Commander, U.S. Army Aviation and Missile Command, Acquisition Center, Aviation & Missile RDEC Directorate, Redstone Arsenal, AL 35898-5275

A -- ELECTRONIC CIRCUIT BOARD MANUFACTURING DEVELOPMENT CENTER SOL DAAH01-98-R-RB01 DUE 041798 POC (RDPC) Deidra Barnes, Contract Specialist, AMSAM-AC-RD-BA, (205)876- 3139, or Harold Smith, Contracting Officer, (205)876-0908. Synopsis Number: R013-98. (PART 1 OF 3) The Missile Research, Development, and Engineering Center, AMCOM, is seeking interested parties for the establishment of an Electronic Circuit Board Manufacturing Development Center, hereafter referred to as "the Center". The purpose of the Center will be to strengthen the U.S. Printed Circuit Board (PCB) industry (including U.S. industries that support it, such as the circuit board equipment fabrication industry, tooling and materials suppliers) and its ability to support military needs through an integrated program of research, education, and industrial extension. The program will conduct research and development programs within industry and academic facilities. The Center will serve as the focus for the Department of Defense (DOD) to work with the U.S. electronics industry in evaluating new design and manufacturing technologies for both commercial and military requirements prior to adoption by PCB manufacturers. REQUIREMENTS: This BAA is soliciting proposals for a cooperative agreementwith a not for profit organization for the establishment, organizational structure, and management of the Center. The technical work will be problem driven to reflect the current and future U.S. industry and military needs in PCB manufacturing which affect the national economy. This work will include at least the following thrust areas: 1) High density, low cost printed circuit interconnections. 2) Design for manufacturability/sustainment. 3) Next generation PCB manufacturing equipment including process improvements. 4) Electrical test and inspection. 5) Reliability. 6) Material characterization/exploitation of existing materials. In addressing these thrust areas and the operation of the Center, candidate proposals must identify and outline how the following requirements will be satisfied: 1. The Center will be managed by a not-for-profit organization. The organizational approach shall be such that it promotes industry cooperation and contribution in the execution of the Center mission. For example, the Center may be configured as a consortium, executed through a cooperative research agreement, or other similar organizational construct. 2. All proposals shall provide an organizational plan that will outline the Center organization and operation, and will include a graphical representation of the hierarchy, structure, and interfaces between different elements of the organization. Suggestions for alternate names for the Center and facility are requested. 3. The proposal shall detail the facility plans. The facility for the Center will allow for the demonstration of the capabilities of new equipment, techniques, and processes with respect to their application in PCB manufacturing, but not so cumbersome that its operation and maintenance in itself leads to inordinate funding requirements. The proposal shall examine the benefits and aspects of a near-virtual Center implementation, and detail the facility implementation strategy for the Center. The proposer should examine the possibility of a phased approach to facility implementation. It is envisioned that the Center should consider "hands on" technology transfers, access to resident Center experts, and sharing of resources for research and limited production (Demonstration Factory). The Center's facilities shall be located in Northern Alabama. 4. Technology transfer/deployment shall be integrated within each project. Technology transfer will not simply be the demonstration of a technology at the conclusion of the project. Implementation of the technology developed into organizations other than the Center should be considered the goal. Participants in projects should be chosen in part based on willingness and ability to incorporate developed technology into their production lines. The education and training program and a demonstration factory should be elements of the technology transfer process. Training and education functions should be self-sustaining from a business perspective. The Center shall sponsor and/or support, where applicable (or where needed), seminars, conferences, workshops, and short courses, which provide state-of-the-art information and technology transfer in PCB manufacturing. 5. Proposals should address the needs of current industry consortiums in the area of PCB manufacturing and development. Close ties and integration with U.S. PCB consortiums is necessary.The proposal should consider collaboration with Historic Black Colleges or Universities (HCBUs)/Minority Institutions (MIs) on education and training efforts as well as other aspects of the Center. 6. The Center will identify and evaluate PCB manufacturing technology needs and problems of industry in light of Army/DOD and industry requirements, and propose and conduct programs that will address these needs and problems. The process proposed for developing a compelling research agenda for the Center should show past experience and projected plans as to how the following requirements will be satisfied: a.How linkages will be established between the Center, Army/DOD, and industry programs. b. How the products and results will reduce cost and lead time, improve reliability,meet environmental concerns, reduce the risk of transition to production, and promote military and commercial integration of technologies ("Dual-Use"). c. How the process for developing the programs and projects agenda will blend a mix of visionary projects with process hardening efforts and deployment activities. d. Defines how involvement and participation by government acquisition managers takes place when establishing and executing programs. Benefits of the work accomplished must support defense systems and the competitiveness of the PCB industry. (CONTINUED) (0063)

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