ADHESION STUDIES Sandia National Laboratories has conducted leading edge studies of the adhesion and associated interfacial issues in actual bonding for mfg. and research applications using modeling and fracture mechanics in conjunction with fundamental adhesion/interface studies to understand the nature of the adhesive bond. Development of finite element code to predict adhesion failure. JKR apparatus, dynamic and static contact angle equipment, fracture mechanics measurement techniques, imaging apparatus with micron level and 30 frames/sec recording capabilities, techniques for measuring highly filled polymer flow and cure in thin gap (10 microns) structures, dynamic mechanical analyzer, thermal analysis techniques. Important applications include: Electronic packaging/underfill industry. Adhesives, encapsulant, and sealant formulators. Bonding applications in general manufacturing. Polymers on high modulus materials (i.e. Metals). Potential Benefits Development of new adhesives with enduring, reliable interface via a fundamental understanding of the interphase region and material curing. Improved understanding of behavior requirements of highly filled epoxies used in flip chip underfill by the packaging industry. Demonstrated Achievements Developed tools for use in characterizing flow of underfill materials, and for testing adhesive joints at an electronics-packaging manufacturer. Led a nation-wide team in the development, testing, and specification of lead-free polysulfide sealant replacements. References Invited participant in DoD, SAE G8 and G9, coating and sealing groups, SEMATECH Liquid encapsulation program, Minnowbrook Conference. Follow-up This proprietary Sandia capability may be applied to solve challenging problems in the field of polymer and other organic sciences. Sandia has the flexibility to form specific teams of technical experts from any or all of the above capabilities to focus expertise on specific technical challenges. We are interested in making this technology available to companies responsive to partnering with Sandia to develop near/term and/or future applications via licensing or cooperative development agreements. For further information, please respond by mail or fax to Joanne Trujillo no later than December 22, 1998 at: Sandia National Laboratories, MS 1380, P. O. Box 5800, Albuquerque, New Mexico 87185-1380. Fax: (505) 843-4163. Please indicate the date and title of this CBD notice. E-MAIL: Joanne Trujillo, jmtruji@sandia.gov. Posted 12/08/98 (W-SN278369).

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