Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- UNCOOLED THERMAL IMAGING SENSORS SOL 99-30 DUE 101899 POC Mr. Raymond Balcerak, DARPA/MTO, FAX (703) 696-2206 WEB: http://www.darpa.mil/, http://www.darpa.mil/. E-MAIL: baa99-30@darpa.mil, baa99-30@darpa.mil. Infrared imaging sensors that operate without cryogenic cooling have the potential to provide the military user with exceptional night vision capabilities packaged in a device of extremely small size, weight, and power. This would significantly reduce the cost and accelerate the implementation of sensors for applications such as targeting, surveillance, and threat warning; and also enable imaging sensors for new platforms such as robotics and micro-air vehicles. However, the performance of uncooled infrared sensors is still inferior to that of cooled sensors. This performance gap limits the number of applications and precludes the widespread use of uncooled infrared sensors in military missions. The objective of this program is to increase the performance of the uncooled infrared sensors to their theoretical limit, providing performance on a par with most of the cooled sensors. To accomplish this goal, research must be focused on the pixel structure, the responsivity loss mechanisms, the electrical andoptical noise sources, the interface of the detector with the readout integrated circuit, and the packaging of the array. The thermal sensitivity objective is less than 10 milli-kelvin with a pixel size less than or equal to 25 micrometers. The general goal for the array size is related to the application. High-performance arrays for long-range systems can be as large as 960x1280 elements, while arrays for micro-sensors may be as small as 240x320 elements. Other performance characteristics to be considered include, but are not limited to, the time constant, power dissipation, dynamic range, uniformity, blooming control, crosstalk, and signal processing. Innovative approaches to reduce the overall cost are also critical, as are unique demonstrations of the new military capability provided by uncooled infrared sensors and their integration with other imaging sensors. Uncooled infrared sensor technology has advanced rapidly in the past few years. Higher performance sensors, electronics integration at the sensor, and new concepts for signal processing are generating new applications and increasing production volume. Uncooled sensors are being considered to replace cooled sensors in some applications, but most importantly, the unique characteristics of the uncooled sensors are spawning novel uses of the technology. Very small, low-power sensors that moderate levels of performance provide are possible with the uncooled infrared technology. In addition, applications such as micro-vehicles and robotics demand an extremely lightweight imaging sensor. These applications provide an impetus for further advances in the technology to provide high performance with smaller optical aperture, power management integral to the sensor, and increased functionality. High-density arrays with small pixels, operating at or near the theoretical limit of uncooled infrared technology, can provide high-performance imaging at a substantially reduced optical aperture. Increased electronic functions provide the capability to compensate for the erratic motion expected from small platforms with minimum stabilization. Low power supplies, integrated with the sensor, enable the deployment of large sensor nets, operating for extended periods of time. The potential to replace cooled sensors in most applications remains a far-reaching goal and provides an opportunity to significantly multiply the number of fielded infrared night sights at substantially reduced life-cycle cost. DARPA seeks innovative proposals in the following areas: (1) high performance uncooled infrared focal plane arrays and (2) demonstrations of unique applications for uncooled imaging sensor technology. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 99-30 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Awards totaling approximately $15 million over three years are expected to be made during the first half of calendar year 2000. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Raymond S. Balcerak, fax: (703) 696-2206, electronic mail: rbalcerak@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 99-30, Uncooled Thermal Imaging Sensors, Proposer Information Pamphlet" which provides further information on high performance uncooled infrared focal plane arrays and demonstrations of unique applications for uncooled imaging sensor technology, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and nine (9) copies of the proposal abstract must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-30) on or before 4:00 p.m., local time, Wednesday, September 1, 1999. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and nine (9) copies of the full proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 99-30) on or before 4:00 p.m., local time, Monday, October 18, 1999, in order to be considered. This notice, in conjunction with the BAA 99-30 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, ornone of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in uncooled thermal imaging sensors. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 99-30. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/MTO, BAA 99-30), Electronic Mail: BAA99-30@darpa.mil, Mail: DARPA/MTO, ATTN: BAA 99-30, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. Posted 07/08/99 (W-SN351741). (0189)

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