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COMMERCE BUSINESS DAILY ISSUE OF MARCH 12,1999 PSA#2301Lockheed Idaho Technologies Company, P.O. Box 1625, Idaho Falls, ID
83415-3521 A -- RAPID SOLIDIFICATION PROCESS FOR POLYMER MEMBRANES, COATINGS AND
FILMS SOL Cbd0999 DUE 041199 POC Paul Grahovac WEB: Idaho National
Engineering & Environmental Laboratory,
http://www.inel.gov/procurement/litco/index.htm. E-MAIL: Paul Grahovac,
pg2@inel.gov. A -Rapid solidification process for polymer membranes,
coatings and films. U. S. Patent Number 5,252,212. This is a potential
technology development and licensing opportunity with Lockheed Martin
Idaho Technologies Company (LMITCO), the prime operating contractor
for the Department of Energy at the Idaho National Engineering and
Environmental Laboratory (INEEL). Polymer applications of the rapid
solidification process ("RSP Polymers") creates a plume of nebulized
polymer droplets. This results in production of asymmetrical polymer
membranes capable of withstanding high temperatures and harsh chemical
conditions. Also, polymers which cannot readily be dissolved in
solvents can be sprayed, and polymer systems normally sprayed with
solvents can be sprayed without them -- using RSP Polymers. This is an
important environmental benefit due to the severe reduction in VOC
(volatile organic compound) emissions associated with spraying paints
and enamels. RSP Polymers can also be manipulated to control the
deposition and solidification of any polymer film. Due to the uniform
droplet size distribution in the plume produced by the process,
consistent film thickness and spatially uniform film physical and/or
chemical properties are achieved. The RSP Polymers coating capabilities
provide precise control of the process, and the deposits which result
have relatively low porosity -- due to the low gas pressure used in the
process and corresponding low droplet velocity. Particularly, using
pressures in the range of about 14-26 psi absolute, normalized to one
atmosphere, low droplet velocity results in gentle droplet impact
conditions at the substrate surface and low gas entrapment. RSP
Polymers provides an improved method of spraying polymers having
predetermined characteristics useful as semipermeable membranes for
separating a wide variety of materials. The process allows application
of very thin or otherwise delicate films or membranes onto strength-
providing substrates, including mesh, and porous and non-porous
substrates. LMITCO is seeking a written indication of interest from
industry partners interested in funding a collaborative technology
development project and /or entering into a license agreement for the
purpose of developing and commercializing this technology. License
terms will include an up-front licensing fee and a running royalty
based on a percentage of sales. This is not an opportunity to provide
goods or services to LMITCO or the Department of Energy. This Request
for Interest (RFI) will close to response 30 days after publication.
Interested parties should send e-mail to pg2@inel.gov (Paul Grahovac,
Account Executive, Technology Transfer Office, LMITCO). If you do not
have e-mail access, send regular mail to Paul Grahovac, Account
Executive, Technology Transfer Office, LMITCO, P. O. Box 1625, Idaho
Falls, ID 83415-3805. Posted 03/10/99 (W-SN306981). (0069) Loren Data Corp. http://www.ld.com (SYN# 0013 19990312\A-0013.SOL)
A - Research and Development Index Page
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