U.S. Army Space and Missile Defense Command, ATTN: SMDC-CM-CK, PO Box 1500, Huntsville, AL 35807-1990

A -- DASG60-98-0010 -- ADVANCED OPTICS/MICROELECTRONICS TECHNOLOGY SOL DASG60-98-R-0011 DUE 041498 POC Dennis Greenawalt, Contract Specialist, SMDC-CM-CK/Donald C. Reesman, Contracting Officer, SMDC-CM-CK/(205) 955-1187 The U.S. Army Space and Missile Defense Command is seeking to award a dedicated contract vehicle for Advanced Optics and Microelectronics Technology. Following is a summary description of the requirement: This effort requires the contractor to evaluate, develop, simulate, test, fabricate, and demonstrate advanced Optics/Microelectronics technologies for system applications that have present or future requirements with regard to operating in a radiation environment, regardless of radiation level. Demonstrated areas of understanding should include natural space and manmade radiation environments where neutron and proton effects, ionizing total dose, dose rate, gamma and gamma dot, x-ray, single event effects, rail-span collapse, and charged particle ionization degradation, but not be limited to past discovered radiation phenomena, could influence from the range of subsystem to part level optics/microelectronics. Optics/ Microelectronics designed, simulated, fabricated, tested parametrically, and/or evaluated under this contract will offer highly enhanced operational and physical features to include operation with regard to, but not be limited to, digital, linear, power conditioning, nonvolatility, high temperature and /or cryogenic temperature conditioning given overall demand to operate in a radiation environment. For the hardware developed under this contract, the contractor must have access to a fabrication facility and qualified technical personnel capable of operating complex instrumentation. Capability must exist for developing and implementing digital, linear, nonvolatile, mixed signal, and optical component radiation hardened design rules, libraries, and macro cells. Further capability is needed to produce prototype microelectronic chips/devices/test structures with fabrication processes that meet the radiation requirements of various programs. The contractor must have a knowledge base of current radiation testing facilities and test plans that are used for, but not limited to, Dose Rate, Total Dose,and Single Event Upset testing. The contractor must also demonstrate knowledge and understanding, with possibility to prototype, state-of-the-art semiconductor component technologies such as high temperature electronics, cryogenic electronics, silicon-on-insulator, ferroelectric, silicon carbide, diamond, and packaging given a radiation environment. Technical and program management personnel will be required to rapidly respond to technical directives and local coordination/interaction with Program Executive Office Missile Defense project offices. The contractor must have demonstrated on time, in budget performance on complex radiation optics/electronics technology programs. A demonstrated knowledge of and working relationships with both contractor and government radiation hardened electronics companies/agencies is needed. The solicitation for proposals is planned to be released approximately February 5, 1998. Any firm competent to perform the effort described above should submit a request for solicitation DASG60-98-R-0011 to SMDC-CM-CK, Dennis Greenawalt, at the address above, within fifteen (15) calendar days from the date of publication of this notice. Requests shall reference DASG60-98-0010. No telephone responses will be accepted. This announcement is for informational purposes and is not a formal solicitation for proposals. This acquisition is not open to foreign participation. SIC Code 8731 is applicable. The small business size standard is 1,000 employees. Firms responding to this notice should indicate whether they are a large, small, or small and disadvantaged business. (0009)

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