Supply Department NAVSEA Indian Head, 101 Strauss Ave, Indian Head, MD 20640-5035

66 -- FLIP-CHIP ALIGNER-BONDER MACHINE SOL N00174-00-R-0030 POC Donna Jenkins, Contract Specialist, Code 1142D, (301)744-6648, fax (301)744-6547 IMPORTANT NOTICE: To register for this solicitation, you must email the following directly to Donna Jenkins at jenkinsdm@ih.navy.mil : Solicitation number N00174-00-R-0030 (in the subject line of your email); Name of the requestor, Organization name, address, telephone and fax numbers; and your email address. Use your email read notification feature to confirm the contract specialist's receipt of your registration. The government is not responsible for any undelivered e-mail transmissions. It's the requestor's responsibility to periodically check the IHDIV Contracts division website for current status of solicitation and amendments. Once the solicitation has been issued on the internet, the contract specialist will send an e-mail message to the registered requestors informing them that the solicitation is now available for downloading off the internet. Copies of issued solicitations can only be obtained by downloading them from the IHDIV Contracts Division website at http://www.ih.navy.mil/contracts (copies of solicitations will not be e-mailed, faxed, mailed, or provided in person, these types of requests WILL NOT BE ACKNOWLEDGED.) Note: All offerors will be ineligible for award unless they have registered in DOD's Central Contractor Registration database. Offerors and contractors may obtain information on registration and annual confirmation requirements by calling 1-888-227-2423, or via the Internet at http://ccr.edi.disa.mil. This requirement will be will be available for downloading from the Indian Head division website beginning approximately 24 April 2000. Prior to this date you will not be able to access this solicitation. This requirement is a full and open competitive procurement. The SIC Code is 3829, and FSC Code is 6650. This requirement is for a Flip-Chip Aligner-Bonder Machine in compliance with the performance specification forthcoming in the solicitation. The following is a summary of forthcoming specifications: a) System for superimposed alignment of front-side chip and substrate fiducials; b)Post-bonding alignment accuracy of 2 microns or better; c) Vision System with motorized camera; .25mm or greater focal length; d) Viewable substrate area of at least .3mm x .3mm; resolution of 2 microns or better; e)Illumination system for viewing of both reflective and non-reflective substrates; f) Motorized alignment with at least 20mm of x-y travel and 5 deg. of theta travel; g) Dual heated stages with bonding temps. of at least 300C, +/-5C accuracy; h) Bond force range from 100g, +/-10g accuracy to 10Kg, +/-100g accuracy; i) Ability to collimate chip and substrate prior to x-y alignment and bonding; j)Ability to accommodate substrates from 1mm x 1mm to 4 in. diam. wafers; up to 8 mm thickness. The prospective offeror's will also be required to install and provide training for the machine in accordance with the statement of work forthcoming in the solicitation. Award will be based on best value determination using price and past performance. Posted 04/07/00 (W-SN442554). (0098)

Loren Data Corp. http://www.ld.com (SYN# 0341 20000411\66-0015.SOL)