Commander, U.S. Army Aviation and Missile Command, Acquisition Center, Aviation & Missile RDEC Directorate, Redstone Arsenal, AL 35898-5275

A -- ELECTRONIC CIRCUIT BOARD MANUFACTURING DEVELOPMENT CENTER SOL DAAH01-98-R-RB01 DUE 041798 POC (RDPC) Deidra Barnes, Contract Specialist, AMSAM-AC-RD-BA, 205-876- 3139, Harold Smith, Contracting Officer, 205-876-0908, Synopsis Number R013-98. (PART 2 OF 3) 7. The proposed organizational structure and agenda should incorporate an industry, government, and academic partnership. Activities undertaken can be performed through or by any of these organizations. It is envisioned that a majority of the work would be performed through industry and academia partners. A joint industry-government approach to cost and resource sharing is encouraged on projects undertaken. AMCOM funding provided should be leveraged by funds and "in-kind" support provided by industry or other organizations. Projects initiated through the Center will be required to achieve >1:1 average (other sources to government) cost sharing/leveraging over all funded projects for first two years. Beginning the third year of operation, a ramp up to >3:1 average (other sources to government) cost share/leveraging is desired. Upon initiation, the Center's planning and implementation measures should begin to move towards self-sufficiency. 8. The organizational and operational structure must be such that it can respond quickly and positively to changes in requirements and funding. The Center shall provide for the ability to attain and apply human, facility, and funding resources to quickly and effectively address technical and productivity problems experienced by the PCB manufacturing industry. Part of the Center mission will be to incorporate a rapid response process. This process will allow the identification of short-term (6-18 month) projects that meet urgent needs for one or more weapon systems or immediate and critical industry requirements. To facilitate these projects, a streamlined process for evaluation, approval, and execution of projects should be proposed. 9. The proposal should show past experience and proposed future mechanisms for leveraging program funding through linkages with organizations such as Defense Advanced Research Projects Agency (DARPA), National Institute of Standards and Technology (NIST), DOD/Department of Energy Labs, consortia, etc. 10. User friendly, easily accessed databases of best practices, technical literature (domestic and foreign), and reports of the Center sponsored programs and projects in PCB manufacturing shall be developed and maintained for both public and private use. The Center shall consider an active program of industrial extension and distance learning including web-based access to aid the competitiveness of small PCB manufacturers. CRITERIA: The following is the Proposal's evaluation criteria: (NOTE Items 1 through 3 are in descending order of importance, with item 3 being significantly less important than items 1 and 2). The subcriteria under 1 through 3 are shown in descending importance.(CONTINUED) (0063)

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