WIRLESS TELEMETRY TECHNOLOGY FOR MEDICAL APPLICATIONS Lockheed Martin Energy Research Corporation (LMER), the management and operating contractor for the United States Department of Energy's Oak Ridge National Laboratory (ORNL), is seeking expressions of interest from companies interested in licensing and commercializing ORNL's wireless telemetry technology for medical applications. ORNL has developed intellectual property in the technology area of radio frequency telemetry, which is applicable to the field of wireless medical telesensors. A major requirement for the successful implementation of large-scale, low cost medical telesensing arrays for fixed facilities, mobile facilities or vehicles, and individuals is the development of a robust, cost-efficient architecture to support the intelligent wireless networking of advanced sensors (for example, vital signs sensors). Spread-spectrum systems offer the flexibility of license-free operation in several distinct frequency bands and facilitate high data rates with high link integrity (low error rates), evenin the presence of significant multipath effects and interfering signals. ORNL is pursuing the development of specialized high-performance wireless systems with advanced circuitry and signal-processing methods which combine improved multipath-rejection capabilities for difficult applications (e.g., highly reflective environments or non-line-of-sight links) with "smart" (autoreconfiguring) radio-frequency (RF) network operation and wireless linking of sensor arrays of diverse types. ORNL has developed numerous RF signal transmission systems for both analog (video) and high-speed digital data for operation in both benign and hostile environments, at frequencies ranging from high frequency to millimeter-wave and employing advanced coding and modulation methods. ORNL has recently designed and successfully tested two high-speed, low-power, programmable, spread-spectrum, multi-channel, "smart sensor" application specific integrated circuits (ASICs) using a standard commercial 0.5-micron complementary metal-oxid semiconductor chip process. The prototype ASICs measure temperature. The technology transfer process will be facilitated through appropriate licensing of LMER's intellectual property and associated research and development undertaken cooperatively between LMER and the licensee and funded by the licensee. Research and development will focus on transitioning the technology from the current laboratory demonstration stage to commercialization. Interested companies with experience and expertise commensurate with the requirements of this commercialization effort are invited to respond to this announcement. Companies interested in this opportunity may obtain more detailed technical information and a description of the licensing and cooperative research and development process by submitting a statement of interest, including a written description of their company and its activities and an explanation of their potential application of the technology. One-page expressions of interest should be received by April 28, 1999. It is anticipated that a formal request for proposals will be available by May 7, 1999. No licensing intermediaries please. This is not a procurement activity. E-MAIL: Click here to contact the contracting officer via, vanderhoofgs@ornl.gov. Posted 04/21/99 (W-SN322811).

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