A -- NANO MECHANICAL ARRAY SIGNAL PROCESSORS

Notice Date

December 7, 2000

Contracting Office

Defense Advanced Research Projects Agency (DARPA), Contract Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

ZIP Code

22203-1714

Solicitation Number

BAA01-10

Response Due

March 19, 2001

Point of Contact

William C. Tang, Ph.D., DARPA/MTO, FAX (703) 351-8689.

Description

Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714. A Nano Mechanical Array Signal Processors, SOL BAA 01-10 DUE 031901, POC William C. Tang, Ph.D., DARPA/MTO, FAX (703) 351-8689. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Nano Mechanical Array Signal Processors (NMASP). Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices or systems. Specifically excluded is research that primarily results in evolutionary improvement to the existing state-of-practice. DARPA seeks innovative proposals in the area of Nano Mechanical Array Signal Processors (NMASP). The final goal is to demonstrate arrays of nano-precision high-Quality-factor (Q on the order of 10,000) ultra-high frequency (UHF) (300 MHz to 3 GHz) mechanical resonators that will achieve radical reductions in size and power consumption over state-of-the-art radio frequency (RF) transceivers and signal processors. One possible use of NMASP in RF receivers, for example, is to implement a mechanical RF channel selector by individually addressing each of the resonators in the array, replacing power-hungry circuits and bulky off-chip components for the same function. The use of NMASP will enable ultra-miniaturized (wristwatch or hearing aid in size) and ultra-low-power (on the order of 100-time reduction compared to commercial counterparts) UHF communicators and/or global positioning system (GPS) receivers. The use of these ultra-miniature communicators/GPS receivers can greatly improve the mobility and location identification of individual war fighters. They can also be used for miniaturization and integration of stand-alone, self-contained, wireless MicroElectroMechanical Systems (MEMS) micro sensors and micro actuators that can be deployed remotely in clusters to drastically enhance superiority of weapon systems and field awareness. Other potential applications of the technologies developed in this program include mechanical signal processing for spectrum analyzers, Fourier-signal transformers, programmable equalizers, frequency converters, parametric amplifiers, and other UHF signal processors. In addition, when configured for sensor applications, the core of NMASP technologies can be used in mass spectrometer, calorimeter, bolometer, and high-resolution infrared (IR) imager applications. All of these NMASP applications will be characterized by significant power reduction and/or ultra miniaturization while meeting or exceeding the performance levels of the state-of-practice approaches. The key focus of this program is on optimized combinations of innovative solutions in micro or nano fabrication, materials processing, device design, transduction mechanism, interconnects, and other relevant engineering approaches that directly address the performance issues in high-Q UHF mechanical resonator arrays for RF transceiver and signal processor applications. These issues include, but are not limited to: (1) temperature stability, tunability, signal-to-noise (S/N) ratio, and environmental sensitivity of individual resonators; (2) uniformity, repeatability, and variability within the arrays; (3) cross-talk, coupling, and isolation among the resonators; (4) clear potentials for chip-level integration with Si, Si-Ge, SiC, III-V, or other appropriate circuit technologies; and (5) compatibility with on-die or second-level hermetic packaging. Fabrication, materials choices, device design, and other engineering approaches are tightly coupled in influencing the performance of the mechanical resonator arrays. For example, by using a structural material with very high stiffness, one can design a resonator with dimensions that are not necessarily all in the sub-micron regime to achieve resonance in the UHF range. Another coupling and engineering tradeoff may be manifested in the balance of employing precision machining to create the resonators and the use of innovative electronic interface and compensation techniques to achieve controls in the desired frequencies within the array. Also, in the dimensions of interest, surface-to-volume ratios of the UHF mechanical resonators are likely to be very high compared to lower-frequency resonant structures, and thus surface effects and sensitivity to mass loading, among others, may need to be considered. These considerations are expected to bear important implications in the requirements for some form of isolation, surface treatment, on-die and/or second-level packaging, or possibly other innovative approaches in order to achieve stability, useful S/N ratio, Q, and other performance parameters of interest that are relevant to RF transceiver and UHF signal processing applications.DARPA discourages proposals that focus solely on individual resonator development or fabrication and materials research, although these subjects may very well be parts of a proposal that aims at demonstrating an optimized NMASP. Rather, the successful demonstration of NMASP will likely require well-coordinated interdisciplinary research and development activities that take into consideration all significant and relevant engineering tradeoffs and optimizations. Teaming among academic, industrial and/or government partners is encouraged, and it is anticipated that the contributions of the team members are complementary as well as essential to the critical path of the research plan. A technology insertion plan is encouraged and research that holds promise of insertion into Department of Defense (DoD) relevance is of great interest. PROGRAM SCOPE: Awards totaling approximately $40 million over four years are expected to be made during the first half of calendar year 2001. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. DARPA reserves the right to use a portion of the $40 million for awards in possible future BAA(s) for phase 2 of the NMASP program. The technical POC for this effort is William C. Tang, Ph.D., fax: (703) 351-8689, electronic mail: wtang@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 01-10, Nano Mechanical Array Signal Processors, Proposer Information Pamphlet" which provides further information on Nano Mechanical Array Signal Processors, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW), at URL http://www.darpa.mil or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit a proposal abstract in advance of a full proposal. An original and nine (9) copies of the proposal abstract and 2 electronic copies (i.e., 2 separate disks) of the abstract [in PDF (preferred), MS-Word readable, HTML, or ASCII format each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip disk, or a CD-ROM] should be submitted. Each disk must be clearly labeled with BAA 01-10, proposer organization, proposal title (short title recommended) and Copy __ of 2. The proposal abstract (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 01-10) on or before 4:00 p.m., local time, Thursday, February 01, 2001. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will respond to proposal abstracts with a recommendation to propose or not propose and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and nine (9) copies of the full proposal and 2 electronic copies (i.e., 2 separate disks) of the full proposal [in PDF (preferred), MS-Word readable, HTML, or ASCII format, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip disk, or a CD-ROM] should be submitted. Each disk must be clearly labeled with BAA 01-10, proposer organization, proposal title (short title recommended) and Copy __ of 2. The full proposal (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 01-10) on or before 4:00 p.m., local time, Monday, March 19, 2001, in order to be considered. This notice, in conjunction with the BAA 01-10 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal, which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in Nano Mechanical Array Signal Processors. The formation of multi-disciplinary teams consisting of industry, academia, and/or national laboratories with complementary areas of expertise is strongly encouraged. To this end, DARPA invites all interested offerors of whatever size or capacity to provide capability statements to assist with teaming arrangements. An interactive web site has been established at URL http://teaming.sysplan.com/NMASP-BAA-01-10/ in which these capability statements will be posted. The web site will remain active from the date of issuance of the BAA until March 12, 2001. Specific information content, communications, networking, and team formation are the sole responsibilities of the participants. Neither DARPA nor the DoD endorses the destination web site or the information and organizations, contained therein, nor does DARPA or the DoD exercise any responsibility at the destination. This web site is provided consistent with the stated purpose of this BAA. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 01-10. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals that have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8689 (Addressed to: DARPA/MTO, BAA 01-10); Electronic Mail: BAA01-10@darpa.mil; Mail: DARPA/MTO, ATTN: BAA 01-10; 3701 North Fairfax Drive, Arlington, VA 22203-1714 This announcement and the Proposer Information Pamphlet may be retrieved via the WWW, at URL http://www.darpa.mil/ in the SOLICITATIONS area.

Record

Loren Data Corp. 20001211/ASOL006.HTM (W-342 SN5083P7)