DOC; Mountain Administrative Support Center; Acquisition Management Division; 325 Broadway MC3; Boulder, CO

A -- RESEARCH AND DEVELOPMENT SOL NB853000004053MB DUE 062100 POC Michelle Bernal, Purchasing Agent, (303) 497-3983 or FAX (303) 497-3163 E-MAIL: NOAA; MASC Acquisition Management, Michelle.A.Bernal@noaa.gov. The National Institute of Standards & Technology(NIST) has a requirement for the development of supplementary data on intermetallics formation in lead-free solders, and to assist NIST in maintaining an on-line database for solder properties. The Government has identified a perspective source in Professor Steven Liu, Associate Director of the Colorado School of Mines Center for Welding and Joining, a center with a strong interest in fundamental materials science issues. It is the intent of the Government to contract with Professor Liu for the specific tasks: 1) Assist NIST with gathering and critical review of additional data for the database and web site. (NIST will furnish files in Excel and Word formats for integration into the web pages and for downloads by users.) The site must be kept compatible with most browsers (especially Netscape and Internet Explorer). 2) Update the web pages with new data at least once per month for a year. Update at least twice a month during the first two months. 3) Develop understanding of thermodynamics and kinetics of the formation of intermetallics. Develop temperature, time, and thickness relationships for Sn-3.2Ag-0.8Cu, Sn-3.5Ag, and Sn-0.8Cu solders. Prepare bulk specimens of these three alloys. Characterize microstructures (qualitative and quantitative) and morphology. Add data to web page. 4) Prepare simple lap joints for tensile or peel testing. Relate microstructure to failure mechanisms. Add data to web page. 5) The proximity to the NIST facility is a critical factor. Face-to-face discussions will be necessary for review of data, presentation formats, and implementation factors. Milestones: 1) Assist in the collection and critical review of solder property data (mechanical and physical). Release a new version of the database each month. 2) Update web site with this new data each month until June 2001. 3) Report on the temperature, time, intermetallic thickness relationships for Sn-3.9Ag-0.6Cu, Sn-3.5Ag, and Sn-0.7Cu solders on copper substrates. Characterize microstructures. Add data to web page. Deliver data on one solder at the end of 4 months, one the second at the end of 8 months, and the last at the end of the contract. 4) Report on tensile or peel testing results. Relate microstructure to failure mechanisms. This procurement is being conducted per FAR Part 13, Simplified Acquisition Procedures. There is no formal solicitation package available. The complete requirement is published in this notice. Qualifications submitted in response to this notice will be evaluated to determine alternative sources for future requirements, or to determine whether competition of this requirement would be in the Government's best interest. Terms and Conditions and agency level protest procedures can be found on web site http: oamweb.osec.doc.gov/conops #REFERENCE. Hard copy in full text available from office address and phone number listed in notice. Anticipated award date will be June 22, 2000. Posted 05/31/00 (D-SN460164). (0152)

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