Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- HEAT REMOVAL BY THERMO-INTEGRATED CIRCUITS (HERETIC) SOL BAA 98-32 DUE 111998 POC E. Towe, DARPA/ETO, Fax (703) 696-2206 WEB: http://www.darpa.mil, http://www.darpa.mil. E-MAIL: BAA98-32@darpa.mil, BAA98-32@darpa.mil. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Heat Removal by Thermo-integrated Circuits (HERETIC). The goal of HERETIC is to develop solid-state and fluidic heat removal devices that are integrable with advanced electronic and photonic devices in high-performance systems. The primary interest is in devices that can be integrated with electronic and optoelectronic chips fabricated from common semiconductor materials. There have been a number of recent developments in the understanding of heat transport and phonon engineering in solid-state and fluidic systems. Concomitant with these developments, there has also been an emergence of a number of engineering concepts that could be applicable to the design and fabrication of novel heat removal devices. These concepts include, but are not limited to: band-gap engineering in (quantum) heterostructures; thermionic emission of hot electronic carriers over energy barriers; vectored, dynamic single-phase synthetic micro-jets; and fluid flow and circulation in micro-channels. Any solid-state cooling devices designed and fabricated using the concepts above should be amenable to integration with electronics or optoelectronics. An example of a fluidic device that could be integrated with electronics is a micro-jet: piezo-electrically actuated single-phase micro-jets that can vector airflow over hot devices can help global air circulation in electronic systems. Arrays of these jets can be localized over particular electronic devices and turned on and off whenever needed. Other novel solid-state or fluidic heat removal devices not mentioned above, but that can clearly be integrated with electronic devices, are solicited. The new breed of devices for thermal management is envisioned to bring about new benefits and higher levels of performance to electronic and optoelectronic systems. It is anticipated that they will exploit recent advances in micro-fabrication technology; the advances include, but are not limited to developments in micro-machining, heterogeneous materials integration, and epitaxial synthesis of the relevant materials. DARPA seeks proposals which embrace all of the following areas: (1) device development, (2) integration and packaging, (3) modeling and simulation, and (4) focused system demonstrations. Proposers are encouraged to develop credible quantifiable metrics to assess the cooling capability and efficiency of their devices, and systems. Proposed efforts should last no longer than thirty-six (36) months in duration. PROGRAM SCOPE: Awards totaling approximately $20 million over three years are expected to be made during the first half of calendar year 1999. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Dr. Elias Towe, etowe@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 98-32, Heat Removal by Thermo-integrated Circuits (HERETIC), Proposer Information Pamphlet" which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and six (6) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 98-32) on or before 4:00 p.m., local time, Monday, October 19, 1998. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and six (6) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 98-32) on or before 4:00 p.m., local time, Thursday, November 19, 1998, in order to be considered. This notice, in conjunction with the BAA 98-32 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in Heat Removal by Thermo-integrated Circuits (HERETIC). All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 98-32. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific andtechnical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 98-32), Electronic Mail: BAA98-32@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 98-32, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. Posted 09/16/98 (W-SN250541). (0259)

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