Bid Office, SPAWARSYSCEN, Code D21B, 53570 Silvergate Avenue, Bldg. A33, Room 0061, San Diego, CA 92152-5112

59 -- SPECIALIZED SOI SUBSTRATES SOL N66001-99-Q-0156 DUE 091399 POC Purchasing Agent, Angela King, D212, (619)553-5829. Contracting Officer, Sylvia Proffit, D211, (619)553-3292. This is a combined synopsis/solicitation prepared in accordance with the format in the Federal Acquisition Regulation, supplemented with information included in this notice. This solicitation incorporates provisions and clauses at FAR 52.213-4 Terms and Conditions -- Simplified Acquisitions (Other Than Commercial Items) (JUN 1999), and any others that are applicable and in effect through the current Federal Acquisition Circular (FAC) and the Defense Acquisition Circular. It is the contractors responsibility to be familiar with all applicable clauses and provisions. No RFQ will be prepared or made available for distribution. The government intends to award on a sole source basis, an order to IBIS Technology for the following: Qty. 80 each. specialized SOI substrates manufactured through the process of Separation by Ion IMplant of OXygen (SIMOX). The wafers shall conform to the SEMI international standards, M1STD.8-89, for 150 mm polished monocrystalline wafers (675 micrometer thickness), and the ASTM Standards F154 and F523 for wafer inspection. The primary wafer flat shall be 55-60 mm long. The buried oxide layer (BOX) shall be formed through the implantation of oxygen onto the wafer, and result in a 380 +/- 10 nm oxide thickness and a 205nm +/- 5nm silicon layer thickness. The buried oxide shall be continuous, with a buried oxide defect density less than or equal to 0.2/square cm. Surface particle density shall be less than 1/square cm. Surface metal contamination of Ti, Cr, Mn, Fe, Co, Cu, Zn shall be less than a total of 1e11 atoms/square cm as measured by TRXF (total reflectance X-ray Fluorescence). TIR (total indicated reading) shall be less than or equal to 3 micrometers, TTV (total thickness variation) shall be less than or equal to 6 micrometers, Bow shall be less than or equal to 21 micrometers, and warp shall be less than or equal to 50 micrometers. A certificate of compliance and analysis, along with actual surface silicon contour map shall be provided. Wafers will be scribed with a lot identification number and a wafer identification number. Facsimile quotations are acceptable and must be received on or before 12:00 p.m. pst on the closing date. Facsimile quotations may be sent to (619)553-1062. Questions may be directed to Angela King at (619)553-5829, kinga@spawar.navy.mil. The applicable Standard Industrial Classification code is 3674 and the size standard is 500. Note 22 applies, however all offers received within 25 days (in lieu of 45 days) after date of publication of this synopsis will be considered by the government. Contractor Centeral Registration (CCR) is required. CCR information can be found at http://ccr.edi.disa.mil/. Posted 08/25/99 (W-SN372389). (0237)

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