Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- MESOSCOPIC INTEGRATED CONFORMAL ELECTRONICS SOL BAA98-28 DUE 082698 POC Dr. William L. Warren, DARPA/DSO, fax (703) 696-3999 MESOSCOPIC INTEGRATED CONFORMAL ELECTRONICS SOL BAA 98-28 DUE 082698 POC Dr. William L. Warren, DARPA/DSO, fax (703) 696-3999 e-mail: baa98-28@darpa.mil URL: http://www.darpa.mil/baa/#dso/. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative research proposals in Mesoscopic Integrated Conformal Electronics (MICE). The goal of MICE is to demonstrate the rapid prototyping and manufacturing of miniaturized and rugged mesoscopic electronics on any surface (Si, glass, plastics, metals, ceramics, etc.) through the 3-dimensional integration of passive components (resistors, capacitors, super-capacitors, inductors, high gain antenna, and interconnects) and active components (batteries, etc.) using a direct-write (mask-less) approach. This solicitation seeks proposals for the development of direct-write machines. The proposed machine should be designed to be a single, compact commercial-off-the-shelf, rapid (hours) prototyping/manufacturing computeraided design/computer aided machine (CAD/CAM) tool that can deposit a wide variety of materials (metals, insulators, ferrites, ruthenates, metals, ferroelectrics, glasses, polymers, etc.) in a 3-dimensional fashion at low-substrate temperatures in a conformal manner on virtually any substrate. A flexible "credit card" sized global positioning system (GPS) will be the application driving the CAD/CAM direct-write tool development. Proposed programs should be no longer than 48 months. More details may be found in the Proposer Information Pamphlet (PIP). Multiple awards are expected. Cost sharing is encouraged, but not required. Substantive cost sharing will increase the attractiveness of proposals. In addition, proposals with cost share will be considered for award under U.S.C. 2371 as an Other Transaction. TEAMING: Proposers are encouraged to team to better address the different technological and scientific aspects in the MICE program. Some areas of expertise include: tool development, device optimization and evaluation, material synthesis (powders/particles), etc. Integrated, collaborative efforts or teaming arrangements among industries, universities, and/or federal and national laboratories with complementary areas of expertise is encouraged. To facilitate potential teaming, proposers may submit a NON-PROPRIETARY one-to-two page "Expression of Interest" letter to include: 1) the area of technical interest to be developed; 2) business and technical points of contact (mailing address, phone number, fax number and email address); and a 3) short summary of the organization's relevant technical expertise and uniqueness. Expression of Interest letters shall be mailed to Attn: BAA 98-28 Letter of Interest, DARPA/DSO, 3701 North Fairfax Drive, Arlington, VA 22203 by 4:00 p.m. ET Wednesday, June 24, 1998. A packet consisting of all expressions of interest will be sent to all respondents by Monday June 29, 1998. FULL PROPOSALS: One (1) original and nine (9) copies shall be submitted. Full proposals shall consist of two volumes: Volume 1 Technical and Volume 2 -- Cost. Volume 1 Technical, maximum of 45 pages, including the special cover sheet, all figures, references, tables, charts, and appendices; Volume 2 Cost, unlimited page count. The technical proposal should be phased as outlined in the PIP. Phase I, the detailed design and proof of concept phase, should not exceed twelve (12) months. The cost proposal should include a resources breakdown by phases and tasks. Details of the proposal format may be found in the PIP. All proprietary material should be clearly marked and will be held in strict confidence. Facsimile transmissions or electronic media transmissions will not be accepted. Separate attachments such as institutional brochures, reprints, disks, or videotapes will be ignored. Proposals not meeting the requirements outlined or provided in the PIP may not be reviewed. Volume 1 -- Technical: The technical proposal shall consist of: (1) Executive Summary (two pages or less); (2) Technical approach section that includes: the perceived need and potential impact on the DoD and industry; the essence of the CAD/CAM direct-write tool; how the proposed CAD/CAM tool advances the state-of-the art and will be able to deposit functional materials at low substrate temperatures in a multi-layered fashion, perceived advantages of the proposed direct-write tool; what is new or novel about the direct-write CAD/CAM direct-write tool, including key challenges and how they will be addressed; the essence of the material precursor (e.g., particle/powder) fabrication process; perceived advantages/uniqueness of the proposed material synthesis process; a discussion of the direct-write battery (ultra-battery) with approaches of how this will be accomplished; technical approach, including key challenges and how they will be addressed; (3) A list of participants and a chart showing development tasks, milestones and funding levels versus time; (4) Plan for the design, materials selection, fabrication and materials and device performance demonstration phases to include technical risk mitigation steps; (5) Time-phased schedule-milestone chart; (6) Organizational structure of the team and management approach; (7) Summary of relevant prior work; (8) Brief description of applicable facilities and equipment; and (9) Short resumes of key individuals. If subcontracting is involved, level of effort, specific roles, key individuals and qualifications should be included. Volume 2 Cost proposals shall contain a summary cost breakdown and a detailed cost breakdown. The summary breakdown should be shown to the level of major tasks and should indicate manpower levels of effort, equipment and supplies, travel, and miscellaneous expenses for the tasks of the entire program, broken out by performer and time. Details of the cost sharing to be undertaken by the offeror must be included in the summary section of Volume 2 of the proposal. All proposals are due by 4:00 p.m. ET, August 26, 1998. Within approximately ten (10) business days of receipt, DARPA will acknowledge receipt of the proposal and assign a control number that should be used in all further correspondence regarding the proposal. EVALUATION OF PROPOSALS: Evaluation of the proposals will be based on the following criteria in decreasing order of importance: 1) The scientific and technical merits of the proposed effort which clearly demonstrates sufficient knowledge of the proposed direct-write fabrication technique and its limitations; an understanding of the direct-write materials behavior; and an understanding of the critical parameters and properties of the proposed active and passive components; 2) The likelihood that the proposed CAD/CAM direct-write tool will provide unique and/or new capabilities of use to the Department of Defense and commercial industry (one-of-a-kind demonstrations that cannot be made into a practical device for use by the military or industry will not be accepted); (3) The qualifications of the principal investigator and other key personnel, and adequacy of equipment and facilities to accomplish the manufacture of the CAD/CAM direct-write tool and testing of the fabricated components; and (4) Realism of cost. GENERAL INFORMATION: Proposers should obtain the Proposal Information Package (PIP), BAA 98-28 for required forms, submission format details and background on these applications. The PIP may be obtained by writing, faxing or e-mailing your request to DARPA/DSO, Attn: BAA98-28, 3701 N. Fairfax Drive, Arlington, Virginia 22203-1714, fax: 703-696-3999, email: baa98-28@darpa.mil. Technical POC is: Dr. William L. Warren, DARPA/DSO. Please reference BAA98-28 in all correspondence. Early submission of proposals is strongly encouraged. Selections for awards may be made at any time during the evaluation process. Proposals will not be returned. Restrictive notices notwithstanding, proposals may be handled, for administrative purposes only, by a support contractor. All support contractors are bound by appropriate non-disclosure requirements. Input on technical aspects of the proposals may be solicited by DARPA from non-Government consultants/experts who are bound by appropriate non-disclosure requirements. Non-Government technical consultants will not have access to proposals that are labeled by the offerors as "GOVERNMENT ONLY." BROAD AGENCY ANNOUNCEMENT: This Commerce Business Daily (CBD) notice itself constitutes the Broad Agency Announcement (BAA) as contemplated by FAR 6.102 (d) (2). A formal RFP or other solicitation regarding this announcement will not be issued. Requests for same will be disregarded. Evaluation and selection of proposals for award will be made to those offerors whose proposal is considered most advantageous to the Government, price and other factors considered. The Government reserves the right to select for award all, some, or none of the proposals received in response to this announcement. Proposals identified for funding may result in a procurement contract, grant, cooperative agreement, or other transaction depending upon the nature of the work proposed, the required degree of interaction between parties, and other factors. The offeror must submit a separate list of all technical data or computer software that will be furnished to the Government with other than unlimited rights (see DFARS Part 227). All responsible sources capable of satisfying the Government's needs may submit proposals that will be evaluated if received by the closing date. Because of the technical breadth implied in this solicitation and hardware demonstration required, no portion of this BAA will be set aside for HBCU and MI participation. However, these organizations are encouraged to apply. (0138)

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