NASA/Goddard Space Flight Center, Code 211, Greenbelt, MD 20771

D -- COMPLEMENTARY METAL OXIDE SEMICONDUCTOR(CMOS) SOL RFP5-58471-037 DUE 030298 POC Herman Martin, Contract Specialist, Phone (301)286-7467, Fax (301)286-1654, Email Herman.N.Martin.1@ gsfc.nasa.gov -- Patrick D. Logan, Contracting Officer, Phone (301)286-4962, Fax (301)286-1654, Email Patrick.D.Logan.1@ gsfc.nasa.gov WEB: Click here for the latest information about this notice, http://nais.nasa.gov/EPS/GSFC/date.html#RFP5-58471-037. E-MAIL: Herman Martin, Herman.N.Martin.1@gsfc.nasa.gov. NASA/GSFC plans to issue a Request for Proposal (RFP) FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR(CMOS) The Government intends to acquire a commercial(modified) items using FAR PART 12, and FAR 13.6 -- simplified acquisition procedures for commercial items. The procurement is being conducted under the authority of FAR Subpart 13.6, Test Program for Certain Commercial Items. The contractor shall be required to test,and deliver the following items to NASA/GSFC. The deliverables include but may not be limited to: 1) Clock tree synthesis data, 2) SDF backannotation data, 3) Prototype units (10-50), and (4) Production units (50-100/yr). Multiple deliveries may be required depending on whether the initial delivery fully meets the mandatory specification and statement of work. All potential offerors shall have the capability to meet or exceed the following requirements: 1) Deliver feature size of 0.35 micron or better CMOS process. The process shall support operating voltage of 3.3V (external/internal ) orbetter and operating temperature in range of 00C to 700C. 2) Deliver tools and libraries for Foundry-Independent Rad-Hard ASIC development. Also, shall have the testing capability for radiation hardness. 3) Deliver Gate Array/Standard Cell implementation with the capability of area-efficient memory cells, compilable, fully diffused large memory blocks, and CPU cores such as R3000. 4) Deliver Die size in the range of 50K usable gates to 1M usable gates. 5) Deliver packaging which include: Dual In-Line Package (DIP), Plastic Ball Grid Array (PBGA), Ceramic Ball Grid Array (CBGA), Plastic Quad Flat Pack (PQFP), Ceramic Quad Flat Pack (CQFP), Plastic Grid Array (PGA), Plastic Leadless Chip Carrier (PLCC), and TAB bonded PQFP. 6) The design environment shall support Design for Testability (DFT) methodologies including ATPG, full or partial scan, boundary scan (JTAG compliance with IEEE 1149.1), and built in self-test (BIST). The anticipated release date of RFP/RFO is on or about March 2, 1998. The SIC is 3571. All qualified responsible sources may submit a proposal which shall be considered by the agency. The solicitation and any documents related to this procurement will be available over the Internet. These documents will be in Microsoft Office Suite (Word 6.0, Excel 5.0, or PowerPoint 4.0) format and will reside on a World-Wide Web (WWW) server, which may be accessed using a WWW browser application. The WWW address, or URL of the NASA/GSFC Business Opportunities page is http://procurement.nasa.gov/EPS/GSFC/class.html. Prospective offerors shall notify this office of their intent to submit an offer. It is the offeror's responsibility to monitor the aforementioned Internet site for the release of the solicitation and amendments (if any). Potential offerors will be responsible for downloading their own copy of the solicitation and amendments (if any). Any referenced notes can be viewed at the following URL: http://genesis.gsfc.nasa.gov/nnotes.htm. (0044)

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