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COMMERCE BUSINESS DAILY ISSUE OF JUNE 29,1999 PSA#2377Defense Advanced Research Projects Agency (DARPA), Contract Management
Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714 A -- RADIO FREQUENCY LIGHTWAVE INTEGRATED CIRCUITS (R-FLICS) SOL 99-27
DUE 100199 POC Dr. Robert F. Leheny, DARPA/MTO, FAX (703) 696-2206 WEB:
http://www.darpa.mil/, http://www.darpa.mil/. E-MAIL:
baa99-27@darpa.mil, baa99-27@darpa.mil. The Defense Advanced Research
Projects Agency (DARPA) is soliciting research proposals in the area of
Radio-Frequency Lightwave Integrated Circuits (R-FLICS) to develop and
demonstrate lightwave technologies for RF analog signal distribution
and processing. The proliferation of systems operating over an
increasingly broad range of the RF spectrum, extending from a few
hundred Megahertz up to and beyond a hundred Gigahertz, has created a
significant challenge to provide efficient, compact and lightweight
components capable of very broadband operation to manage and control
these systems within the analog signal domain. Lightwave technologies
are helping to meet these challenges in applications where imposing the
RF signal onto a lightwave carrier can take advantage of the very
broadband, lightweight, low loss properties of optical fiber for use in
transmission links. In addition, once the signal of interest is in the
optical domain, chip-scale lightwave modules offer the possibility for
efficiently realizing complex signal processing applications over very
broad RF bandwidths. The goal of the R-FLICS program is to develop and
demonstrate how recent advances in lightwave technologies and further
innovative extensions can substantially improve the effectiveness for
use of chip-scale lightwave components in military RF systems. The
proposed research should investigate innovative approaches that enable
revolutionary advances in science, devices or systems. Specifically
excluded is research that primarily results in evolutionary improvement
to the existing state of practice. This DARPA program will build on
advances in chip-scale lightwave device technologies to develop and
demonstrate how these advances can lead to revolutionary new system
concepts and resulting capabilities. Two key elements in RF-Lightwave
technology will be addressed. The development and demonstration of
RF-Lightwave transmitter and receiver modules that enable link
performance to achieve zero net RF loss or better (RF gain) from RF
input to RF output. Components for these applications that can be shown
to be low cost to manufacture are of greatest interest. A second thrust
will seek to develop and demonstrate enhanced performance capabilities
for RF systems enabled by on-chip integration of lightwave and RF
technologies to achieve more complex RF functionality in routing,
controlling, and processing analog signals in the 0.5-50 Ghz range.
Attainment of R-FLIC program goals will greatly enhance and expand the
application of lightwave technology for military RF systems including
antenna remoting, antenna beam forming (scanning, null scanning and
multifunctional shared apertures), signal synthesis, frequency
conversion and channelization, as well as very wideband remote
processing. Additional information on these technology areas is
provided in the Areas of Interest section of the BAA 99-27 Proposer
Information Pamphlet referenced below. PROGRAM SCOPE: The R-FLICS
program will have two major thrusts: Thrust I. This thrust will
incorporate the design, development and demonstration of chip-level
components enabling high performance RF-Lightwave point-to-point links.
While this thrust will support very innovative individual investigator
efforts, teaming of component researchers, manufacturers and
systems/subsystems integrators is strongly encouraged to insure that
technologically innovative designs are both manufacturable and can meet
specific systems needs. Thrust II. This thrust will incorporate the
design, development and demonstration of chip-scale lightwave modules
that exploit the broadband capability of lightwave technology. The main
focus of this thrust will be the demonstration of chip-scale
RF-Lightwave microsystems that can substantially enhance the
performance of military RF systems. To meet this objective, teaming
between component researchers and manufacturers (technology suppliers)
and systems/subsystems integrators (technology users) is strongly
encouraged. While the main focus of this thrust will be on the
development of the chip-scale modules, the systems integrator role is
anticipated to lead in the definition of modules performance goals and
to provide focus and evaluation for the effort of component
researchers and manufacturers. It is anticipated that a typical effort
will include an initial design phase to define the military
applications and systems benefits to be derived from RF-lightwave
integration followed by the main effort, a broadly-based research phase
focused on development of prototype R-FLIC modules for
proof-of-principal demonstration. For both thrusts, offerors must be
capable of demonstrating the technology developed under the program for
military applications. The proposed scope of the program does not
include field insertion but rather is limited to prototype
demonstration. However, offerors are encouraged to propose high payoff
insertion demonstrations as a program option. Awards totaling
approximately $30 million over four years are expected to be made
during the second half of calendar year 1999. Multiple awards are
anticipated. Collaborative efforts/teaming and cost sharing are
encouraged. The technical POC for this effort is Robert Leheny, fax:
(703) 696-2206, electronic mail: rleheny@darpa.mil. GENERAL
INFORMATION: Proposers must obtain a pamphlet entitled "BAA 99-27,
Radio-Frequency Lightwave Integrated Circuits (R-FLICS), Proposer
Information Pamphlet" which provides further information on areas of
interest, the submission, evaluation, and funding processes, proposal
abstract formats, proposal formats, and other general information. This
pamphlet may be obtained from the World Wide Web (WWW) or by fax,
electronic mail, or mail request to the administrative contact address
given below. Proposals not meeting the format described in the
pamphlet may not be reviewed. In order to minimize unnecessary effort
in proposal preparation and review, proposers are strongly encouraged
to submit proposal abstracts in advance of full proposals. An original
and eleven (11) copies of the proposal abstract must be submitted to
DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.:
BAA 99-27) on or before 4:00 p.m., local time, Friday August 6, 1999.
Proposal abstracts received after this time and date may not be
reviewed. Upon review, DARPA will provide written feedback on the
likelihood of a full proposal being selected and the time and date for
submission of a full proposal. Proposers not submitting proposal
abstracts must submit an original and eleven (11) copies of the full
proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA
22203-1714 (Attn.: BAA 99-27) on or before 4:00 p.m., local time,
Friday, October 1, 1999, in order to be considered. This notice, in
conjunction with the BAA 99-27 Proposer Information Pamphlet,
constitutes the total BAA. No additional information is available, nor
will a formal RFP or other solicitation regarding this announcement be
issued. Requests for the same will be disregarded. The Government
reserves the right to select for award all, some, or none of the
proposals received. All responsible sources capable of satisfying the
Government's needs may submit a proposal which shall be considered by
DARPA. Historically Black Colleges and Universities (HBCUs) and
Minority Institutions (MIs) are encouraged to submit proposals and join
others in submitting proposals; however, no portion of this BAA will be
set aside for HBCU and MI participation due to the impracticality of
reserving discrete or severable areas of research in R-FLIC
technologies. All administrative correspondence and questions on this
solicitation, including requests for information on how to submit a
proposal abstract or full proposal to this BAA, should be directed to
one of the administrative addresses below; e-mail or fax is preferred.
DARPA intends to use electronic mail and fax for correspondence
regarding BAA 99-27. Proposals and proposal abstracts may not be
submitted by fax or e-mail; any so sent will be disregarded. DARPA
encourages use of the WWW for retrieving the Proposer Information
Pamphlet and any other relatedinformation that may subsequently be
provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and
full proposals will be accomplished through a technical review of each
proposal using the following criteria, which are listed in descending
order of relative importance: (l) overall scientific and technical
merit, (2) potential contribution and relevance to DARPA mission, (3)
plans and capability to accomplish technology transition, (4) offeror's
capabilities and related experience, and (5) cost realism. Note: cost
realism will only be significant in proposals which have significantly
under or over-estimated the cost to complete their effort. The
administrative addresses for this BAA are: Fax: (703) 351-8616
(Addressed to: DARPA/MTO, BAA 99-27), Electronic Mail:
BAA99-27@darpa.mil, Mail: DARPA/MTO, ATTN: BAA 99-27, 3701 North
Fairfax Drive, Arlington, VA 22203-1714. This announcement and the
Proposer Information Pamphlet may be retrieved via the WWW at URL
http://www.darpa.mil/ in the solicitations area. Posted 06/25/99
(W-SN347138). (0176) Loren Data Corp. http://www.ld.com (SYN# 0002 19990629\A-0002.SOL)
A - Research and Development Index Page
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