Commanding Officer, USCG Civil Engineering Unit Oakland, 2000 Embarcadero, Suite 200, Oakland, CA 94606-5337

Z -- REPAVE/INSTALL GROUNDING AT HELO PAD AT USCG STATION NEAH BAY, NEAH BAY, WA SOL DTCG88-98-B-623319 DUE 022798 POC Almer Adams, Contracting Officer or Bid Clerk at (510) 535-7242 DTCG-98-B-623319 REPAVE/INSTALL GROUNDING AT HELO PAD AT USCG STATION NEAH BAY, NEAH BAY, WA. Furnish all labor, materials, and equipment necessary to repair the existing helo pad, approximately 8,100 square feet, at Station Neah Bay. Work includes, but is not limited to, the following: (1) Overlay the helo pad with three (3) inches of TYPE B asphalt concrete and pavement reinforcing fabric; (2) Replace existing helo pad lights and mounting brackets with new; (3) Install new helo pad grounding system; and (4) Install pavement masking on newly paved area to match existing. Estimated range is $25,000 to 100,000. Performance period is 30 calendar days after receipt of Notice to Proceed. This procurement is subject to the Small Business Competitiveness Demonstration program and is open to large and small business participation. The applicable SIC is 1611. Small Business xize standard is $17 million. All responsible sources may submit a bid, which will be considered. THIS IS AN UNRESTRICTED ACQUISITION BEING SOLICITED. ALL RESPONSIBLE SOURCES ARE ENCOURAGED TO RESPOND. For minority, women and disadvantaged business enterprises: The Department of Transportation (DOT Office of Small and Disadvantage Business Utilization has programs to assist minority, women owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates up to $500,000 per contract to provide accounts receivable financing. The Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $500,000 per contract. DOT provides an 80 percent guaranty on the bond amount to a surety against losses. For further information and applicable forms concerning the STLP and Bonding Assistance Program, please call (800) 532-1169. Anticipated bid issue date is 24 December 1997 with opening date 30 days later. ONLY WRITTEN REQUEST FOR SOLICIATIONS WILL BE ACCEPTED. PLEASE FAX YOUR REQUESTS TO THE ATTENTION OF: Bid Issue Clerk, FAX (510) 535-7288. (0012)

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