DOC; Mountain Administrative Support Center; Acquisition Management Division; 325 Broadway MC3; Boulder, CO

A -- RESEARCH AND DEVELOPMENT SOL NB853000004053MB DUE 080400 POC Michelle Bernal, Purchasing Agent, (303) 497-3983 or FAX (303) 497-3163 E-MAIL: NOAA; MASC Acquisition Management, Michelle.A.Bernal@noaa.gov. The National Institute of Standards & Technology(NIST) has a requirement for the development of supplementary data on intermetallics formation in lead-free solders, and to assist NIST in maintaining an on-line database for solder properties. The tasks are as follows: 1) Assist NIST with gathering and critical review of additional data for the database and web site. (NIST will furnish files in Excel and Word formats for integration into the web pages and for downloads by users.) The site must be kept compatible with most browsers (especially Netscape and Internet Explorer). 2) Update the web pages with new data at least once per month for a year. Update at least twice a month during the first two months. 3) Develop understanding of thermodynamics and kinetics of the formation of intermetallics. Develop temperature, time, and thickness relationships for Sn-3.2Ag-0.8Cu, Sn-3.5Ag, and Sn-0.8Cu solders. Prepare bulk specimens of these three alloys. Characterize microstructures (qualitative and quantitative) and morphology. Add data to web page. 4) Prepare simple lap joints for tensile or peel testing. Relate microstructure to failure mechanisms. Add data to web page. Milestones: 1) Assist in the collection and critical review of solder property data (mechanical and physical). Release a new version of the database each month. 2) Update web site with this new data each month until June 2001. 3) Report on the temperature, time, intermetallic thickness relationships for Sn-3.9Ag-0.6Cu, Sn-3.5Ag, and Sn-0.7Cu solders on copper substrates. Characterize microstructures. Add data to web page. Deliver data on one solder at the end of 4 months, one the second at the end of 8 months, and the last at the end of the contract. 4) Report on tensile or peel testing results. Relate microstructure to failure mechanisms. This procurement is being conducted per FAR Part 13, Simplified Acquisition Procedures. There is no formal solicitation package available. The complete requirement is published in this notice. Technical questions pertaining to this requirement should be submitted in writing and sent by fax or by email to the Contracting Officer. Evaluation factors will be as follows: 1) Likelihood of on-time, high-quality work. 2) Solder data development. 3) Web publishing. 4) Price. Terms and Conditions and agency level protest procedures can be found on web site http: oamweb.osec.doc.gov/conops #REFERENCE. Hard copy in full text available from office address and phone number listed in notice. Anticipated award date will be August 11, 2000. Posted 07/07/00 (D-SN472389). (0189)

Loren Data Corp. http://www.ld.com (SYN# 0010 20000711\A-0010.SOL)

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