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COMMERCE BUSINESS DAILY ISSUE OF FEBRUARY 10,1998 PSA#2029US Army ARDEC, AMSTA-AR-PC, Picatinny Arsenal, New Jersey 07806-5000 A -- DUAL USE APPLICATION PROGRAM (DUAP), SCIENCE & TECHNOLOGY (S&T)
INITIATIVES SOL DAAE30-98-BAA-0102 DUE 040698 POC Dianna McGinley
(973)724-4423; Paul Milenkowic (973)724-5391 WEB: US ARMY TACOM-ARDEC
Procurement Network, http://procnet.pica.army.mil/procacts.htm. E-MAIL:
Dianna McGinley, dmcgin@pica.army.mil. The U.S. Army TACOM-ARDEC
announces a program in the area of Dual Use Application Program (DUAP),
Science and Technology (S&T) Initiatives. This Broad Agency
Announcement is issued under the S&T Initiative and is part of the
Defense Departments DUAP. The anticipated Army share of the FY98 DUAP
funding is approximately $22,000,000. TACOM-ARDEC seeks projects to
create and develop new product or process technologies which have
potential for both Army and commercial applications. If successfully
developed, the technology will have both Army relevance and sufficient
potential commercial applications to support a viable production base.
The proposer must bear at least 50% of the cost of the proposed effort.
There is no pre-set dollar range for individual proposals, however, the
Government share contemplated is shown below and will be provided
within the Broad Agency Announcement (BAA) to be issued for each topic
area. The topic areas for this BAA are as follows with the Government
share contemplatedshown in parenthesis: Acoustical Signal Enhancement
Module for Improving Speech Recognition Accuracy in High Noise
Environments ($400,000); Photon Battery for Fire Control Applications
($200,000); Improved Luminous Sources for Fire Control Devices
($200,000); Model Based Control Systems for the Production of Energetic
Materials ($6,000,000); Manufacturing Integration of Open Architecture
Controllers Using Totally Integrated Munitions Enterprise Techniques
($4,000,000); Flexible-Integrated Robotic Welding System ($600,000);
Thermoplastic Laminate Modeling and Fabrication ($600,000);
Lightweight, Cost Efficient Highly Loaded Composite Structures
($80,000); Ion Beam Processing for Increased Wear Life of High Value
Chrome Plated Parts ($100,000); and Application of Multiple Explosively
Formed Penetrator (MEFP) Technology to Downhole Penetrator Warheads
($250,000). There is no guarantee that awards will be made in each of
the topic areas identified. The Government may award several proposals
in a topic area depending in part on the cost of individual proposals
and funding. Proposals received in response to this BAA will be
evaluated by a panel of experts assembled at TACOM-ARDEC and ranked
prior to forwarding for Army review and the DOD Steering Committee. The
DOD Steering Committee will make the final selection(s) for award. It
is contemplated that Cooperative Agreements and/or Other Transactions
will be awarded as a result of the BAA. This BAA will be available on
TACOM-ARDEC Acquisition Centers home page during the week of 9 February
1998; address is "http://procnet.pica.army.mil" or by contacting the
point of contacts identified at the above address. (0037) Loren Data Corp. http://www.ld.com (SYN# 0007 19980210\A-0007.SOL)
A - Research and Development Index Page
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