Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- ADVANCED LITHOGRAPHY SOL BAA 99-14 DUE 032299 POC D. Patterson, DARPA/ETO, Fax (703) 696-2206 WEB: http://www.darpa.mil, http://www.darpa.mil. E-MAIL: BAA99-14@darpa.mil, BAA99-14@darpa.mil. PROGRAM OBJECTIVES AND DESCRIPTION: The goal of the DARPA Advanced Lithography research program is to revolutionize semiconductor lithography through accelerated research of highly innovative technical approaches that will enable pattern transfer to wafers of features of 100 nm and below. The solutions sought should be highly innovative, and compatible with future manufacturing at exposure rates in excess of one sq cm/sec. DARPA is soliciting proposals for research and development to understand and overcome specific technological obstacles to the realization of lithography for 100 nm critical dimensions and smaller and the supporting technologies relevant to more than one lithography technology option. Preference will be given to lithography approaches that extend to the smallest critical dimensions and to supporting technologies that are applicable to the largest number of lithography technologies. As part of this program, DARPA will support component prototyping as opposed to integrated machine prototyping, thus the program will focus on solving critical problems that will enable machine prototyping by industry at a future time. It is anticipated that awards to industry would include cost sharing of 1X to 2X the DARPA investment. Teaming and partnerships are encouraged. Cost sharing by universities and nonprofits is encouraged but not required. In all areas, modeling will be used to identify problem areas and accelerate solutions. Evolutionary improvements to the present state-of-practice will not be considered. DARPA seeks innovative proposals in the following areas: (1) Lithography: 100 nm and Below; and (2) Lithography Support and Cross-Cutting Technologies. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 99-14 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. Three year programs are encouraged. The technical POC for this effort is Dr. David Patterson, fax: (703) 696-2206, electronic mail: dpatterson @darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet titled "BAA 99-14, Advanced Lithography, Proposer Information Pamphlet" which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and nine (9) copies of the proposal abstract must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-14) on or before 4:00 p.m., local time, Friday, January 29, 1999. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original nine (9) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-14) on or before 4:00 p.m., local time, Monday, March 22, 1999, in order to be considered. This notice, in conjunction with the BAA 99-14 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in advanced lithography. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 99-14. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. Factor 2 includes a preference for lithography approaches that extend to the smallest critical dimensions and to supporting technologies that are applicable to the largest number of lithography technologies. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 99-14); Electronic Mail: BAA 99-14@darpa.mil; Mail: DARPA/ETO, ATTN: BAA 99-14, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. Posted 12/21/98 (W-SN282212). (0355)

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