NASA/George C. Marshall Space Flight Center, Procurement Office, Marshall Space Flight Center, AL 35812

99 -- CADMIUM-ZINC-TELLURIDE ARRAYS DUE 022800 POC Beth W. Ewing, Contract Specialist, Phone (256) 544-0351, Fax (256) 961-0059, Email beth.ewing@msfc.nasa.gov -- Jeffrey S. Jackson, Contract Specialist, Phone (256) 544-8935, Fax (256) 544-9354, Email jeffrey.jackson@msfc.nasa.gov WEB: Click here for the latest information about this notice, http://nais.msfc.nasa.gov/cgi-bin/EPS/bizops.cgi?gr=D&pin=62#1-0-S5-C7 169. E-MAIL: Beth W. Ewing, beth.ewing@msfc.nasa.gov. THIS NOTICE CONSTITUTES AMENDMENT NO. 01 (1-0-S5-C7169) TO THE COMBINED SYNOPSIS/RFQ FOR Cadmium-Zinc-Telluride Arrays. Companies shall acknowledge all amendment(s) in their quote. This notice serves as the official amendment to subject synopsis/RFQ and a written amendment will not be issued. The purpose of this amendment is to add the description as follows: Two Cadmium-Zinc-Telluride working arrays. Each shall consist of a single piece of CdZnTe material, 2-mm thick, bonded to a suitable low-noise readout chip; an application specific integrated circuit (ASIC). Each array will have 16X16 pixels, of pitch 0.38 mm, with an approximate 1-mm wide border surrounding the pixellated area. The readout chip will enable the detector pixels to be clocked out into a suitable computer-based analog to digital converter board (not provided). The units shall be mounted in existing housings to supply necessary voltages, cooling (to -25 C) and vacuum environments. Existing control units will also be utilized. CdZnTe material Spectroscopic grade single crystal material will be used. The vendor will investigate material from various suppliers in addition to the former supplier, eV Products Inc. Samples will be characterized electrically. Infra-red transmission microscopy will be used to identify inclusions (precipitates) and material defects. This technique will be employed in the selection of the starting material. Masks The vendor will fabricate masks for the pixel structure based on dimensional details to be obtained from the ASIC supplier (see below), but nominally on a 380 micron pitch. Gold bond contacts will be fabricated on this scale working with the chip supplier if previous experience exists. An inter-pixel gap approximately 50 microns will be investigated, implying a pixel pad size of around 330 microns. Testing of the detector chips After application of pixel contacts the vendor will test inter-pixel resistance and leakage currents. This is an extensive test phase. This information is to be provided to MSFC around 4 months after receipt of order. Redout (ASIC) The front end (preamplification) sections of the readout chip(s) will be low-noise, with a goal of 30 electrons RMS per pixel, and will contain shaping, peak-level-sensing and multiplexing circuit(s) to enable the pizels to be clocked out into a suitable compter-based analog to digital converter board (not provided by the vendor). This (off-board) read cycle will be initiated by a suitable (on circuit) threshold-selectable, trigger. A Rutherford Appleton Laboratories (RAL) PAC/Shamrock type ASIC system modified for electron sensing, or equivalent, should be used. The full specs and necessary procedures are as follows: Bonding of detectors to the ASIC The vendor will bond the 16X16 pixel detector to the ASIC readout by an appropriate manner to give reliable contacts at the intended operating temperature (-20 C). This wil probably entail some form of direct bump bonding to the CdZnTe array. In the case of the RAL device, additional (wire) bonds will need to be used to link the front end (preamplifier) chip to a separate multiplexer and readout chip. Housing/Packaging The vendor will mount each detector unit on a Peltier cooler unit inside each existing vacuum chamber housing. The vendor will investigate the feasibility of this and perform any modification necessary. The modification of the existing detector boxes will need to address such issues as thermal loads on the existing Peltier coolers. The system packaging is required to be capable of high altitude balloon flight. Thus, it must be reasonably robust and in the case of the detector housing (but not the control unit), be capable of being operated in a vacuum. System tests and specifications Preliminary functional tests of the units will be made by the vendor to determine performance. Greater than or equal to 98% of all pixels should operate reliably at the optimum operating temperature (probably -20 C) with simular gains, resolutions and photopeak efficiency (all within +/-20%). In addition, there is a requirement of 2.5% FWHM enegy resolution at 60 keV, with a goal of 0.6% FWHM, for each active pixel. The due date for receipt of offers is not extended. Companies shall provide the information stated in the synopsis/RFQ posted on the NASA Acquisition Internet Service (NAIS) on 2/28/2000. Documents related to this procurement are available over the Internet and are in Microsoft Office Suite (Word 6.0, Excel 5.0, or PowerPoint 4.0) format and reside on the World Wide Web (WWW) server which may be accessed using a WWW browser application. The Internet site, or URL, for the NASA/MSFC Business Opportunities home page is http://nais.msfc.nasa.gov/cgi-bin/EPS/bizops.cgi?gr=CL&pin=62 Posted 02/14/00 (D-SN425207). (0045)

Loren Data Corp. http://www.ld.com (SYN# 0251 20000216\99-0002.SOL)