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COMMERCE BUSINESS DAILY ISSUE OF JUNE 29,1999 PSA#2377

Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- RADIO FREQUENCY LIGHTWAVE INTEGRATED CIRCUITS (R-FLICS) SOL 99-27 DUE 100199 POC Dr. Robert F. Leheny, DARPA/MTO, FAX (703) 696-2206 WEB: http://www.darpa.mil/, http://www.darpa.mil/. E-MAIL: baa99-27@darpa.mil, baa99-27@darpa.mil. The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Radio-Frequency Lightwave Integrated Circuits (R-FLICS) to develop and demonstrate lightwave technologies for RF analog signal distribution and processing. The proliferation of systems operating over an increasingly broad range of the RF spectrum, extending from a few hundred Megahertz up to and beyond a hundred Gigahertz, has created a significant challenge to provide efficient, compact and lightweight components capable of very broadband operation to manage and control these systems within the analog signal domain. Lightwave technologies are helping to meet these challenges in applications where imposing the RF signal onto a lightwave carrier can take advantage of the very broadband, lightweight, low loss properties of optical fiber for use in transmission links. In addition, once the signal of interest is in the optical domain, chip-scale lightwave modules offer the possibility for efficiently realizing complex signal processing applications over very broad RF bandwidths. The goal of the R-FLICS program is to develop and demonstrate how recent advances in lightwave technologies and further innovative extensions can substantially improve the effectiveness for use of chip-scale lightwave components in military RF systems. The proposed research should investigate innovative approaches that enable revolutionary advances in science, devices or systems. Specifically excluded is research that primarily results in evolutionary improvement to the existing state of practice. This DARPA program will build on advances in chip-scale lightwave device technologies to develop and demonstrate how these advances can lead to revolutionary new system concepts and resulting capabilities. Two key elements in RF-Lightwave technology will be addressed. The development and demonstration of RF-Lightwave transmitter and receiver modules that enable link performance to achieve zero net RF loss or better (RF gain) from RF input to RF output. Components for these applications that can be shown to be low cost to manufacture are of greatest interest. A second thrust will seek to develop and demonstrate enhanced performance capabilities for RF systems enabled by on-chip integration of lightwave and RF technologies to achieve more complex RF functionality in routing, controlling, and processing analog signals in the 0.5-50 Ghz range. Attainment of R-FLIC program goals will greatly enhance and expand the application of lightwave technology for military RF systems including antenna remoting, antenna beam forming (scanning, null scanning and multifunctional shared apertures), signal synthesis, frequency conversion and channelization, as well as very wideband remote processing. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 99-27 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: The R-FLICS program will have two major thrusts: Thrust I. This thrust will incorporate the design, development and demonstration of chip-level components enabling high performance RF-Lightwave point-to-point links. While this thrust will support very innovative individual investigator efforts, teaming of component researchers, manufacturers and systems/subsystems integrators is strongly encouraged to insure that technologically innovative designs are both manufacturable and can meet specific systems needs. Thrust II. This thrust will incorporate the design, development and demonstration of chip-scale lightwave modules that exploit the broadband capability of lightwave technology. The main focus of this thrust will be the demonstration of chip-scale RF-Lightwave microsystems that can substantially enhance the performance of military RF systems. To meet this objective, teaming between component researchers and manufacturers (technology suppliers) and systems/subsystems integrators (technology users) is strongly encouraged. While the main focus of this thrust will be on the development of the chip-scale modules, the systems integrator role is anticipated to lead in the definition of modules performance goals and to provide focus and evaluation for the effort of component researchers and manufacturers. It is anticipated that a typical effort will include an initial design phase to define the military applications and systems benefits to be derived from RF-lightwave integration followed by the main effort, a broadly-based research phase focused on development of prototype R-FLIC modules for proof-of-principal demonstration. For both thrusts, offerors must be capable of demonstrating the technology developed under the program for military applications. The proposed scope of the program does not include field insertion but rather is limited to prototype demonstration. However, offerors are encouraged to propose high payoff insertion demonstrations as a program option. Awards totaling approximately $30 million over four years are expected to be made during the second half of calendar year 1999. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Robert Leheny, fax: (703) 696-2206, electronic mail: rleheny@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 99-27, Radio-Frequency Lightwave Integrated Circuits (R-FLICS), Proposer Information Pamphlet" which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and eleven (11) copies of the proposal abstract must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-27) on or before 4:00 p.m., local time, Friday August 6, 1999. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and eleven (11) copies of the full proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-27) on or before 4:00 p.m., local time, Friday, October 1, 1999, in order to be considered. This notice, in conjunction with the BAA 99-27 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in R-FLIC technologies. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 99-27. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other relatedinformation that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/MTO, BAA 99-27), Electronic Mail: BAA99-27@darpa.mil, Mail: DARPA/MTO, ATTN: BAA 99-27, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. Posted 06/25/99 (W-SN347138). (0176)

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