66 -- ETCHER, INDUCTIVELY COUPLED PLASMA

Notice Date

May 25, 2001

Contracting Office

US Army Materiel Command Acquisition Center, Army Research Laboratory Contracting Division, Attn: AMSSB-ACA-P, 2800 Powder Mill Road, Adelphi, Maryland 20783-1197

ZIP Code

20783-1197

Solicitation Number

X1B7J-1017-H522

Response Due

June 22, 2001

Point of Contact

Edna Wilson, Contract Specialist (301)394-4011, Robert Tomko, Contracting Officer (301)394-3691

Description

The Army Research Laboratory is soliciting on a brand name or equal basis for a commercially available Inductively Coupled Plasma Etcher. The band name product is Plasmalab System 100 Advanced ICP Etch Tool manufactured by Oxford Instruments America, Inc., 130A Baker Avenue Extension Concord, MA 01742. The salient capabilities are (1) System is capable of etching Platinum and PZT. (2) Platinum and PZT processing can be performed consecutively in-situ. (3) There is no redeposited material in the etched trenches. (4) Conventional photoresist mask patterns can be used without the need of UV treatment. (5) Selectivity of PZT to photoresist is better than 5:1. (6) Selectivity of Platinum to PZT is better than 10:1. (7) Selectivity of Platinum to photoresist is better than 100:1. (8) Photoresist mask can be removed by plasma ashing or using standard wet solvent chemistry. (9) Gases are environmentally friendly. (10) The cooled/heated bottom electrode is temperature controlled detween -150 to +400 degrees centigrade. To request a copy of the solicitation package send a request to rmac-adelphi@arl.army.mil with "E.Wilson X71B7J-1017-H522" in the subject line. No telephone request will be honored.

Record

Loren Data Corp. 20010530/66SOL005.HTM (W-145 SN50N107)