Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- MOLETRONICS (MOLECULAR ELECTRONICS) SOL BAA00-39 DUE 110900 POC Dr. William Warren, DARPA/DSO, fax (703) 696-3999; Dr. Christe Marrian, DARPA/MTO, fax (703) 696-2206 MOLETRONICS (MOLECULAR ELECTRONICS); SOL: BAA 00-39; DUE 11-09-00; POCs: Dr. William Warren, DARPA/DSO; FAX: (703) 696-3999; and Dr. Christie Marrian, DARPA/MTO; FAX: (703) 696-2206; URL: http://www.darpa.mil/baa/#dso E-MAIL: baa00-39@darpa.mil. The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative research proposals in Moletronics (Molecular Electronics). The goal of the DARPA Moletronics Program is to demonstrate functionality, e.g., 16 kbit memory or logic circuit of corresponding device count, comprised of defect- and fault-tolerant molecular-based circuits fabricated using hierarchical assembly processes at a density equivalent to 1011 devices/cm2. The circuit architecture, systems architecture, and full input/output to the outside world must be scaleable to 1011 or equivalent for logic levels and must operate at room temperature. The objectives of the DARPA Moletronics Program are to: 1) demonstrate basic logic and simple arithmetic operations; 2) demonstrate high-density, molecular-scale functional electronic modules (e.g., memory) in an extremely small, low-power format; 3) demonstrate the scalability of molecular-scale electronics to circuits containing 1011 elements and for densities equivalent to 1011/cm2; and 4) to show that hierarchical assembly procedures are cost-effective manufacturing processes. The desire for molecular electronics is to use molecules, carbon nanotubes, nano-wires, and/or nanoparticles to achieve further miniaturization, greater functionality, and faster clock rates for advanced electronic systems. To accomplish this goal, there are three parallel tasks with constant feedback and interaction among each that must be demonstrated throughout the program. The first task is the development and optimization of molecular devices and components such as switches, nanotubes, multi-state molecules, and molecules exhibiting highly non-linear characteristics. The second task is hierarchical self-assembly, i.e., bridging the nano- to the micro-worlds. This can be described as a set of processes that will first assemble individual devices, then create functional nano-blocks (e.g., memory and/or logic) from those devices, and finally the interconnection amongst said nano-blocks to form computationally functional circuits (modules) with a reasonable input and output methodology. Innovative interconnect and input/output concepts (e.g., multiplexing and demultiplexing schemes) are solicited. The third task is the development of circuit and systems architectures. These architectures encompass programmability of the molecular circuit as well as defect and fault tolerance. Hardware and software (algorithm) approaches to quantifying the level of defects and faults that can be tolerated, and the time needed to find and route around the defects, and to program/compile a circuit with large numbers of devices need to be developed at the program start. Modular approaches to mapping and identifying defects at both local and global levels are encouraged. System architecture scalability in terms of power, access times, and input/output must be addressed. Within two (2) years after program start, proposers must be able to model or simulate the scalability of the Moletronic system architecture (power dissipation, programmability, access times to the molecular devices, nanoblocks, and electronic modules, input/output, defect and fault tolerance, defect search times, etc.) to 1011/cm2 device counts and 1011 device densities. It is viewed imperative to the Moletronics Program to consider the three aforementioned tasks in a concurrent and integrated approach in order to understand potential performance, density, scalability, manufacture, and cost benefits vs. scaled silicon technology. Proposals must demonstrate this three-pronged approach to Moletronics and how it will be implemented in the decision-making process in the program. Proposals are sought to develop molecular-scale electronic modules that have high-density, low-power, and high-speed device and circuit architectures. An example of a molecular-scale electronic module of interest is one that is able to compute, store the computation, and subsequently retrieve the stored data, i.e., perform both logic and memory functionalities. Another example could be interconnected lookup tables. In this case the bits could be stored in the lookup tables and moved from one location to another as computationally required. Other electronic modules are also of interest but demonstration vehicles should have an equivalent device count to a 16 kbit memory and operate at room temperature. The proposed team should be able to design, synthesize, and test the electronic module connected to the outside world with realistic input/output (I/O) schemes. Atomic probe tips are not an acceptable I/O approach. The logic part of the electronic module comprised of molecular-scale components should be able to produce the correct truth table, and the demonstrated configuration must be scalable to densities of >1011 devices/cm2. The molecular memory part of the electronic module should be capable of performing a storage function that is bistable and reversibly driven from one state to the other by an outside signal and must be scalable to densities of >1011 bits/cm2. Optical techniques to read and write the electronic memory are strongly discouraged. All the devices must operate at room temperature. It is important that not only the modules scale, but the associated interconnect technology must also scale to densities >1011 devices/cm2. GENERAL INFORMATION: Proposers must obtain a Proposer Information Pamphlet (PIP), which provides detailed information on program objectives, areas of interest, submission, evaluation, funding processes, proposal formats, and other program information. This should be retrieved via the World Wide Web (WWW) at URL http://www.darpa.mil/baa/#dso, or by fax, e-mail, or mail request to the administrative contact address given below. TEAMING: Proposers are encouraged to form integrated collaborative teams (including industries, universities, and/or federal and national laboratories with complementary areas of expertise) to better address the different technological and scientific aspects in the Moletronics program. To assist with teaming arrangements, an interactive web site has been established at URL: http://www.sainc.com/darpa/moletronics. Individual researchers and organizations with specific, applicable expertise or capabilities may provide non-proprietary descriptions of their capabilities and interests. The web site will remain active from the date of issuance of this BAA until November 9, 2000. Specific information content, communications, networking, and team formation are the sole responsibilities of the participants. DARPA will not participate in these activities other than to provide the web site forum to enable others to initiate communications. WHITE PAPERS: Submission of white papers is highly recommended. Submission and review of white papers is intended to minimize unnecessary effort in proposal preparation and review. All white paper submissions will be evaluated for their responsiveness to the stated goals and objectives of this BAA. Offerors should submit an original and ten (10) copies of the white paper to DARPA/DSO, ATTN: BAA 00-39, 3701 N. Fairfax Drive, Arlington, Virginia 22203-1714 on or before 4:00 p.m. ET August 21, 2000. White papers must meet the objective and format guidelines as described in the PIP in order to be considered. The white paper should not exceed ten (10) pages in length, including the special cover sheet, all charts, figures and appendices. Within ten (10) business days, DARPA will acknowledge receipt of the white paper submission and assign a control number that should be used in all further correspondence. Recommendations for full proposal submission will be made within approximately thirty (30) days of receipt. Regardless of this recommendation, the decision to submit a full proposal is the responsibility of the proposer. All full proposal submissions will be fully evaluated regardless of the disposition of the white paper. FULL PROPOSALS: Proposals should provide a detailed description of a coherent effort addressing one or more of the specific topics of interest in a manner consistent with the overall program goals. An original and ten (10) copies should be submitted to DARPA/DSO, ATTN: BAA 00-39, 3701 N. Fairfax Drive, Arlington, Virginia 22203-1714 on or before 4:00 p.m. ET, November 9, 2000. Full proposals must meet the objective and format guidelines as described in the PIP and consist of two volumes; a technical volume and a cost volume. The cost proposal, should be valid for a period of six (6) months after the date of submission. Proposed programs should be no longer than 48 months. Fax or e-mail transmissions will not be accepted. EVALUATION OF PROPOSALS: Within approximately ten (10) business days of receipt of full proposals, DARPA will acknowledge receipt of the submission and assign a control number that should be used in all further correspondence regarding the proposal. DARPA reserves the right to select for award specific sections of any proposed effort. DARPA's intent is to review proposals as soon as possible after they arrive. Evaluation of white papers and full proposals will be accomplished through a technical review of each proposal using the following criteria: (1) The Scientific and Technological Merits; (2) Potential Impact on Future Military and Commercial Systems; (3) Offeror's Capabilities, Past Related Experience, and Facilities; and (4) Cost Realism. Cost sharing is also encouraged, but not required. All proposals and white papers will be reviewed by Government officials only. Input on purely technical aspects of white papers and proposals may be solicited by DARPA from non-Government consultants/experts bound by appropriate non-disclosure requirements. Non-Government technical consultants will not have access to submissions that are labeled by the offerors as "GOVERNMENT ONLY." Restrictive notices notwithstanding, white papers and proposals may be handled, for administrative purposes only, by a support contractor. The contractor is bound by appropriate non-disclosure requirements. Early submission of proposals is encouraged; selections may be made at any time during the process. Not all proposals deemed selectable may be funded. Proposals may be considered for funding for a period of up to one year. The Government reserves the right to select for award all, some, or none of the proposals received. Multiple awards are expected. Proposals identified for funding may result in a contract, grant, cooperative agreement, or other transaction, depending upon the nature of the work proposed, the required degree of interaction between parties, and other factors. The offeror must submit a separate list of all technical data or computer software that will be furnished to the Government with other than unlimited rights (see DFARS Part 227). All administrative correspondence and questions on this solicitation should be directed to BAA 00-39, FAX: (703) 696-3999, E-MAIL: BAA00-39@darpa.mil, or MAIL: DARPA/DSO, ATTN: BAA 00-39, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This notice, in conjunction with the BAA 00-39 PIP, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals. However, no portion of this BAA will be set aside for HBCUs and MIs specifically. Posted 06/28/00 (W-SN469542). (0180)

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