NASA/Langley Research Center, Mail Stop 144, Industry Assistance Office, Hampton, VA 23681-0001

66 -- SHEAR STRESS AND PRESSURE SENSOR SYSTEMS SOL SS291 DUE 052698 POC Linda P. Fitzgerald, Procurement Analyst, Phone (757)-864-2461, Fax (757) 864-7898, Email L.P.FITZGERALD@larc.nasa.gov WEB: Click here for the latest information about this notice, http://nais.nasa.gov/EPS/LaRC/date.html#SS291. E-MAIL: Linda P. Fitzgerald, L.P.FITZGERALD@larc.nasa.gov. NASA/LaRC is hereby soliciting information for potential sources to provide Item 1)18 units of 6-integrated sensor cluster on a flexible polyimide tape substrate of 1 Cm x 1 Cm. The cluster consists of MEMS type sensors for measurements of pressure, shear stress, temperature, and electrical lines with contact pads. See specifications below. 2) 2 units of 15.24 Cm x 45.72 Cm (6" x 18") polyimide sheet with 3 units of the 6-integrated sensor cluster placed on each sheet. Detailed specifications for the each 6-integrated sensor cluster locations will be provided with 2 NASA-provided polyimide sheets of 15.24 Cm x 45.72 Cm. The polyimide sheet with the 3 units of the 6-integrated sensor cluster interfaces to an ASIC device described in Item 3. 3) 20 customized ASIC (Application Specific Integrated Circuit) interfacing electronic circuits for the 6-integrated sensor cluster. The ASIC will receive inputs from the shear stress, pressure, and temperature sensors. The ASIC maintains the temperature of the shearstress sensor resistors at a constant value. Outputs of the ASIC will be fed into the subsequent circuits for multiplexing, A/D conversion, signal processing, and control. 4) 6 units of electronic circuit board for data acquisition and control for the 6-integrated sensor clusters. The board consists of the ASIC's, multiplexers, A/D converters, and a microprocessor or microcontoller. 5) 2 units of fully integrated operational systems. The fully integrated system consists of 3 units of the 6-integrated sensor cluster on the provided polyimide sheet and interfacing electronic circuit board for data acquisition and control. Also provide software/firmware, operational instruction, and laboratory test data. Further details will be provided as needed. Specifications: For Items #1 and #2 -- The 6-integrated sensor cluster consists of a total of 6 sensors: 2 pressure sensors, 2 shear stress sensors, and 2 temperature sensors, which constitutes an array of 2x3 sensor on a flexible polyimide sheet of 1Cm x 1 Cm. Thepolyimide sheet also has built-in electrical lines for power and data transfer and interconnecting pads for electrical connections. The pressure sensors are MicroElectroMechanical Systems (MEMS) type with a piezoresistive bridge diffused on the sensing diaphragm for absolute pressure measurements from 600 mbar to 2500 mbar with maximum total error band of 0.1% of full-scale output. The shear stress sensors are MEMS based thermal type sensors whose sensing element of solid state resistor is insulated by a vacuum chamber located under the sensing resistor. Accuracy of the shear stress sensors should be better than +/- 2% of full-scale output. The resistance of the shear stress sensors should be close to 2,000 Ohms, and the shear stress sensors shall not have a common ground. The temperature sensors are solid state type and will be located next to the shear stress sensors. Operational temperature of the cluster sensors ranges from -10C to +75C. Maximum polyimide sheet with electrical connecting pads for the 6-integrated sensor cluster shall be less than 1 Cm x 1 Cm, and the 6-integrated sensor array area shall be less than 1 mm x 3 mm. A total thickness of the 6-integrated sensor cluster with the polyimide sheet shall be less than 100 micrometers. Surface variation of the 6-integrated sensor cluster will be less than 20 micrometers. The 6-integrated sensor cluster on 1 Cm x 1 Cm polyimide sheet is flexible to accommodate surface curvature of 6.35-mm (0.25") radius. Item 3 -- Each ASIC device is packaged in an industry standard surface mount package form and interfaces to 3 units of the 6-integrated sensor cluster. That is each ASIC interface to 6 shear stress sensors, 6 pressure sensors, and 6 temperature sensors. The interfacing ASIC circuit to the shear stress sensors will adjust its output to zero for zero flow when prompted by the user and maintains a constant temperature of the shear stress sensor's sensing element resistor during the measurements. The interfacing circuits for the pressure and temperature sensors are for the above-mentioned MEMS type sensors. ASIC circuit design codes will be made available in a Tanner Electronic Design Automation Tool platform. The ASIC units shall operate in a temperature range from -10C to +75C. Item 4 -- The board will interface to 3 units of the 6-integrated sensor cluster and provides inputs to a data acquisition processor such as a PC. Detailed data processing and control protocol will be worked out at a later date. The board will consist of the ASIC's, multiplexers, analog-to-digital converters, and other digital circuits including microprocessor. Control and operational software shall be provided with the board. The board will be in a form of Printed Circuit Board (PCB) with a smallest form factor possible. Further details about the technical requirements on the physical board will be provided at a later date. The Standard Industrial Classification (SIC) code is 3823 with a size standard of 500 employees. No solicitation exists; therefore, do not request a copy of the solicitation. If a solicitation is released it will be synopsized in the CBD and on the NASA Acquisition Internet Service. It is the potential offerors responsibility to monitor these cites for the release of any solicitation or synopsis. Vendors having the capabilities necessary to meet or exceed the stated requirements are invited to submit appropriate documentation, literature, brochures, and references. Responses must include whether you are large, small, small disadvantaged 8 (a), and or woman owned business. Technical questions should be directed to Saeun K. Kahng at 757-864-7553 or e-mail: s.k.kahng@larc.nasa.gov. Procurement questions should be directed to Joan Y. Crepps at 757-864-2521 or e-mail: j.y.crepps@larc.nasa.gov. Please advise if the requirement is considered to be a commercial or commercial-type product. A commercial item is defined in Internet "Note A". [INTERNET ONLY (commercial product definition)] This synopsis is for information and planning purposes and is not to be construed as a commitment by the Government nor will the Government pay for information solicited. Respondents will not be notified of the results of the evaluation. Respondents deemed fully qualified will be considered in any resultant solicitation for the requirement. The Government reserves the right to consider a small business or 8(a) set-aside based on responses hereto. All responses shall be submitted to NASA Langley Research Center, Industry Assistance Office, Mail Stop 144, Hampton, VA 23681. no later than May 26, 1998. In responding reference SS291. Any referenced notes can be viewed at the following URL: http://genesis.gsfc.nasa.gov/nnotes.htm. (0132)

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