NASA/Lyndon B. Johnson Space Center, Houston Texas, 77058-3696, Mail Code: BJ

70 -- X-38 AVIONICS MULTI-PROTOCOL BOARDS FOR SPACE VEHICLE 201 SOL 9-BJ2-14-8-04Q DUE 022598 POC Florence A. Ahadzie, Contract Specialist, Phone (281) 483-4371, Fax (281) 483-2138, Email fahadzie@ems.jsc.nasa.gov -- Ronald Johnson, Contracting Officer, Phone (281) 483-4164, Fax (281) 483-2138, Email rjohnson@ems.jsc.nasa.gov WEB: Click here for the latest information about this notice, http://nais.nasa.gov/EPS/JSC/date.html#9-BJ2-14-8-04Q. E-MAIL: Florence A. Ahadzie, fahadzie@ems.jsc.nasa.gov. The purpose of this Modification 1 is to consolidate the synopsis/solicitation and specifications into one document. The specifications were intitially posted as a separate document. This notice is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; offers are being requested and a written solicitation will not be issued. This notice is being issued as a Request for Quotation (RFQ) for X-38 avionics multi-protocol boards for space vehicle 201. (See attachments for specifications). The provisions and clauses in the RFQ are those in effect through FAC 97-03. The SIC code and the small business size standard for this procurement are 3764 and 1,000 respectively. The offeror shall state in their offer their size status for this procurement. All qualified responsible business sources may submit an offer which shall be considered by the agency. Delivery to NASA/JSC is required within the delivery schedule spelled out in the attached specifications. Delivery shall be FOB Destination. The DPAS rating for this procurement is DO-C9. Offers (2 original copies) for the items(s) described above must be mailed to the designated office of receipt @ NASA/JSC, 2101 NASA Road 1, Bldg. 12, Rm. 135, Attn.: BJ22/Florence Ahadzie, Houston, Texas, 77058, and are due by 3:00 p.m. February 25, 1998. Each offer must include the following: solicitation number, FOB destination to this Center, proposed delivery schedule, discount/payment terms, warranty duration (if applicable), identification of any special commercial terms, and a completed and signed copy of the "Representations & Certifications" document required by FAR 52.212-3. This document may be obtained via the internet at URL: http://nais.nasa.gov/msfc/pub/reps_certs/midrange/, and will be incorporated by reference in any resultant contract. Offerors are encouraged to use the Standard Form 1449, Solicitation/Contract/Order for Commercial Items form found at URL: http://procure.arc.nasa.gov/Acq/Standard_Forms/Index.html to submit a offer. Offerors shall provide the information required by FAR 52.212-1. If the end product(s) offered is other than domestic end product(s) as defined in the clause entitled "Buy American Act -- Supplies," the offeror shall so state and shall list the country of origin. FAR 52.212-4 is applicable. FAR 52.212-5 is applicable with the exception of section (b): (4) (5) (12) (13) (14) (15) (15)(ii) & (16); and section (c): (1) through (5). Questions regarding this acquisition must be submitted in writing, by e-mail or facsimile, no later than February 17, 1998. Selection and award will be made (on an aggregate basis) to the lowest priced, technically acceptable offeror. Technical acceptability will be determined by information submitted by the offeror providing a description in sufficient detail to show that the product offered meets the Government'srequirement. An ombudsman has been appointed -- See Internet Note "B". It is the offeror's responsibility to monitor this site for the release of amendments (if any). Potential offerors will be responsible for downloading their own copy of this combination synopsis/solicitation and amendments (if any). Any referenced notes can be viewed at the following URL: http://genesis.gsfc.nasa.gov/nnotes.htm. Specifications for the X-38 Avionics Fiber Data Distribution interface(FDDI) Board 7 Build Level- Commercial 7 ANSI X3T9.5 compliant 7 VME form factor-6U @ .8 in. pitch 7 VME Interface- VME64 (master and slave) with block transfers 7 Backplane Connectors a) Din 41612 b) OPTION: Backplane P1/P2 connectors compatible with VME64 extensions(5 row P1 and P2) with pin assignments for rows z and d grounded or used for signals. c) Corrosion resistant electrical contacts 7 VME bus Compliance- Address:A32, Data:D32 7 Cooling -- air-cooled 7 Dual Attach Station with SMT 7.3 or later version 7 Type 1 optical data link in accordance with Mil-Std-2204A 7 1 megabyte of FDDI ring buffer memory 7 1 megabyte of data memory 7 2 megabytes of instruction memory 7 Hardware check sum engine for protocol acceleration 7 Multi-address detection and management 7 I/O ports- 7 1-RS 232 channel user programmable 7 FDDI I/O via front panel (ST connectors) 7 Power requirements- FDDI board not to exceed the total allowed current of a single VME slot over the temperature operating range 7 Device Driver Software for VxWorks version 5.3 to locate on a Power PC604e board. 7 Interface for control of an Optical bypass switch -5VDC @ 80 milliamp 7 Built-in Test(BIT) of the CPU board with user accessible results and is launched: 7 Automatically initiated at power up of board 7 Under user request for continuous non-intrusive testing 7 95% fault detection and 90% isolation to the component 7 Environmental 7 Temperature 7 Operating -- 0 0C to 30 0C 7 Non-operating -- 20 0C to 60 0C As part of the selection of the commercial boards, vendor must demonstrate that it carries the FDDI equivalent ruggedized version of the commercial version with additional features: 7 Build Level -Ruggedized (Mil Temp compliant) 7 Board Cooling -Conduction-cooled per IEEE 1101.2-1992 w/wedge locks @ .8 in. pitch 7 Dual Attach Station FDDI I/O with optical interface via backplane P0 or front panel 7 Type 3 Optical Data Link in accordance with Mil-Std-2204A 7 Environmental 7 Vibration-Random (operating) Frequency (HZ) Acceptance 20 .015 g2/Hz 50 .09 g2/Hz 800 .09 g2/Hz 2000 .015 g2/Hz Overall -- 10.8 grms 1 min./axis 7 Temperature 7 Operating -- 0 0C to +32.2 0C 7 Non-operating- -50 0C to 85 0C 7 Pressure -- 8 to 18 psia (operating) 7 Optional: Environmental stress screening 7 Handling/Shock (non-operating) 1. Four drop test for each of the four ORU edges are required. Each edge is used as a pivot such that the opposite edge of the ORU is lifted 4 inches above the wooden bench and dropped. 2. 20g terminal sawtooth shock pulse of 11 milliseconds in each axis. Specifications for the V-201 Avionics System Manager Memory Buffer Board 1. Board Build level -- commercial 2. 16 Mbytes of Static Ram 3. < 70 nsec access time 4. Error Detection &Correction (EDC) circuitry on-board 5. Device Driver Software for VxWorks version 5.3 hosted on the Power PC board. 6. VMEbus Compliance- Address: A32/24/16, Data: D32/16/08 7. VME form factor-6U @ .8 in. pitch 8. Backplane Connectors a) Din 41612 b) OPTION: Backplane P1/P2 connectors compatible with VME64 extensions (5 row P1 and P2) with pin assignments for rows z and d grounded or used for signals. 9. Power requirements-memory board not to exceed the total allowed current of a single VME slot over the temperature operating range 10. Built-in Test (BIT) of the memory board with user accessible results and is launched: a) Automatically initiated at power up of board b) Under user request c) 95% fault detection and 90% isolation to the component 11. Environmental Factors Temperature: Operating -- 0 0C to 30 0C Non-operating- -20 0C to 60 0C As part of the selection of the memory boards, vendor must demonstrate that it carries the Multi-Protocol equivalent ruggedized version of the commercial version with additional features: 1. Board Cooling : Conduction-cooled per IEEE 1101.2-1992 w/wedge locks @ .8 in. pitch 2. Environmental: a) Temperature -- Operating 0 0C to +32.2 0C -- Non-operating- -50 0C to 85 0C b) Pressure -- 8 to 18 psia (operating) c) Vibration-Random (operating) Frequency (HZ) Acceptance 20 .015 g2/Hz 50-800 .09 g2/Hz 2000 .015 g2/Hz Overall -- 10.8 grms 1 min./axis d) Handling/Shock (non-operating) I. Four drop test for each of the four ORU edges are required. Each edge is used as a pivot such that the opposite edge of the ORU is lifted 4 inches above the wooden bench and dropped. II. 20g terminal sawtooth shock pulse of 11 milliseconds in each axis. e) Optional environmental stress screening 7 Specifications for V-201 Avionics Multi-Protocol board 1. Build level- Commercial 2. VME form factor-6U @ .8 in. pitch 3. VME Interface- ANSI/IEEE std. 1014-1987 4. Backplane Connectors a) Din 41612 b) OPTION: Backplane P1/P2 connectors compatible with VME64 extensions (5 row P1 and P2) with pin assignments for rows z and d grounded or used for signals. c) Corrosion resistant electrical contacts 5. 2-16 bit timers 6. On-board firmware to support HDLC on any serial channel 7. 8 Kbyte or more of Dual-Port Memory 8. DMA Channel for each port channel 9. Board cooling -- air-cooled 10. Power requirements- Protocol board not to exceed the total allowed current of a single VME slot over the temperature operating range 11. Four to Eight (4-8 )I/O serial communication channels selectable as RS-422/232/485 with the following abilities: a) Sustain 2 channels running at 2 megahertz, synchronously with the remaining channels at 9.6Kbaud async running full-duplex b) Or, all channels at 1 megahertz running synchronously c) Modem control I/O signals as Differential or signal-ended 12. Board Software/BSP/Device Drivers -- VxWorks version 5.3 13. Built-in Test (BIT) of the CPU board with user accessible results and is launched: a) Automatically initiated at power up of board b) Under user request c) 95% fault detection and 90% isolation to the component 14. Environmental Temperature- Operating 0 0C to 30 0C Non-operating -20 0C to 60 0C As part of the selection of the commercial boards, vendor must demonstrate that it carries the Multi-Protocol equivalent ruggedized version of the commercial version with additional features: 1. Board Cooling : Conduction-cooled per IEEE 1101.2-1992 w/wedge locks @ .8 in. pitch 2. Environmental: a) Temperature -- Operating 0 0C to +32.2 0C -- Non-operating- -50 0C to 85 0C -- Optional environmental stress screening b) Pressure -- 8 to 18 psia (operating) c) Vibration-Random (operating) Frequency (HZ) Acceptance 20 .015 g2/Hz 50-800 .09 g2/Hz 2000 .015 g2/Hz Overall -- 10.8 grms 1 min./axis d) Handling/Shock (non-operating) I. Four drop test for each of the four ORU edges are required. Eachedge is used as a pivot such that the opposite edge of the ORU is lifted 4 inches above the wooden bench and dropped. II. 20g terminal sawtooth shock pulse of 11 milliseconds in each axis. e) Optional: Environmental stress screening Specifications for V-201 Avionics PowerPC (PPC) and 1553B PMC boards 7 Build LEVEL-Commercial 7 CPU- PowerPC (PPC) 604e-100MHz or faster 7 VME form factor-6U @ .8 in. pitch 7 Level 2 Cache-512 Kbytes 7 Dram memory-32 Mbytes 7 Error Detection /Correction with ability to turn it on or off 7 User Flash- 8 Mbytes or more 7 VME Interface- VME64 (master and slave) with block transfers 7 Backplane Connectors a) Din 41612 b) OPTION: Backplane P1/P2 connectors compatible with VME64 extensions (5 row P1 and P2) with pin assignments for rows z and d grounded or used for signals c) Corrosion resistant electrical contacts 7 PCI bus backbone with at least one PMC slot 7 Real-time clock w/ minimum of 50 bytes of RAM and w/ ability to generate a 50 Hz interrupt with a stability of 50 ppm. 7 Board cooling- air-cooled 7 I/O -- 7 Single dual Redundant 1553B PCI Mezzanine Card to locate on PPC 604/604e 7 commercial build level 7 BIT software/firmware 7 RT/BC 7 transformer or direct coupled 7 2 -RS-232 w/DMA 7 2 -RS-422 (synchronous or asynchronous)w/DMA and with associated I/O modem control signals also differential. Sustain 2 Megabits/sec on both channels 7 1-SCSI-2 with DMA 7 Discrete I/O Parallel port 7 Current (amperage) requirements- CPU and PMC together not to exceed the total allowed current of a single VME slot over the temperature operating range specified below 7 Operating system / BSP -- VxWorks version 5.3, supported by WindRiver 7 VxWorks version 5.3 device drivers for all I/O specified above to locate on PPC 604e. 7 Built-in Test (BIT) of the CPU board with user accessible results and is launched: 7 Automatically initiated at power up of board 7 Under user request 7 95% fault detection and 90%isolation to the component 7 Environmental Factors (natural and induced) 7 Temperature 7 Operating -- 0 0C to 30 0C 7 non-operating -- -20 0C to 60 0C As part of the selection of the commercial boards, vendor must demonstrate that it carries the PowerPC (PPC) and 1553B PMC equivalent ruggedized version of the commercial version with additional features: 7 Build level Ruggedized (Mil Temp Compliant) 7 Board power consumption no more than 30 watts 7 Board Cooling 7 604e- conduction-cooled per IEEE 1101.2-1992 w/wedge locks @ .8 in. pitch 7 PMC conforming to Draft Standard for conduction-cooled PMC modules 7 Environmental Factors (natural and induced) 7 Temperature 7 Operating -- 0 0C to +32.2 0C 7 Non-operating- -50 0C to 85 0C 7 Pressure -- 8 to 18 psia (operating) 7 Optional environmental stress screening 7 Vibration-Random (operating) Frequency (HZ) Acceptance 20 .015 g2/Hz 50 .09 g2/Hz 800 .09 g2/Hz 2000 .015 g2/Hz Overall -- 10.8 grms 1 min./axis 7 Handling/Shock (non-operating) 1. Four drop test for each of the four ORU edges are required. Each edge is used as a pivot such that the opposite edge of the ORU is lifted 4 inches above the wooden bench and dropped. 2. 20g terminal sawtooth shock pulse of 11 milliseconds in each axis. Line item # Name EstimatedCost per item Delivery Schedule(ARO) Quantity OrderMIN. MAX ProcurementWindow(date) Additional Information 1 Commercial PowerPC(PPC) 604e board(bd) w/1553 PMC 12 weeks 10 50 Nov. 97 through July 98 2 VxWorks 5.3 BSP/w I/O device drivers for PPC 604e 6 weeks 1 5 Nov. 97 through July 98 Software works with both commercial and the ruggedized CPU boards 3 VxWorks 5.3 BSP/device drivers for 1553B 6 weeks 1 5 Nov. 97 through July 98 Software works with both commercial and the ruggedized 1553B boards 4 Commercial FDDI bd 14 weeks 10 50 Nov. 97 through July 98 5 VxWorks 5.3 FDDI BSP/device drivers 15weeks 1 5 Nov. 97 through July 98 Software works with both commercial and the ruggedized FDDI boards 6 Commercial Multi-protocol bd 14 weeks 6 25 Nov. 97 through July 7 Multi-Protocol VxWorks 5.3 BSP/ I/O device drivers 6 weeks 1 3 Nov. 97 throughJuly Software works with both commercial and the ruggedized Multi-protocol boards 8 Commercial Memory Buffer Board 12 weeks 3 10 Nov. 97 through July 9 VxWorks 5.3 memory buffer board BSP/device drivers 6 weeks 1 3 Nov. 97 through July Software works with both commercial and the ruggedized memory boards Note: Offeror to provide quotation for per unit prices (in column 3 entitled "Estimated price per unit") based solely on the minimum quantity. The Government reserves the right to purchase additional quantities up to the maximum quantity, if needed. X-38 Avionics Hardware/Software Line Items ITEM DESCRIPTION 1. Commercial PowerPC(PPC) board(bd) w/1553B PPC 604e,100Mhz or faster w/1553B single ch. (see specifications) complete h/w documentation Certificate of compliance 2) VxWorks 5.3 BSP/ I/O device drivers for S/W Vxworks device driver for PPC 604e PPC 604e boards and complete documentation 3) VxWorks 5.3 BSP/device drivers for 1553B S/W Vxworks device driver for 1553B PMC and complete documentation 4) Commercial FDDI bd ANSI X3T9.5 compliant VME FDDI board, Dual attach station, optical by-pass control, hardware checksum (see specs for complete details) complete h/w documentation Certificate of Compliance 5) VxWorks 5.3 FDDI BSP/device drivers S/W VxWorks device driver for FDDI boards and complete s/w documentation 6) Commercial Multi-protocol board Multi-serial channel board and complete h/w documentation. Certificate of compliance 7) Multi-protocol VxWorks 5.3 BSP/I/O S/W Vxworks device driver for Device Driver multi-protocol board and complete s/w documentation 8) Commercial Memory buffer board Static memory board(see specs for full details) and complete h/w documentation. Certificate of Compliance 9) VxWorks 5.3 memory buffer board BSP/device S/W Vxworks device driver for Drivers MEMORY BUFFER board and complete s/w documentation (0042)

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