Defense Microelectonics Activity(DMEA), Directorate of Contracting/MEOP, 4234 54th Street, Bldg 620, McClellan AFB, CA 95652-1521

59 -- HYBRID, IC PACKAGING, AND PRINTED CIRCUIT BOARD MANUFACTURING SERVICES BLANKET PURCHASE AGREEMENT (BPA) SOL DMEA 00-006 DUE 010500 POC Kellie Valdez at (916)231-1523 or Jerry Tucker at (916)231-1593 E-MAIL: Contracting Officer, valdez@dmea.osd.mil. The Defense Microelectronic Activity (DMEA) has a requirement to provide microelectronics circuit designs, prototypes, layouts, drawings, and test specifications in support of DOD airborne and ground weapons systems. DMEA has been tasked with supporting the reverse engineering and prototyping of replacements for obsolete microelectronic devices. The objective is to provide form, fit, and functional replacements for the redesigned obsolete/unreliable devices. This responsibility includes the redesign of obsolete and/or unreliable microelectronics devices. It also includes the insertion of advanced technologies into weapon systems. Providing this support for the weapons systems that use the late generations of advanced microelectronics devices requires manufacturing services not readily available within DMEA. 3.1 Hybrid Services: The contractor shall provide the services as defined by each task order to deliver functional hybrid devices to DMEA. The range of services shall include: 3.1.1 Parts Acquisition: The contractor shall purchase all parts required to manufacture hybrids based upon designs provided by DMEA. 3.1.2 Substrate Layout: The contractor shall layout designs provided by DMEA or designs done under paragraph 3.1.1 of this CET. 3.1.3 Substrate Fabrication: The contractor shall manufacture substrates from layouts provided by DMEA or layouts done under paragraph 3.1.2 of this CET. 3.1.4 Hybrid Assembly: The contractor shall assemble hybrids. 3.1.5 Burn-in Testing: The contractor shall perform burn-in testing based upon requirements specifications provided by DMEA. 3.1.6 Electrical Testing: The contractor shall perform electrical testing based upon test specifications provided by DMEA. 3.2 IC Packaging Services: The contractor shall provide the services as defined by each task order to deliver functionally packaged IC devices to DMEA. The range of services shall include: 3.2.1 Package and Lid Acquisition: The contractor shall procure packages and lids based upon the requirements specification provided by DMEA. 3.2.2 Wafer Dicing 3.2.3 Die Packaging 3.2.4 Marking: The contractor shall mark packaged parts based upon the requirements specification provided by DMEA. 3.2.5 Burn-in Testing: The contractor shall perform burn-in testing based upon requirements specifications provided by DMEA. 3.2.6 Electrical Testing: The contractor shall perform electrical testing based upon test specifications provided by DMEA. 3.2.7 Screening (as per Mil-Std-883E or MIL-PRF-38535): The contractor shall screen packaged parts based upon the requirements specification provided by DMEA. 3.3 Circuit Board Services: The contractor shall provide the services as defined by each task order to deliver functional printed circuit boards to DMEA. The range of services shall include: 3.3.1 Board Layout: The contractor shall layout designs provided by DMEA. 3.3.2 Parts Acquisition: The contractor shall purchase all parts required to fabricate printed circuit boards based upon designs provided by DMEA 3.3.3 Artwork Generation: The contractorgenerate the artwork required to fabricate printed circuit boards using layouts provided by DMEA or layouts performed under paragraph 3.3.1 of this CET. 3.3.4 Board Fabrication: The contractor shall fabricate printed circuit boards. 3.3.5 Assembly: The contractor shall assemble printed circuit boards. 3.3.6 Opens/Shorts Testing: The contractor shall perform opens and shorts testing. The BPAs will be established for a period not to exceed 5 years, and will be processed IAW Far Part 13.2 Blanket Purchase Agreements and Far Part 12 Acquisition of Commercial Items. If your company is interested in entering into a BPA with DMEA it is requested your firm provide the following information: A. Pricing IAW the attached schedule, commercial price list and/or catalogs are preferred. B. Describe the Quality Plan in place. C. If proposing to major elements 3.1, 3.2 or 3.3 vendor must be able to perform all sub-elements. D. Verify that the Government Credit Card is or is not acceptable. E. Provide a listing of previous customers include the contract/order number and a point of contact, this information will be used to determine past performance. F. QML certification is desired. G. Provide enough information that explains the products and services that your firm provides to allow for a complete evaluation. H. Identify any FSS/GSA contracts your firm actively holds that can provide the same products and services. I. The contractor must be registered in the Central Contracting Registration Database http://www.ccr2000.com/index.html Posted 12/08/99 (W-SN406891). (0342)

Loren Data Corp. http://www.ld.com (SYN# 0214 19991210\59-0018.SOL)