Naval Research Laboratory, Code 3220, 4555 Overlook Ave. S.W., Washington, D.C. 20375-5326

66 -- WAFER BONDER SOL N00173-00-R-HA04 POC Hilda R. Abdon, Contract Specialist, Code 3220.HA, (202) 767-0682, Wayne Carrington, Contracting Officer!! E-MAIL: Click Here, ABDON@CONTRACTS.NRL.NAVY.MIL. This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Federal Acquisition Regulation Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. This solicitation, N00173-00-R-HA04 is a request for proposal (RFP). The incorporated provisions and clauses of this acquisition are those in effect for Federal Acquisition Regulation (FAR) and Federal Acquisition Circular 97-08 (excluding 97-07) and for Defense Federal Acquisition Regulation Supplement (DFARS) through Defense Federal Acquisition Regulation 91-13. The small business size standard for this acquisition is 500 employees and the SIC code is 3674. This acquisition is unrestricted. The Naval Research Laboratory (NRL) has a requirement for CLIN 0001, a Wafer Bonder System. The wafer bonder is a tool for fusing two semiconductor or glass wafers together. The wafer bonder tool is to be a versatile piece of equipment designed to produce bonded wafers under a variety of methods and environments. The tool will accommodate substrate sizes ranging from 2" diameter up to 6" diameter, specifically including 4" diameter. Wafers are to bonded in a chamber that can have a controllable environment from high vacuum to atmosphere including inert gases. A variety of wafer bonding techniques will be able to be performed including direct wafer bonding, high pressure bonding, high temperature bonding, and anodic bonding using high voltage as well as any combination of the above. The required instrument shall meet or exceed the following specifications: Unique features required: 1. Very low bond chamber volume: 2.5 liters or less 2. 7000 N contact force 3. Bond chamber vacuum capability of 7.5 x 10-6 torr. 4. Wafer separation thickness of less than 50 micrometers. 5. Switchable power supply for triple stack anodic bonding. General Specifications: 1. Simultaneous and independent top and bottom wafer heating up to 550 C. 2. High voltage capability for anodic wafer bonding: adjustable between 1-1200 Volts; at least 50 mA current; polarity switchable. 3. Vacuum capability of 7.5 x 10-6 torr. 4. Wafer bonder controller unit for voltage control, temperature control, pressure control, vacuum equipment control and computer interface electronics. 5. Complete computer control of all bonding parameters including voltage control, pressure control, temperature control, and anodic bond parameters. 6. Personal computer with hard drive for storage of boding recipes, control of bonder, and recording of bond parameters. 7. Automatic control of contact force of electrode. 8. Automatic recording of bonding process parameters. 9. Adjustable contact force up to 7000 N with a minimum controllable resolution of 7 N. 10. Complete and continuous display of process parameters including temperature profile, bond current with resolution of 200 microamps up to 50 mA or 20 microamps up to 5 mA, bonder controller interface inputs and outputs, bonder status. 11. Complete control software for programming commands of all parameters for anodic bonding (including polarity switching), direct bonding, and thermo-compression bonding. Password protection of programmable recipes. Operator adjustable wait commands for bonding parameters. 12. Handling tool for loading and unloading of hot bond tools. 13. Bond tool pedestal to hold bond tool during wafer load and unload. 14. Bond Chuck equipment for 2", 4" and 6" wafers: mechanical alignment of wafers for direct wafer bonding, thermo-compression bonding, and anodic bonding. Will allow wafer contact in vacuum and defined atmosphere. Chuck fabricated from stainless steel. Graphite electrode for anodic bonding with accommodations for center bow. Stainless steel pressure plate for very high pressure thermo-compression bonding and silicon direct bonding without center bow. Separation flags or shims to maintain better than 50 micrometer separation prior to bonding. 15. Vacuum equipment for high vacuum operation: Vacuum equipment controlled by software and computer interface (24V interface desired); turbo molecular pump with control unit; oil free roughing pump including all connectors and valves for evacuation over bypass line/turbo pump and purging of chamber; bypass line with interlock to protect turbo pump from mechanical damage needed for continuous turbo pump operation and fast chamber evacuation; measurement equipment including full range gauge and analog port for bonder control unit to display chamber vacuum, as well as electronic interface for vacuum display on computer. Full documentation of operating instructions, repair/maintenance manual, and schematic drawings must be included. Contractor must provide a standard commercial warranty, including an offer of extended warranty as provided in customary commercial practice. The contractor will be required to certify that the offered equipment will perform precisely as described in this specification. All capabilities must be demonstrated during the initial installation and will be reviewed prior to final acceptance of the instrument. Delivery and acceptance is at the Naval Research Laboratory, 4555 Overlook Avenue, S.W. Washington D.C. 20375-5326, FOB Destination, no later than 120 days from date of award. The FAR and DFAR provisions and clauses sited herein are incorporated by reference into this solicitation. Offerors are advised to propose in accordance with the provision of FAR 52.212-1, Instructions to Offerors-Commercial Items. The proposal must demonstrate an understanding of all requirements covered in the RFP's terms and conditions. General statements that the offer can or will comply with the requirements, that standard procedures will be used, that well-known techniques will be used, or paraphrases the RFP's Specifications in whole or in part will not constitute compliance with these requirements concerning the content of the technical proposal. Offerors will be evaluated in accordance with FAR 52.212-2, Evaluation-Commercial Items. The specific evaluation criteria under paragraph (a) of FAR 52.212-2 are: (1) price, (2) technical capability of the item offered to meet NRL needs, and (3) past performance. Technical and past performance combined are of equal importance compared to price. Offerors are advised to include with their offer a completed copy of the following provisions: FAR 52.212-3, Offeror Representations and Certifications-Commercial Items (Web site: http://heron.nrl.navy.mil/contracts/reps&certs.htm) and DFARS 252.225-7000, Buy American Act-Balance of Payments Program Certificate. The following FAR clauses apply to this acquisition: FAR 52.212-4, Contract Terms and Conditions-Commercial Items; FAR 52-212-5, Contract Terms and Conditions Required to Implement Statutes of Executive Orders-Commercial Items. The additional clauses that are applicable to this acquisition are FAR 52.203-6, FAR 52.203-10, FAR 52.219-8, FAR 52.222-26, FAR 52.222-35, FAR 52.222-36, FAR 52.222-37, FAR 52.225-3, FAR 52.225-18, and FAR 52.247-64. The clauses at DFARS 252.212-7001, Contract Terms and Conditions Required to Implement Statutes Applicable to Defense Acquisitions of Commercial Items apply to this acquisition. The additional clauses cited applicable to this acquisition are DFARS 252.225-7001, DFARS 252.225-7007, DFARS 252.225-7012, DFARS 252.204-7004, and DFARS 252.232-7009. Any contract awarded as a result of this solicitation will be a DO rated order certified for national use under the Defense Priorities and Allocations System (DPAS) (15CFR700). Any questions generated, as a result of this solicitation must be received no later than 10 calendar days before the closing date. Original and two (2) copies of the Offeror's proposal must be delivered to Contracting Officer, Bldg. 222, Rm. 115A, Naval Research Laboratory, Code 3220.HA, 4555 Overlook Ave., S.W., Washington, D.C., 20375-5326 no later than 4:00 p.m. E.S.T. on 20 April 2000. The package should be marked RFP N00173-00-R-HA04, Closing Date: 20 April 2000. For more information regarding this solicitation contact Hilda R. Abdon, Contract Specialist, (202) 767-0682. All responsible sources may submit a proposal, which shall be considered by the agency. Synopsis number HA04. EMAILADD: Abdon@contracts.nrl.navy.mil EMAILDESC: <A HREF="mailto: ">Click here to forward</A> a request via e-mail Cite: Posted 03/23/00 (W-SN437476). (0083)

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