DEVELOPMENT OF GMR NONVOLATILE MEMORY RADIATION HARDENED 64 MBIT CHIP (GMR III) MAGNETIC PROGRAM

Notice Date

December 15, 2000

Contracting Office

Defense Advanced Research Projects Agency (DARPA), Contract Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

ZIP Code

22203-1714

Description

Development of GMR Nonvolatile Memory Radiation Hardened 64 Mbit Chip (GMR III) Magnetic Program. SOL: SS01-02. DUE: N/A. POC: Thomas E. Lyon, Contracting Officer, Fax: (703) 696-2208. The Defense Advanced Research Projects Agency (DARPA) intends to award a sole-source modification to its existing contract with Honeywell, Inc., Solid State Electronics Center, 12001 State Highway 55, Plymouth,MN 55441, MDA972-98-C-0021, for the purpose of concluding R&D associated with DARPA's Materials and Devices Program. This modification is the continuation of an on-going effort, the contractor having the knowledge and understanding that makes it uniquely qualified to provide these services. This notice is not a request for competitive proposals. See Note #22.

Record

Loren Data Corp. 20001219/SPMSC006.HTM (W-350 SN5089Z8)