for innovative new MEMS, including but not limited to process disintegration, massively parallel microassembly, non-silicon substrates, and fully three-dimensional structures. Additional information on these technology areas is provided in the areas of interest section of BAA 97-43, Microelectromechnaical Systems (MEMS) Proposer Information Pamphlet, referenced below. PROGRAM SCOPE: Awards totaling approximately $25 million over 3 years are expected to be made during the first half of calendar year 1998. Multiple awards are anticipated. Collaborative efforts, teaming, and cost sharing are encouraged. The technical POC for this effort is Dr. Albert P. Pisano, FAX: (703) 696-2206, electronic mail: apisano@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 97-43, Microelectromechanical Systems (MEMS), Proposer Information Pamphlet," which provides further information on the development and demonstration of arrays of MEMS and the manufacturing of resources for innovative new MEMS; the submission, evaluation, and funding processes; proposal abstract formats; proposal formats; and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. To minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and five (5) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-43) on or before 4:00 p.m. Friday, November 21, 1997. Proposal abstracts received after this time and date will not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and five (5) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-43) on or before 4:00 p.m. Monday, December 15, 1997, in order to be considered. This notice, in conjunction with Microelectromechnacial Systems (MEMS) BAA 97-43 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal, which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals or join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in the development and demonstration of arrays of MEMS and the manufacturing of resources for innovative new MEMS. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use e- mail and fax for correspondence regarding BAA 97-43. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the proposer information pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will be significant only in proposals that have significantly under-estimated or overestimated the cost to complete the effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 97-43), Electronic Mail: BAA97-43@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 97-43, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the proposer information pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0274)

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